Susceptor assemblies comprising a susceptor base and a plurality of pie-shaped skins thereon are described. A pie anchor can be positioned in the center of the susceptor base to hold the pie-shaped skins in place during processing.

Exemplary semiconductor processing chambers may include a chamber body. The chambers may include a showerhead. The chambers may include a substrate support. The substrate support may include a platen characterized by a first surface facing the showerhead. The substrate support may include a shaft coupled with the platen along a second surface of the platen opposite the first surface of the platen. The shaft may extend at least partially through the chamber body. A coating may extend conformally about the first surface of the platen, the second surface of the platen, and about the shaft.

Disclosed are systems and methods for processing gift transactions. An example method includes receiving an identification of a first merchant from a giver at a first time, wherein a gift from the giver to a recipient is redeemable at the first merchant. The method can include generating a policy comprising the first merchant. The policy can be at least in part giver-defined and linked to the recipient payment account. The method can then include transmitting an electronic notice to a recipient device, receiving a selection from the recipient of a second merchant at which to redeem the gift from the giver, updating the policy to apply to the second merchant selected by the recipient to yield an updated policy and, upon receiving an indication of a triggering event caused by use of the recipient payment account as defined by the updated policy, applying an amount of money to the gift.

According to one aspect of the technique of the present disclosure, there is provided a substrate processing apparatus including: a process chamber; a process gas supplier through which a process gas is supplied into the process chamber; an exhauster through which an inner atmosphere of the process chamber is exhausted; a plasma generating structure configured to supply a plasma into the process chamber; a boat configured to accommodate a plurality of substrates in the process chamber; a rotary shaft configured to rotatably support the boat; and an internal conductor provided inside the rotary shaft and electrically connected to the boat; wherein the boat is made of a non-metallic material, at least a part of a surface of the boat is conductive, and the boat is configured to electrically connect the internal conductor and the plurality of substrates.

A wafer placement table includes a conductor unit. In the wafer placement table, a sub-RF electrode (first conductive layer) and a jumper layer (second conductive layer) are embedded at different levels in a ceramic substrate having a wafer placement surface, and the conductor unit establishes electrical continuity between the sub-RF electrode and the jumper layer. The conductor unit is a transversely placed coil or a transversely placed perforated cylindrical body.

Electrostatic chucks for use in substrate processing chambers are provided herein. In some embodiments, an electrostatic chuck for use in a substrate processing chamber includes: a dielectric plate having an electrode disposed therein, the dielectric plate further including a central portion and a peripheral portion, wherein the peripheral portion comprises at least one of: an outer sidewall having at least one asperity; a porosity greater than a porosity of the central portion of the dielectric plate; or one or more coatings made of a material different than a material of the central portion.

There is provided a substrate holder including: a ceramic base member; a plurality of electrodes and at least one conductive member embedded in the ceramic base member; a plurality of connecting parts electrically connecting the plurality of electrodes and the at least one conductive member such that each of the at least one conductive member is connected to at least one of the plurality of electrodes; a plurality of terminals provided on at least one of the plurality of electrodes or the at least one conductive member. A resistance value between a connecting part connected to the at least one conductive member and a terminal provided on the at least one conductive member is smaller than a resistance value between both ends of each of the plurality of electrodes. The number of the plurality of terminals is smaller than two times the number of the plurality of electrodes.

An electrostatic chuck according to the disclosure includes a chuck base, and an upper plate. The upper plate includes a base portion, and a first contact pattern, a second contact pattern and an outer dam protruding from the base portion. The outer dam surrounds the first contact pattern structure and the second contact pattern structure. A distance of the second contact pattern structure to the outer dam is less than a distance from the first contact pattern structure to the outer dam. A surface roughness of a top surface of the second contact pattern structure is greater than a surface roughness of a top surface of the first contact pattern structure.

A wafer placement table includes a ceramic substrate having a wafer placement surface; a first electrically conductive layer embedded in the ceramic substrate; and an electrically conductive via connected at one end to the first electrically conductive layer, wherein the electrically conductive via includes a plurality of columnar members connected together in a vertical direction, and wherein the area of the connection surface of one of two columnar members connected to each other is larger than the area of the connection surface of the other.

In one embodiment according to the disclosure, an apparatus for manipulating substrates in semiconductor processing comprising a plurality of lift pins, comprising a top end and a down end, and configured for the top end can move upward to an UP position and move downward to a DOWN position, wherein the top end supports a wafer, a weight comprising a plurality of lift pin holes and is configured to connect the plurality of lift pins and a plurality of weight supports, each of them are configured to attach to the plurality of lift pins respectively and each of them are to be placed in the plurality of lift pin holes respectively is presented. The embodiment can improve the semiconductor processing efficiency by preventing the lift pins from getting stuck.