Provided is a substrate holder and a substrate treatment apparatus capable of positioning a substrate even in a case in which the substrate receives a frictional force and the like from a support surface. A substrate holder 200 according to the present invention includes: a first holding member 300; a second holding member 500 adapted to pinch a substrate W with the first holding member 300; three or more positioning members 360 including contact surfaces 342 that come into contact with side end portions of the substrate W; a first moving member 380 including a plurality of engaging portions 384 that are engaged with the positioning members 360 such that the positioning members 360 with a state in which distances of an ideal axis L and contact surfaces 376 of the positioning members 360 are equal to each other maintained; and a first biasing member 310 adapted to bias the first moving member 380, in which the first moving member 380 delivers a biasing force of the first biasing member 310 to each of the positioning members 360, and the positioning members 360 are biased in a direction in which the contact surfaces 376 approaches the ideal axis L with the delivered biasing force.

The present invention relates to a substrate support assembly for a substrate treatment apparatus, including: a chuck base disposed opposite to a substrate when the substrate is installed, rotatable around a rotating shaft, and having an installation accommodation portion formed in the lower portion near the outer peripheral surface thereof in a circumferential direction thereof; chuck pins disposed on top of the chuck base and movable along directions away from and approaching the substrate; a mechanism unit disposed in the installation accommodation portion and connected to the chuck pins to move the chuck pins; and a driving unit for transmitting power to the mechanism unit.

An apparatus is provided. The apparatus includes a spinner configured to hold a wafer, a nozzle configured to supply a liquid chemical onto an upper surface of the wafer, and a laser module configured to heat the wafer by radiating a laser beam to a lower surface of the wafer while the nozzle supplies the liquid chemical onto the upper surface of the wafer.

The invention relates to a wafer chuck for handling a wafer, in particular in a wafer process device, further preferably in a scanning acoustic microscope, with a fixing device for the wafer, wherein the fixing device has a free space for receiving the wafer and a holder with multiple wafer contact fingers, which are movable relative to the holder for a wafer. The wafer contact fingers are arranged annularly around the free space for the wafer, preferably in one plane. The wafer contact fingers can be moved in the direction of the free space for the wafer or can be moved away from the free space for the wafer. One actuation device for the wafer contact fingers is provided and, when the actuation device is actuated, the wafer contact fingers are moved or can be moved simultaneously.

According to the present disclosure, a semiconductor manufacturing apparatus includes a rotation stage that rotates a wafer, a nozzle that supplies a chemical solution to the wafer and a nozzle movement section that moves the nozzle on a scan trajectory, wherein the nozzle movement section moves the nozzle along a first trajectory and a second trajectory on the scan trajectory, the first trajectory is a trajectory to turn around at a first turnaround point on one side and a second turnaround point on the other side with respect to a portion closest to a rotation axis of the rotation stage in the scan trajectory, and the second trajectory is a trajectory to turn around at a third turnaround point and a fourth turnaround point provided on the same side as the third turnaround point with respect to the portion closest to the rotation axis in the scan trajectory.

The present invention relates to a substrate support assembly for a substrate treatment apparatus, including: a chuck base supporting the substrate to be treated, disposed rotatable around a rotating shaft, and having as installation accommodation portion formed near the outer peripheral surface thereof in a circumferential direction thereof and a receiving recess formed open on the top thereof at the inside surrounded by the installation accommodation portion; chuck pins disposed on the top of the installation accommodation portion of the chuck base and movable along directions away from and approaching the substrate; a mechanism unit disposed in the installation accommodation portion and connected to the chuck pins to move the chuck gins; a driving unit for transmitting power to the mechanism unit; and as ultrasonic cleaning unit disposed in the receiving recess.

A vacuumizing device includes a vacuum chamber, a bonding fixture and a vacuumizing system. The bonding fixture is disposed in the vacuum chamber and includes a substrate table provided with a plurality of grooves for retention of the substrate by suction. The vacuumizing system is disposed in communication with both the vacuum chamber and grooves. During vacuumizing by the vacuumizing system, a vacuum value in the grooves is smaller than or equal to a vacuum value in the vacuum chamber. In the vacuumizing device and methods, the vacuumizing system is used to vacuumize the grooves in the substrate table and the vacuum chamber so that the vacuum value in the grooves is always smaller than or equal to that in the vacuum chamber. As a result, the substrates are firmly retained on the substrate table without warping, thereby improving the quality of substrate bonding.

A placing table includes an edge ring disposed to surround a substrate, the edge ring having a first recess portion at a lower portion thereof; an electrostatic chuck having a first placing surface on which the substrate is placed, a second placing surface on which the edge ring is placed, and an electrode embedded therein to face the second placing surface; an annular member disposed to surround the electrostatic chuck, the annular member having a second recess portion; and an elastic member disposed in a space surrounded by the first recess portion, the electrostatic chuck and the second recess portion.

A cleaning device includes: a plurality of rollers that hold a peripheral edge part of a substrate; a rotation driving unit that rotates the substrate by rotationally driving the plurality of rollers; a cleaning member that abuts on the substrate and cleans the substrate; a cleaning liquid supply nozzle that supplies a cleaning liquid to the substrate; a microphone that detects a sound generated when a notch of the peripheral edge part of the substrate hits the plurality of rollers; and a rotation speed calculation unit that calculates a rotation speed of the substrate on the basis of the sound detected by the microphone.

A substrate holding mechanism for holding a substrate placed on a stage which is rotatable with respect to a turntable, includes a substrate holding member, provided at a peripheral portion of the stage, fixed to a rotating shaft disposed below a surface on which the substrate is placed, and contactable to a side surface of the substrate placed on the stage, a biasing member having a first end fixed to the substrate holding member at a position closer to a center of the stage than the rotating shaft, and a second end fixed at a position separated from the substrate holding member toward the center of the stage and below the rotating shaft, and a pressing member configured to press upwardly a portion of the substrate holding member where the first end of the biasing member is fixed.