A solderless surface mount fuse including a base having a floor and a plurality of adjoining sidewalls defining a cavity, a fuse element including a separation portion spanning between two electrode portions, the separation portion and the electrode portions formed of a contiguous piece of material, the separation portion suspended within the cavity below top edges of the sidewalls of the base, and a cap having a ceiling and a plurality of adjoining sidewalls, the cap fitting over the base and the fuse element with bottom edges of the sidewalls of the cap disposed below the top edges of the sidewalls of the base, wherein the cavity of the base contains a fuse filler that completely surrounds the separation portion.

A fuse device that uses a fuse element having an appropriate size in order to improve the rating, while maintaining insulation performance. The fuse device is provided with a fuse element, a case having a housing space for housing the fuse element and having a lead-out port through which both ends of the fuse element are led out, and which supports the fuse element in a bridge-like manner in the housing space; and a shield disposed in the housing space for shielding an inner wall surface leading to the lead-out port from a scattered melted material from a fusing location of the fuse element.

The present disclosure discloses a miniature super surface mount fuse, comprising: a fuse element provided with a low overload fusing point and at least two high breaking capacity fusing points connected in series with the low overload fusing point and respectively arranged on two sides of the low overload fusing point, at least two cavity plates provided with cavities, the low overload fusing point and the high breaking capacity fusing points being located at corresponding positions of the cavities; the present disclosure further provides a manufacturing method for a surface mount fuse; the miniature super surface mount fuse of the present disclosure can provide the protection for the civil consumer electronic circuit under various overload conditions without the occurrence of safety hazards such as smoking or cracking of the housing or explosion.

A vertical surface mount device pass-through fuse including an electrically insulating fuse body, a fusible element disposed on a first side of the fuse body and extending between first and second terminals, an electrically insulating cap having a domed portion and a flanged portion extending from the domed portion, the domed portion disposed over the fusible element, and the flanged portion affixed to the fuse body, and a conductive lead frame having a bow portion and an elongate shank portion extending from the bow portion, wherein the bow portion is disposed on the cap and is connected to the first terminal, and wherein the shank portion extends away from the fuse body.

A high breaking capacity chip fuse including a bottom insulative layer, a first intermediate insulative layer, a second intermediate insulative layer, and a top insulative layer disposed in a stacked arrangement in the aforementioned order, a fusible element disposed between the first and second intermediate insulative layers and extending between electrically conductive first and second terminals at opposing longitudinal ends of the bottom insulative layer, the first intermediate insulative layer, the second intermediate insulative layer, and the top insulative layer, wherein the first and second intermediate insulative layers are formed of porous ceramic.

A fuse includes a stack, a flattened wire, and a terminal. The stack has multiple layers arranged to form steps. The stack has an upper stack with layers of a first size and a lower stack with layers of a second, larger size. The flattened wire is located between the upper stack and the lower stack. The terminal is connected to the flattened wire and includes multiple surfaces to cover the steps at one end of the stack.

A surface-mount type micro fuse has a fusible element provided in a housing. The fusible element has a fusible body and two intermediary portions connected to both ends of the fusing portion. Two gaps are formed respectively between the fusible body and the intermediary portions. When the fusible element is blown out due to the transient abnormal current, the gaps between the intermediary portions cause a large distance instantaneously to prevent the arc. Then effectively ensure the safety of the use of the overall circuit.

A novel temperature-triggered fuse device is configured to be activated at a designer-specified ambient temperature by utilizing wetting force among a pair of wetting material bays and a solder bridge or a solder ball. The solder bridge or the solder ball is typically positioned on top of the pair of wetting material bays separated by an electrically-insulated gap. Preferably, the wetting material bays are at least partly made of gold, nickel, or other elements suitable for generating an increased wetting force to the solder bridge or the solder ball upon increases in ambient temperature. The novel temperature-triggered fuse device can be integrated into various types of integrated circuits (IC's), or can function as a discrete fuse connected to one or more electronic components for robust protection from power surges and/or thermal runaway-related device malfunctions, meltdowns, or explosions. Various methods of producing the temperature-triggered fuse device are also disclosed herein.

A solderless surface mount fuse including a base having a floor and a plurality of adjoining sidewalls defining a cavity, a fuse element including a separation portion spanning between two electrode portions, the separation portion and the electrode portions formed of a contiguous piece of material, the separation portion suspended within the cavity below top edges of the sidewalls of the base, and a cap having a ceiling and a plurality of adjoining sidewalls, the cap fitting over the base and the fuse element with bottom edges of the sidewalls of the cap disposed below the top edges of the sidewalls of the base, wherein the cavity of the base contains a fuse filler that completely surrounds the separation portion.

A micro-fuse assembly includes a substrate, a number of thin-film micro-fuses on the substrate, and a topping wafer configured to sealingly engage to at least one of the substrate or the thin-film micro-fuses to define a cavity therebetween. The cavity is configured to encapsulate the thin-film micro-fuses within an inert environment sealed within the cavity. A method of encapsulating a micro-fuse assembly within an inert environment using a topping wafer is also disclosed.