A magnetron plasma apparatus boosted by hollow cathode plasma includes at least one electrically connected pair of a first hollow cathode plate and a second hollow cathode plate placed opposite to each other at a separation distance of at least 0.1 mm and having an opening following an outer edge of a sputter erosion zone on a magnetron target so that a magnetron magnetic field forms a perpendicular magnetic component inside a hollow cathode slit between plates and, wherein the plates and are connected to a first electric power generator together with the magnetron target to generate a magnetically enhanced hollow cathode plasma in at least one of a first working gas distributed in the hollow cathode slit and a second working gas admitted outside the slit in contact with a magnetron plasma generated in at least one of the first working gas and the second working gas.

The sputtering cathode has a tubular shape having a pair of long sides facing each other in cross-sectional shape, has a sputtering target whose erosion surface faces inward, and a magnetic circuit is provided along the sputtering target. The pair of long sides are constituted by rotary targets each having a cylindrical shape. The rotary target is internally provided with a magnetic circuit and configured to allow the flow of cooling water. The magnetic circuit is provided parallel to the central axis of the rotary target and has a rectangular cross-sectional shape having a long side perpendicular to the radial direction of the rotary target.

A magnet bar structure for a sputter magnetron system comprises a magnet bar having attached to it a sensing device for sensing intrinsic and/or extrinsic properties of a tubular sputtering target when mounted over the magnet bar structure.

A magnetron assembly for magnetron sputtering with rotary cathode systems is provided. The magnetron assembly comprises a plurality of magnets attached to a plurality of yokes and a plurality of driving modules, each comprising an actuating mechanism operatively coupled to at least one of the plurality of yokes. The plurality of driving modules are adapted for adjusting the position of the plurality of yokes individually.

The sputtering cathode has a tubular shape having a pair of long sides facing each other in cross-sectional shape, has a sputtering target whose erosion surface faces inward, and a magnetic circuit is provided along the sputtering target. The pair of long sides are constituted by rotary targets each having a cylindrical shape. The rotary target is internally provided with a magnetic circuit and configured to allow the flow of cooling water. The magnetic circuit is provided parallel to the central axis of the rotary target and has a rectangular cross-sectional shape having a long side perpendicular to the radial direction of the rotary target.

Methods and apparatus for low angle, selective plasma deposition on a substrate. A plasma chamber uses a process chamber having an inner processing volume, a three dimensional (3D) magnetron with a sputtering target with a hollow inner area that overlaps at least a portion of sides of the sputtering target and moves in a linear motion over a length of the sputtering target, a housing surrounding the 3D magnetron and the sputtering target such that at least one side of the housing exposes the hollow inner area of the sputtering target, and a linear channel interposed between the housing and a wall of the process chamber.

An ion source that is capable of different modes of operation is disclosed. The ion source includes an insertable target holder includes a hollow interior into which the solid dopant material is disposed. The target holder may a porous surface at a first end, through which vapors from the solid dopant material may enter the arc chamber. The porous surface inhibits the passage of liquid or molten dopant material into the arc chamber. The target holder is also constructed such that it may be refilled with dopant material when the dopant material within the hollow interior has been consumed. A solid target is also disposed in the arc chamber. When the insertable target holder is used, multicharged ions are created. When the insertable target holder is retracted, single charged ions are created by only etching the solid dopant-containing compound.

An ion source that is capable of different modes of operation is disclosed. The ion source includes an insertable target holder includes a hollow interior into which the solid dopant material is disposed. The target holder may a porous surface at a first end, through which vapors from the solid dopant material may enter the arc chamber. The porous surface inhibits the passage of liquid or molten dopant material into the arc chamber. The target holder is also constructed such that it may be refilled with dopant material when the dopant material within the hollow interior has been consumed. The ion source may have several gas inlets. When the insertable target holder is used, the ion source may supply a first gas, such as a halogen containing gas. When operating in a second mode, the ion source may utilize an organoaluminium gas.

A machine for the deposition of material on a substrate by the cathodic sputtering technique is provided, of the type provided with a cathode assembly having a tubular support extending substantially along a first axis (A), and a plurality of magnetic elements constrained to the tubular support and spaced from one another along the first axis (A), and wherein each of the magnetic elements has at least one second axis (M) of magnetic orientation, linking the respective magnetic poles (N; S) and has an outer side jutting from the tubular support and an inner side constrained to the tubular support, wherein the second axis (M) linking the poles of each magnetic element is transverse to the first axis (A) of the tubular support and the polarity (S; N) of the outer sides of two consecutive magnetic elements along the first axis (A) on the tubular support is alternating.

A radial magnetron system for plasma surface modification and deposition of high-quality coatings for multi-dimensional structures is described. The system includes an axial electrode, a target material disposed on a portion of the axial electrode, an applied potential from an external electrical power source, and a high-current contact attached to the axial electrode for the applied potential. The system further includes a primary permanent magnet assembly comprising individual magnetic material elements configured to produce a target-region magnetic field for generating a Hall-effect dense plasma region under application of the applied potential to the axial electrode, and a magnet substrate that supports the primary permanent magnet assembly within the axial electrode. The magnet substrate is configured to provide a passageway for cooling the primary permanent magnet assembly and the axial electrode.