A planarization system is provided. The planarization system includes a first substrate chuck which holds the substrate during a planarization step, and a second substrate chuck which holds the substrate with a non-flat configuration during a separation step.

A wafer chuck table includes a center plate having a plurality of first protrusions each having an upper end at least partially defining a first reference plane, segmented plates arranged around the center plate and having a plurality of second protrusions, each having an upper end at least partially defining a second reference plane such that the segmented plates have separate, respective pluralities of second protrusions at least partially defining separate, respective second reference planes, and driving units configured to adjust an inclination angle of the segmented plates with respect to the center plate so that the first reference plane and the separate, respective second reference planes are coplanar.

Disclosed is a substrate treating apparatus. The substrate treating apparatus includes a body including an irradiation end, from which laser light is irradiated, a shaft coupled to the body, and a driver that supplies power to the shaft, the heating unit is swung about an axis of the shaft, and the controller moves the irradiation end of the heating unit to a target location on a substrate by adjusting a rotation angle of the heating unit and a rotation angle of the support unit.

A cleaning device for cleaning a rear face of a substrate may include a housing, an electrostatic chuck disposed in the housing wherein the substrate is placed on the electrostatic chuck, at least one adsorption member configured to place the substrate onto the electrostatic chuck, a driving member configured to rotate the electrostatic chuck, a circulation member coupled to the driving member and configured to form a circulating airflow for preventing scattering of a cleaning solution in the housing, at least one auxiliary circulation member disposed adjacent to the circulation member wherein the at least one auxiliary circulation member includes a circulation hole for the circulating airflow, and at least one nozzle disposed adjacent to the at least one auxiliary circulation member and configured to the cleaning solution onto the rear face of the substrate.

A semiconductor wafer held by a Bernoulli chuck is reliably rotated. A wafer holding apparatus includes: a chuck for holding a semiconductor wafer; and a rotating mechanism for rotating the chuck. On a facing surface of the chuck facing the semiconductor wafer, a plurality of pads and a plurality of support parts are formed. The chuck holds the semiconductor wafer by jetting gas from each of the plurality of pads. The plurality of support parts is formed at positions each deviated from a center of the facing surface of the chuck. When the chuck holds the semiconductor wafer, the plurality of pads is not in contact with the semiconductor wafer while the plurality of support parts is in contact with a principal surface of the semiconductor wafer.

A semiconductor processing device comprises a susceptor assembly comprising a wafer support configured to support a wafer. The wafer support comprises a wafer support body configured to support the wafer, a purge channel extending laterally from an inner portion of the wafer support body to an outer portion of the wafer support body, a first plenum channel disposed at the outer portion of the wafer support and in fluid communication with the purge channel, and an outlet to deliver purge gas to an edge of the wafer, the outlet in fluid communication with the first plenum channel, a purge gas supply hole on a surface opposite to the wafer support body. The purge gas supply hole is in fluid communication with the purge channel, and a plurality of first purge holes fluidly communicated with the first plenum channel and the purge channel.

The present invention provides a substrate treating apparatus including: a support unit supporting and rotating the substrate in a treatment space; a liquid supply unit supplying a liquid to the substrate supported by the support unit; and an irradiating module irradiating light to the substrate supported by the support unit, in which the irradiating module includes: a housing having an accommodation space; a laser unit located in the accommodation space, and including a laser irradiation unit irradiating laser light, and an irradiation end having one end protruding from the housing and irradiating the laser light irradiated from the laser irradiation unit to the substrate supported by the support unit; and a cooling unit located in the accommodation space and cooling the laser irradiation unit.

A method of manufacturing a pressure sensor comprises: above a film portion formed on one surface of a substrate, depositing a first magnetic layer, a second magnetic layer and an intermediate layer between the first and second magnetic layers on one surface of a substrate; removing the deposited layers leaving a part thereof; and removing a part of the substrate from another surface of the substrate. By removing the deposited layers leaving a part thereof, a strain detecting element is formed in a part of a first region, the strain detecting element comprising the first magnetic layer, the second magnetic layer and the intermediate layer. By removing a part of the substrate, a part of the first region of the substrate is removed. In addition, the deposition of the first magnetic layer is performed with the substrate being bended.

Provided is an apparatus for treating a substrate, which includes: a chamber having a treating space; a substrate support unit supporting and rotating a substrate in the treating space; a liquid supply unit supplying a chemical liquid to the substrate supported on the substrate support unit; a laser irradiation unit irradiating a laser to a bottom of the substrate supported on the substrate support unit; and a laser reflection unit coupled to the laser irradiation unit, and reflecting the laser irradiated and reflected to the bottom of the substrate, in which the laser reflection unit includes a reflection member reflecting the laser reflected from the substrate, and a driving member tilting the reflection member at a predetermined tilt angle.

A device for holding and rotating a plate shaped article comprises a group of fixed pins and a group of pivot pins arranged along the circumference of the movable base in a manner that each pivot pin opposites a fixed pin, and also comprises magnetic bodies positioned within and outside two opposing sides of the pivot pins. Each of the pivot pins can be driven to rotate around its pivot back and forth under the magnetic repulsive force between two adjacent magnetic bodies, so as to release or clamp the plate shaped article. The present invention has advantages of simple structure, convenient and reliable action control, controllable clamping force and good compatibility with various processing chambers.