A lower-surface center region of a substrate held by a first holder is cleaned by a cleaner. A lower-surface outer region of the substrate rotated by a second holder is cleaned by the cleaner. A mobile base provided with the second holder and the cleaner is moved in a horizontal plane such that a reference position of the first holder coincides with a center axis of the second holder in a plan view when the substrate is received and transferred between the first holder and the second holder, and is moved in the horizontal plane such that the cleaner overlaps with the lower-surface center region of the substrate held by the first holder and a center axis of the cleaner coincides with a first portion different from a center of the substrate in the plan view when the lower-surface center region is cleaned.

A tensioning device, including a base configured to carry a mask plate, a clamp configured to clamp the mask plate, and a deformation adjusting assembly provided on the base or on the clamp, wherein the deformation adjusting assembly is configured to adjust a deformation of an end portion of the mask plate protruding from the base in a direction of gravity when the base carries the mask plate, so as to make the deformation less than a preset deformation threshold. A base, a clamp and a clamping for the mask plate are also provided.

A wafer carrier includes a pocket sized and shaped to accommodate a wafer, the pocket having a base and a substantially circular perimeter, and a removable orientation marker, the removable orientation marker comprising an outer surface and an inner surface, the outer surface having an arcuate form sized and shaped to mate with the substantially circular perimeter of the pocket, and the inner surface comprising a flat face, wherein the removable orientation marker further comprises a notch at a first end of the flat face.

An apparatus may include a clamp to clamp a substrate wherein the clamp is arranged opposing a back side of the substrate; and an illumination system, disposed to direct radiation to the substrate, when the substrate is disposed on the clamp, wherein the radiation comprises a radiation energy, equal to or above a threshold energy to generate mobile charge in the substrate, where the illumination system is disposed to direct radiation to the back side of the substrate.

A cleaning device includes: a plurality of rollers that hold a peripheral edge part of a substrate; a rotation driving unit that rotates the substrate by rotationally driving the plurality of rollers; a cleaning member that abuts on the substrate and cleans the substrate; a cleaning liquid supply nozzle that supplies a cleaning liquid to the substrate; a microphone that detects a sound generated when a notch of the peripheral edge part of the substrate hits the plurality of rollers; and a rotation speed calculation unit that calculates a rotation speed of the substrate on the basis of the sound detected by the microphone.

A failure analysis unit is a wafer conveyance unit configured to convey a wafer while holding the wafer in a semiconductor failure analysis apparatus, the wafer conveyance unit including: a placement table configured to fix a wafer at a predetermined observation position; and a wafer chuck configured to convey the wafer while holding the wafer to the observation position. The wafer chuck includes a plurality of holding members (protruding portions) provided so as to face a side surface of the wafer, and holds the wafer by sandwiching a peripheral portion of the wafer W with the plurality of holding members.

The disclosure provides one technique for suppressing wear of a cleaning member and unexpected dust generation. A substrate support mechanism 100 includes a first support part 110 which is swingable and has a contact region that can come into contact with a peripheral edge of one surface of a substrate W in a closed state, a second support part 120 which supports the other surface of the substrate W, and a first support part moving part 140 which swings the first support part 110.

The disclosure provides a substrate cleaning device and a substrate processing device capable of suppressing erroneous rotation detection of an optical sensor due to adhesion of droplets or mist. A substrate cleaning device includes a substrate cleaning part for cleaning a substrate, a drive roller for rotating the substrate, a driven roller rotated by the substrate, and a rotation detection part for detecting rotation of the driven roller. The rotation detection part includes a detected part provided on the driven roller, an optical sensor for detecting rotation of the detected part by irradiation with detection light, and a liquid filling part for filling an optical path forming space in which an optical path of the detection light is formed with a liquid having transmittance.

A substrate cleaning apparatus and related apparatuses/methods are disclosed. In one embodiment, a substrate cleaning apparatus includes: a first spindle group including a first driving spindle having a first driving roller configured to rotate a substrate and an idler spindle having a driven roller rotated by the substrate; a second spindle group including a plurality of second driving spindles each having a second driving roller configured to rotate the substrate; a cleaning mechanism configured to clean the substrate rotated by the first driving roller and the plurality of second driving rollers; and a rotation detector configured to detect the rotational speed of the driven roller. The driven roller is positioned on the opposite side to a direction in which the substrate receives a force from the cleaning mechanism.

According to one embodiment of the present disclosure, provided is a substrate cleaning device including: a substrate holder configured to hold a substrate; a substrate cleaning member configured to come into sliding contact with the held substrate, and clean the substrate using a first cleaning liquid supplied from a first nozzle; a self-cleaning member configured to come into sliding contact with the substrate cleaning member at a retreat position separated from the substrate holder, and performs self-cleaning on the substrate cleaning member using a second cleaning liquid supplied from a second nozzle; a measurement module configured to measure a physical property value of a waste liquid of the second cleaning liquid used for the self-cleaning of the substrate cleaning member; and a controller configured to estimate a number of fine particles adhering to the cleaned substrate based on the physical property value of the waste liquid.