A micro-fuse assembly includes a substrate, a number of thin-film micro-fuses on the substrate, and a topping wafer configured to sealingly engage to at least one of the substrate or the thin-film micro-fuses to define a cavity therebetween. The cavity is configured to encapsulate the thin-film micro-fuses within an inert environment sealed within the cavity. A method of encapsulating a micro-fuse assembly within an inert environment using a topping wafer is also disclosed.

A compact, high breaking capacity fuse that includes a top and bottom insulative layer and a single piece fusible element disposed between the top and bottom insulative layer. The top and bottom insulative layers include cavities that are aligned at assembly to form a chamber in which a fusible element portion of the single piece fusible element is disposed. The single piece fusible element additionally includes terminal portions that extend along outer surfaces of the top and bottom insulative layers.

A fuse includes a tubular body having two ends each having a first cap, which is formed with a through hole; a fusible and breakable unit including a first fusible filament arranged inside the tubular body and having two ends extending outward through the through holes respectively; and a plurality of second caps each of which has a surface that is formed with a recessed part and an opposite surface that is provided with a conductive wire. The recessed parts of the second caps are mounted to outer circumferences of the first caps. The two ends of the first fusible filament are respectively coupled between the first caps and the second caps corresponding thereto so as to extend a distance between the two ends of the first fusible filament and thus, preventing the occurrences of electrical arc after the first fusible filament is fused and broken.

A high-voltage fuse includes a temperature fuse device and a high-voltage breaking device that are connected in parallel, wherein the high-voltage breaking device includes a fuse link, and the fuse link is an n-shaped structure with parallel segments at both ends thereof; and a resistance value of the temperature fuse device is lower than a resistance value of the fuse link, and a melting point of the temperature fuse device is lower than a melting point of the fuse link. The high-voltage fuse can realize an over-temperature fusing function. Due to the n-shaped fuse link, the electric arc may be cut off quickly to perform high-voltage breaking and protect the safety of the circuitry.

A protection device comprises a substrate, a fusible element, a flux and an insulating cover. The fusible element is disposed on the substrate and connects to a power line of an apparatus to be protected. The flux is disposed on the fusible element. The insulating cover is secured on the substrate to form a room for receiving the fusible element. The insulating cover has a bottom surface facing the substrate, and a plurality of protrusions are formed and distributed on the bottom surface to hold the flux in place.

A protection device comprises a substrate, a fusible element, a flux and an insulating cover. The fusible element is disposed on the substrate and connects to a power line of an apparatus to be protected. The flux is disposed on the fusible element. The insulating cover is secured on the substrate to form a room for receiving the fusible element. The insulating cover has a bottom surface facing the substrate, and a plurality of protrusions are formed and distributed on the bottom surface to hold the flux in place.

The invention relates to a fuse (1), in particular SMD fuse, with an insulating housing (2) having a cavity (3), a (4) arranged in the cavity (3) of the insulating housing (2), and contact means (5) electrically connected to the melting conductor (4) for making contact with the outside of the fuse (1), wherein the insulating housing (2) comprises a base body (6) having the cavity (3) and a lid (7) closing the cavity (3) of the base body (6), wherein the contact means (5) are each arranged with an inner section (8) electrically connected to the melting conductor (4) in the interior of the insulating housing (2) and with an outer section (9) on the outer side (10) of the insulating housing (2), preferably of the base body (6).

The invention relates to a fuse (1), in particular SMD fuse, with an insulating housing (2) having a cavity (3), a (4) arranged in the cavity (3) of the insulating housing (2), and contact means (5) electrically connected to the melting conductor (4) for making contact with the outside of the fuse (1), wherein the insulating housing (2) comprises a base body (6) having the cavity (3) and a lid (7) closing the cavity (3) of the base body (6), wherein the contact means (5) are each arranged with an inner section (8) electrically connected to the melting conductor (4) in the interior of the insulating housing (2) and with an outer section (9) on the outer side (10) of the insulating housing (2), preferably of the base body (6).

A fuse device includes a fuse element and a cooling member, wherein the fuse element includes a low thermal conductivity portion having a relatively low thermal conductivity in which an interrupting portion that is blown out by heat is separated from the cooling member, and a high thermal conductivity portion having a relatively high thermal conductivity, provided in a portion other than the interrupting portion, and in contact with or close to the cooling member.

A fuse device includes a fuse element and a cooling member, wherein the fuse element includes a low thermal conductivity portion having a relatively low thermal conductivity in which an interrupting portion that is blown out by heat is separated from the cooling member, and a high thermal conductivity portion having a relatively high thermal conductivity, provided in a portion other than the interrupting portion, and in contact with or close to the cooling member.