The present disclosure relates to an integrated chip (IC) processing tool having a die exchanger configured to automatically transfer a plurality of IC die between a die tray and a die boat, and an associated method. The integrated chip processing tool has a die exchanger configured to receive a die tray comprising a plurality of IC die. The die exchanger is configured to automatically transfer the plurality of IC die between the die tray and a die boat. An IC die processing tool is configured to receive the die boat from the die exchanger and to perform a processing step on the plurality of IC die within the die boat. By operating the die exchanger to automatically transfer IC die between the die tray and the die boat, the transfer time can be reduced and contamination and/or damage risks related to a manual transfer of IC die can be mitigated.

A batch processing oven comprising a processing chamber and a rack configured to be positioned in the processing chamber. The rack is configured to support a plurality of substrates and a plurality of panels in a stacked manner such that one or more substrates of the plurality of substrates are positioned between at least one pair of adjacent panels of the plurality panels. Vertical gaps separate each substrate of the one or more substrates from an adjacent substrate or panel on either side of the substrate.

Generation of dust from a peripheral portion of a substrate can be suppressed, and a processed substrate can be suppressed from being adversely affected by a pre-processed substrate. Further, an actual elevation state of the member configured to be moved up and down to support the substrate can be investigated. A substrate transfer device includes a first supporting portion, a second supporting portion and an elevating mechanism. The first supporting portion and the second supporting portion are configured to support a substrate from below the substrate. The elevating mechanism is configured to elevate the second supporting portion up and down between a first position higher than a height of the first supporting portion and a second position lower than the height of the first supporting portion. The substrate transfer device further includes a detecting mechanism configured to detect an elevation state of the second supporting portion.

A substrate processing apparatus includes a process chamber and a transfer device configured to transfer a plurality of substrates to a substrate retainer. The transfer device includes a base; a first moving unit capable of linear motion; a first drive unit to drive the first moving unit. The first drive unit includes a first pulley group; a first motor coupled to a first pulley; and a first connecting member coupling the first belt and the first moving unit. A second moving unit is capable of linear motion. A second drive unit is in an enclosure of the first moving unit and drives the second moving unit. The second drive unit includes a second pulley group; a second belt wound on the second pulley group, a second motor coupled to drive a second pulley; and a second connecting member coupling the second belt and the second moving unit.

A substrate holding device includes a base body that has a flat plate-like shape and in which gas holes that open in an upper surface of the base body are formed, and a plurality of protrusions that protrude upward from the upper surface of the base body. A groove that opens in a lower surface of the base body and that is connected to the gas holes is formed in the base body, and a plurality of protrusions that protrude downward are formed in the groove.

Disclosed are an apparatus and a method for liquid-treating a substrate. An apparatus for treating a substrate includes a liquid treatment chamber that supplies a liquid onto the substrate to liquid-treat the substrate, a drying chamber that removes the remained liquid on the substrate, and a transfer unit that transfers the substrate between the liquid treatment chamber and the drying chamber, wherein the transfer unit includes a hand that supports the substrate, and a weight measuring unit that measures a weight of the remained liquid on the substrate. A weight of a remained liquid on a substrate may be measured by measuring a weight of the substrate while the substrate is transferred.

A substrate treating apparatus includes a transporting space, transport mechanisms, and heat-treating sections. The transport mechanisms are provided in the transporting space. The heat-treating section, transporting space, and heat-treating section are aligned in the stated order in a transverse direction. One heat-treating section includes a plurality of heat-treating units. The heat-treating units are arranged in a longitudinal direction. The other heat-treating section includes a plurality of heat-treating units. These heat-treating units are also arranged in the longitudinal direction. One transport mechanism transports substrates to the heat-treating units. The other transport mechanism also transports substrates to the heat-treating units.

Wafers on a first wafer carrier in a tank are lifted from the first wafer carrier and a bath in the tank so as to accomplish Marangoni drying of the wafers. The lifted dry wafers are positioned on a second wafer carrier in a chamber and shifted to an offset position. A barrier, which can be a wall of the chamber with or without a sweeping flow of gas, impedes the passage of deposits to the wafers arising during drying of the first wafer carrier. Static electricity can be discharged from wafer supports in the offset position.

A wafer cassette and a method for placing a wafer are provided. The wafer cassette includes a box body including a plurality of groups of card slots formed on sidewalls of the box body. Each group of the card slots is configured to hold a wafer and includes a wafer input terminal. The wafer cassette also includes a guide device including a plurality of groups of guide slots configured to be docked to the wafer input terminals. Each group of the guide slots and a docking group of the card slots are formed at a same floor.

Disclosed is a substrate treating apparatus for performing a cleaning treatment on substrates. The apparatus includes an indexer block with an indexer robot, a treating block including a cleaning unit, and a path block disposed between the indexer block and the treating block. The indexer robot includes a guide rail, a base, an articulated arm, and a hand. The guide rail is positioned so as not to overlap a mount position of a substrate in the path block.