A compact, high breaking capacity fuse that includes a top and bottom insulative layer and a single piece fusible element disposed between the top and bottom insulative layer. The top and bottom insulative layers include cavities that are aligned at assembly to form a chamber in which a fusible element portion of the single piece fusible element is disposed. The single piece fusible element additionally includes terminal portions that extend along outer surfaces of the top and bottom insulative layers.

A fuse line fixing structure of a fuse includes a base having first and second support sections. The first support section has two sides each forming a first wing and a first concave surface is formed between the first support section and the first wings. First and second electrodes are respectively arranged at two ends of the base. The first electrode includes a first curved plate arranged between the first support section and the first wings. The first curved plate has a convex engagement surface positioned against the first concave surface and a concave engagement surface facing toward an upper side of the first concave surface. The fuse line straddles between the first and second support sections and has an outer circumferential surface in mutual contact, through surface to surface engagement, with the concave engagement surface of the first curved plate.

Disclosed is a thin-film micro-fuse assembly having: a substrate; an insulating layer disposed on the substrate, the insulating layer comprising silicon dioxide; a conductor disposed on the insulating layer, the conductor forming: an inlet terminal, an outlet terminal and a fuse element between the inlet terminal and the outlet terminal, the inlet terminal and the outlet terminal widthwise converging toward the fuse element, and the fuse element having a first thickness and a first width that is between 1 and 5 times the first thickness.

A surface-mountable thin-film fuse component is disclosed that may include a substrate having a top surface, a first end, and a second end that is spaced apart from the first end in a longitudinal direction. The thin-film component may include a fuse layer formed over the top surface of the substrate. The fuse layer may include a thin-film fuse track. An external terminal may be disposed along the first end of the substrate and electrically connected with the thin-film fuse track. The external terminal may include a compliant layer comprising a conductive polymeric composition.

The invention relates to a fuse (1), in particular SMD fuse, with an insulating housing (2) having a cavity (3), a (4) arranged in the cavity (3) of the insulating housing (2), and contact means (5) electrically connected to the melting conductor (4) for making contact with the outside of the fuse (1), wherein the insulating housing (2) comprises a base body (6) having the cavity (3) and a lid (7) closing the cavity (3) of the base body (6), wherein the contact means (5) are each arranged with an inner section (8) electrically connected to the melting conductor (4) in the interior of the insulating housing (2) and with an outer section (9) on the outer side (10) of the insulating housing (2), preferably of the base body (6).

A novel temperature-triggered fuse device is configured to be activated at a designer-specified ambient temperature by utilizing wetting force among a pair of wetting material bays and a solder bridge or a solder ball. The solder bridge or the solder ball is typically positioned on top of the pair of wetting material bays separated by an electrically-insulated gap. Preferably, the wetting material bays are at least partly made of gold, nickel, or other elements suitable for generating an increased wetting force to the solder bridge or the solder ball upon increases in ambient temperature. The novel temperature-triggered fuse device can be integrated into various types of integrated circuits (IC's), or can function as a discrete fuse connected to one or more electronic components for robust protection from power surges and/or thermal runaway-related device malfunctions, meltdowns, or explosions. Various methods of producing the temperature-triggered fuse device are also disclosed herein.

A fuse device includes a fuse element and a cooling member, wherein the fuse element includes a low thermal conductivity portion having a relatively low thermal conductivity in which an interrupting portion that is blown out by heat is separated from the cooling member, and a high thermal conductivity portion having a relatively high thermal conductivity, provided in a portion other than the interrupting portion, and in contact with or close to the cooling member.

A fuse housing assembly and a fuse kit are provided. The fuse housing assembly and the fuse kit are configured to allow for fuses having terminals of different sizes to be mounted onto a circuit board. The fuse housing assembly and the fuse kit include a spacer configured to protect the exposed portions of the fuse terminals from the environment and prevent the proximal ends of the fuse terminals from breaking the fuse elements. Further, the spacer retains the fuse body of the respective fuses and the fuse terminals in a fixed position relative to each other so as to prevent the fuse terminals from being bent.

A fuse element comprises a low melting point metal layer, a first high melting point metal layer having a higher melting point than a melting point of the low melting point metal layer, and a restricting portion including a high melting point material having a higher melting point than a melting point of the low melting point metal layer and configured to restrict flow of the low melting point metal or deformation of a layered body constituted by the first high melting point metal layer and the low melting point metal layer.

A novel temperature-triggered fuse device is configured to be activated at a designer-specified ambient temperature by utilizing wetting force among a pair of wetting material bays and a solder bridge or a solder ball. The solder bridge or the solder ball is typically positioned on top of the pair of wetting material bays separated by an electrically-insulated gap. Preferably, the wetting material bays are at least partly made of gold, nickel, or other elements suitable for generating an increased wetting force to the solder bridge or the solder ball upon increases in ambient temperature. The novel temperature-triggered fuse device can be integrated into various types of integrated circuits (IC's), or can function as a discrete fuse connected to one or more electronic components for robust protection from power surges and/or thermal runaway-related device malfunctions, meltdowns, or explosions. Various methods of producing the temperature-triggered fuse device are also disclosed herein.