Electronic device processing systems including an equipment front end module with at least one side storage pod are described. The side storage pod has a chamber including a top substrate holder and a bottom substrate holder. In some embodiments, an exhaust port is located at a midpoint between the top substrate holder and the bottom substrate holder. Methods and systems in accordance with these and other embodiments are also disclosed.

A substrate container system comprises a container body having a bottom face, a front opening that enables passage of a substrate, and a back opening opposing the front opening, the back opening having a width smaller than that of the front opening; and a back cover that covers the back opening and establishes sealing engagement with the container body, wherein the back cover comprises a first gas inlet structure that bendingly extends under the bottom face of the container body upon assembly; wherein the first gas inlet structure comprises a downward facing gas intake port opposing the bottom face of the container body.

The present disclosure relates to the technical field of semiconductors, and proposes a semiconductor chip container and a fixture. The container is placed in a containing device with a chemical reagent, and the container includes a main body and partition plates, where the main body has an accommodating space; the partition plates are arranged in the accommodating space and divide the accommodating space into a plurality of independent accommodating chambers; the plurality of accommodating chambers are respectively used for placing a plurality of independent semiconductor chips; the main body is provided with first through holes; the first through holes are used for allowing the chemical reagent to enter the accommodating space; the main body and the partition plates are used for preventing the semiconductor chip from being separated from the corresponding accommodating chamber under the action of the chemical reagent.

The present invention provides a wafer container and a gas diffusion device applied in the wafer container. The wafer container includes a shell, and all components included and applied on the shell are made of thermal resistance materials. The gas diffusion device and the wafer container, when assembled together, utilize a coupling structure and a collar as a protection mechanism for the gas diffusion device. The gas diffusion device has a buffering chamber that provides a buffering tolerance and a communicating space for the gas before the gas enters an interior space of the wafer container.

An apparatus for semiconductor manufacturing includes an input port to receive a carrier, wherein the carrier includes a carrier body, a housing installed onto the carrier body, and a filter installed between the carrier body and the housing. The apparatus further includes a first robotic arm to uninstall the housing from the carrier and to reinstall the housing into the carrier; one or more second robotic arms to remove the filter from the carrier and to install a new filter into the carrier; and an output port to release the carrier to production.

Proposed is a wafer storage container for accommodating wafers in a storage chamber and, more particularly, a wafer storage container that can effectively block contaminated outside air flowing into the wafer storage container from an external chamber.

A substrate processing apparatus includes: a batch processor configured to collectively process a lot including plural substrates; a single-wafer processor configured to process the substrates included in the lot one by one; and a transport portion configured to deliver the substrates one by one between the batch processor and the single-wafer processor. The batch processor includes a processing tank configured to store a processing liquid including a rinsing liquid. The transport portion includes a fluid supplier configured to supply, after receiving the substrates included in the lot in the processing tank and until delivering the substrates to the single-wafer processor, a low surface tension fluid having a lower surface tension than the rinsing liquid to at least one of the processing tank and the substrates.

Adsorbents can be structured for use in a wafer container microenvironment. The loading of these adsorbents can be tailored to the particular contaminants to be removed from the wafer container microenvironment. The loading can include adsorbents for one or more contaminants, the contaminants including acids, bases, condensable organic compounds, and/or volatile organic compounds. The adsorbent can further include a moisture removal material such as a molecular sieve. The contaminants to be removed can be determined by cleaning or staging conditions for the wafer container, testing of previous adsorbents used in processes.

A substrate storage container and a gas replacement unit capable of reducing variations in humidity or concentration of gas in a space above a substrate are provided. The substrate storage container comprises a container body having an opening and is capable of containing substrates, a lid, at least one intake valve for supplying gas to the inside of the container body, and at least one gas replacement unit which blows out the supplied gas wherein the at least one intake valve is attached to the back, bottom surface of the container body. The gas replacement unit includes a housing member and a cover member. The housing member has a plurality of first group blowout holes in the vertical direction, and the opening area of the top first group blowout hole is larger than the opening area of the second of the first group blowout holes.

A storage system includes shelves each with a nozzle to supply clean gas into containers, flow amount controllers to control a supply amount of clean gas to a nozzle, a transport apparatus to transfer the containers to and from the shelves, and a controller to control the transport apparatus and the flow amount controllers. The controller makes an assignment of at least one shelf in preparation to store an incoming container and before the occurrence of the incoming container, and controls a flow amount controlling device to supply clean gas to the nozzle in the at least one shelf, based upon the assignment.