A switch module with a built-in structure of anti-surge and linkage disconnection, particularly to one that has an anti-surge instant expanding detaching device with a cocoon form protection structure, when an overvoltage occurs, the metal oxide varistor would instantly heat up or explode, and the expanded graphite is linear expanded by absorbing heat and forms a cocoon form protection structure that fill up the containing space like a spider web covering the metal oxide varistor to forms a flame proof layer, when the expanding volume of the expanded graphite reach the predetermined setting, the expansion provides a push force pushing the pushing element forcing the first connecting point detaching from the second connecting point and turning off the switch, and further achieving the effects of easy manufacturing and improving the stability and the accuracy.

A switch module with a built-in structure of anti-surge and linkage disconnection, particularly to one that has an anti-surge instant expanding detaching device with a cocoon form protection structure, when an overvoltage occurs, the metal oxide varistor would instantly heat up or explode, and the expanded graphite is linear expanded by absorbing heat and forms a cocoon form protection structure that fill up the containing space like a spider web covering the metal oxide varistor to forms a flame proof layer, when the expanding volume of the expanded graphite reach the predetermined setting, the expansion provides a push force pushing the pushing element forcing the first connecting point detaching from the second connecting point and turning off the switch, and further achieving the effects of easy manufacturing and improving the stability and the accuracy.

The temperature sensitive pellet type thermal fuse includes: a conductive envelope having an opening at a first end; a temperature sensitive device housed inside the envelope; a first lead which is installed in the opening of the envelope and has a fixed contact; a second lead connected to a second end of the envelope; a movable contact housed in the envelope; and a weak compression spring housed in the envelope. The temperature sensitive device includes a cylindrical case having an open end which may be arranged at the side of the first lead, a temperature sensitive material housed in the cylindrical case, and a strong compression spring configured to press against the temperature sensitive material.

The temperature sensitive pellet type thermal fuse includes: a conductive envelope having an opening at a first end; a temperature sensitive device housed inside the envelope; a first lead which is installed in the opening of the envelope and has a fixed contact; a second lead connected to a second end of the envelope; a movable contact housed in the envelope; and a weak compression spring housed in the envelope. The temperature sensitive device includes a cylindrical case having an open end which may be arranged at the side of the first lead, a temperature sensitive material housed in the cylindrical case, and a strong compression spring configured to press against the temperature sensitive material.

A fuse includes an outer cartridge body, an inner cartridge body provided inside the outer cartridge body, a fuse core provided inside the inner cartridge body, two inner copper bushes provided at and covering two open ends of the outer cartridge body, and two outer copper bushes provided at and covering the two inner copper bushes and two open ends of the outer cartridge body. One end of one inner copper bush is a first open end, and the other end is a first closed end. An end face of the first closed end has a first opening. The first open end of the inner copper bush and the outer cartridge body form an interference fit. An end of the fuse core extends and passes through the first opening, and is fixed to the end face of the first closed end.

Example embodiments relate a subsea fuse device exposed to a high ambient pressure when deployed. The fuse device comprises a metallic fuse housing enclosing a low-pressure hollow space and a fuse arranged in the low-pressure hollow space, the fuse having two electrical connectors, wherein one of the electrical connectors of the fuse is electrically and thermoconductively coupled to the metallic fuse housing so as to provide an electrical connection between the fuse connector and the housing and to dissipate heat from the fuse.

Example embodiments relate a subsea fuse device exposed to a high ambient pressure when deployed. The fuse device comprises a metallic fuse housing enclosing a low-pressure hollow space and a fuse arranged in the low-pressure hollow space, the fuse having two electrical connectors, wherein one of the electrical connectors of the fuse is electrically and thermoconductively coupled to the metallic fuse housing so as to provide an electrical connection between the fuse connector and the housing and to dissipate heat from the fuse.

A solderless surface mount fuse including a base having a floor and a plurality of adjoining sidewalls defining a cavity, a fuse element including a separation portion spanning between two electrode portions, the separation portion and the electrode portions formed of a contiguous piece of material, the separation portion suspended within the cavity below top edges of the sidewalls of the base, and a cap having a ceiling and a plurality of adjoining sidewalls, the cap fitting over the base and the fuse element with bottom edges of the sidewalls of the cap disposed below the top edges of the sidewalls of the base, wherein the cavity of the base contains a fuse filler that completely surrounds the separation portion.

A solderless surface mount fuse including a base having a floor and a plurality of adjoining sidewalls defining a cavity, a fuse element including a separation portion spanning between two electrode portions, the separation portion and the electrode portions formed of a contiguous piece of material, the separation portion suspended within the cavity below top edges of the sidewalls of the base, and a cap having a ceiling and a plurality of adjoining sidewalls, the cap fitting over the base and the fuse element with bottom edges of the sidewalls of the cap disposed below the top edges of the sidewalls of the base, wherein the cavity of the base contains a fuse filler that completely surrounds the separation portion.

A micro-fuse assembly includes a substrate, a number of thin-film micro-fuses on the substrate, and a topping wafer configured to sealingly engage to at least one of the substrate or the thin-film micro-fuses to define a cavity therebetween. The cavity is configured to encapsulate the thin-film micro-fuses within an inert environment sealed within the cavity. A method of encapsulating a micro-fuse assembly within an inert environment using a topping wafer is also disclosed.