In an embodiment, a system includes: a gas distributor assembly configured to dispense gas into a chamber; and a chuck assembly configured to secure a wafer within the chamber, wherein at least one of the gas distributor assembly and the chuck assembly includes: a first portion comprising a convex protrusion, and a second portion comprising a concave opening, wherein the convex protrusion is configured to engage the concave opening.

A wafer carrier includes a pocket sized and shaped to accommodate a wafer, the pocket having a base and a substantially circular perimeter, and a removable orientation marker, the removable orientation marker comprising an outer surface and an inner surface, the outer surface having an arcuate form sized and shaped to mate with the substantially circular perimeter of the pocket, and the inner surface comprising a flat face, wherein the removable orientation marker further comprises a notch at a first end of the flat face.

A method includes: supplying a processing liquid to a center position of a substrate surface; shifting a supply position of the processing liquid from the center position to a first eccentric position; holding the supply position of the processing liquid at the first eccentric position and supplying a substitute liquid to a second eccentric position; shifting the supply position of the processing liquid in a direction away from the center position, and shifting a supply position of the substitute liquid to the center position; and supplying the processing liquid to the first eccentric position at a first flow rate, and reducing the flow rate of the processing liquid to a second flow rate after the supply position of the processing liquid starts to be shifted from the first eccentric position in the direction and until the supply position of the substitute liquid reaches the center position.

In a substrate processing apparatus for supplying a processing liquid onto a lower surface of a substrate being rotated, to thereby process the substrate, provided are an upper support body which is separably placed on a lower support body, a plurality of upper holding members protruding downward from the upper support body, for holding the substrate, and an upper hold-driving part for moving the upper holding members separably from and contactably with an outer edge portion of the substrate. Preferably, the upper hold-driving part moves the upper holding members by using a magnetic action between holding-side magnetic members and an annular driving-side magnetic member.

In a substrate processing apparatus for supplying a processing liquid onto a substrate being rotated, to thereby process the substrate, an upper support body which is an annular member is separably placed on a lower support body for supporting the substrate. The upper support body rotates together with the lower support body while covering an outer edge portion of the substrate. The upper support body includes an annular sidewall opposed to an outer periphery of the substrate and an outer periphery of the upper support body in a radial direction and an annular upper portion which extends from the annular sidewall inward in the radial direction and is opposed to an outer edge portion of an upper surface of the substrate in an up-and-down direction. The opening area of the annular upper portion is not less than a half of the area of the substrate.

The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a treating bath having an accommodation space for accommodating a treating liquid; a support member configured to support at least one substrate in a vertical posture at the accommodation space; and a posture changing robot configured to change a posture of a substrate immersed in the treating liquid from the vertical posture to a horizontal posture, and wherein the posture changing robot comprises: a body configured to hold the substrate thereon; and a liquid supply member configured to supply a wetting liquid to the substrate placed on the body.

The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate onto a support film on a frame to form a work piece work piece; loading the work piece onto the work piece support; providing a clamping electrode for electrostatically clamping the work piece to the work piece support; providing a mechanical partition between the plasma source and the work piece; generating a plasma through the plasma source; and etching the work piece through the generated plasma.

A lithographic apparatus comprising: a clamping surface for supporting a substrate, wherein a property of the clamping surface is defined by at least one clamping surface parameter, and wherein the property of the clamping surface has been selected to exhibit low wear; a clamping apparatus for actuating a clamping operation between the clamping surface and the substrate, wherein the clamping operation is defined at least in part by at least one interface characteristic between the clamping surface and the substrate; and a processing station, operable to apply an adjustment to a first property of the substrate to optimize at least one interface characteristic of a particular clamping operation in dependence on the clamping surface parameter and at least one substrate surface parameter which defines a second property of the substrate.

At least one laser sensor and a controller are embedded into a substrate processing system communicating with a remote big data and machine learning server receiving/sending data from/to a fleet of substrate processing systems for autonomous process control and optimization. The laser sensor is arranged proximate to a region of the substrate processing system and is configured to capture first data from at least one of an edge coupling ring and a semiconductor substrate transported from/to the processing chamber to/from the region. The controller is configured to receive the first data from the laser sensor, process the first data to generate second data, transmit the second data to a remote server via a network, receive third data from the remote server via the network in response to sending the second data to the remote server, and operate the substrate processing system based on the third data for process optimization.

The present disclosure provides a mounting fixture of a bearing ring for a wafer. The bearing ring includes a circular ring portion, screw elements, and multiple permanent seats, wherein the circular ring portion includes a ring body and multiple lugs provided with light holes, each of the permanent seats is provided with a threaded hole, and one of the screw elements can be in threaded connection with the threaded hole after passing through a light hole. The mounting fixture includes a first clamp body and a second clamp body, where the first clamp body is provided with a first circular hole portion and first groove portions; a diameter of the first circular hole portion is greater than or equal to an external diameter of the ring body; the second clamp body is provided with second groove portions penetrating through the second clamp body.