The present invention provides lift pin strategies with a reduced risk of causing contamination due to the up and down actuation of lift pins. The present invention provides a lift pin system that uses electromagnetic actuation strategies in order to raise and lower lift pins. The electromagnetic forces act remotely on the lift pins so that direct contact or coupling of the lift pins to actuation components is not required. This avoids contamination that otherwise would be associated with friction and associated lubricants used for mechanical actuation strategies.

The substrate processing apparatus includes a suction holding mechanism, a rotation mechanism, a plurality of lift pins, a vertical movement mechanism, and a horizontal movement mechanism. The suction holding mechanism sucks and holds a substrate. The rotation mechanism rotates the suction holding mechanism holding the substrate about the rotation axis. The vertical movement mechanism moves the plurality of lift pins in the vertical direction. A sensor measures the eccentric state of the substrate W held by the suction holding mechanism. The vertical movement mechanism supports the substrate from the suction holding mechanism by moving the plurality of lift pins and the horizontal movement mechanism moves the plurality of lift pins based on the eccentric state of the substrate measured by the sensor in a state where the substrate is supported.

A substrate transfer device, includes: a first planar motor installed in a first chamber and having an array of coils; a second planar motor installed in a second chamber connected to the first chamber and having an array of coils; a pair of transfer units configured to move on at least one of the first planar motor and the second planar motor and configured to transfer a substrate; and a controller configured to control supply of electric current to the coils of the first planar motor and the second planar motor.

Systems and techniques for providing for semiconductor processing chambers configured for use with two concentric edge rings with dual-lift mechanisms are disclosed. The dual-lift mechanisms may each have a first lifter structure and a second lifter structure which may be each at least partially independently actuatable. The first lifter structure may be used to move a lower edge ring of the edge rings between two or more vertically offset positions, and the second lifter structure may be used to raise and lower an upper edge ring of the edge rings. The dual-lift mechanism may be interfaced to the chamber housing of the semiconductor processing chamber.

According to one aspect of the technique of the present disclosure, there is provided a substrate processing apparatus including: a process chamber in which a substrate is accommodated; a substrate mounting table provided in the process chamber and heated by a heater; and a substrate mounting table cover arranged on an upper surface of the substrate mounting table and configured such that the substrate is placed on an upper surface of the substrate mounting table cover, wherein the substrate mounting table cover is made of silicon carbide and is provided with a silicon oxide layer of a first thickness at least on the upper surface of the substrate mounting table cover where the substrate is placed.

A lower-surface center region of a substrate held by a first holder is cleaned by a cleaner. A lower-surface outer region of the substrate rotated by a second holder is cleaned by the cleaner. A mobile base provided with the second holder and the cleaner is moved in a horizontal plane such that a reference position of the first holder coincides with a center axis of the second holder in a plan view when the substrate is received and transferred between the first holder and the second holder, and is moved in the horizontal plane such that the cleaner overlaps with the lower-surface center region of the substrate held by the first holder and a center axis of the cleaner coincides with a first portion different from a center of the substrate in the plan view when the lower-surface center region is cleaned.

Provided is a support unit including a support plate on which the substrate is placed, and a support protrusion provided on the support plate and separating the substrate from the support plate, wherein the support plate includes a first protrusion protruding from an upper surface of the support plate, wherein the first protrusion is provided in a support region provided by the support protrusion.

A substrate processing apparatus is disclosed. An exemplary substrate processing apparatus includes a reaction chamber; a susceptor plate positioned within the reaction chamber, constructed and arranged to support a substrate, and provided with one or more holes; a substrate lift mechanism comprising: a plurality of lift pins to support the substrate; and a lift pin support member to move the lift pins; in a vertical direction through the one or more holes; a substrate transfer robot provided with one or more robotic arms to transfer the substrate to a position above the lift pins; and a gas supply unit constructed and arranged to face the susceptor plate; wherein the gas supply unit is constructed and arranged to move in the vertical direction thereby positioning the gas supply unit in a processing position in the reaction chamber.

A method includes placing a wafer on a susceptor, wherein the wafer has a first radius, wherein a top surface of the susceptor has a second radius that is greater than the first radius; using microwave radiation to heat the wafer and the susceptor; and removing the wafer from the susceptor.

A substrate treating apparatus is provided. The substrate treating apparatus includes an atmospheric pressure transfer module provided with a first transfer robot having a first hand with a substrate placed thereon; a vacuum transfer module provided with a second transfer robot having a second hand with a substrate placed thereon; a load-lock chamber positioned between the atmospheric pressure transfer module and the vacuum transfer module, and having an inner space convertible between an atmospheric pressure and a vacuum atmosphere; a process chamber coupled to the vacuum transfer module and treating the substrate; and a ring carrier supported by the first transfer robot or the second transfer robot for a transfer of a ring member. The ring carrier comprises a plate having the ring member placed thereon and at least one leg protruding from a bottom surface of the plate and placed at the first hand or the second hand.