A device for moving an object including a substrate through an open side of a processing station of a processing apparatus including a support, placeable at the processing station. The device includes a carrier, guided for movement relative to the support along a path predominantly directed in parallel to a reference axis in a reference co-ordinate system. The device includes a device for controlling movement of the carrier and driving the movement in an opposite direction along the path. The device includes a component for holding the object and a suspension mechanism with which the holding component is connected to the carrier. The suspension mechanism is arranged to guide movement of the holding component relative to the carrier along a holding component path. The device is arranged to drive the movement of the holding component along the holding component path. The holding component path is predominantly directed parallel to the reference axis.

Embodiments of the present disclosure generally relate to lift pins and to apparatus for controlling lift pin movement. In an embodiment, an apparatus for positioning a substrate in a chamber is provided. The apparatus includes a chamber component, a lift pin having a top surface for supporting the substrate and a lift pin shaft and a stopper. The apparatus further includes a compressible element positioned between the chamber component and the stopper, the compressible element further positioned around the lift pin shaft, the lift pin being moveable relative to a substrate transfer plane by movement of a substrate support in contact with the compressible element.

A wafer support device includes a support base having a wafer-facing surface, the support base comprising a heater, and an electrostatic chuck supported by the support base, the electrostatic chuck having an attraction surface configured to attract a wafer for wafer processing. During the wafer processing, the wafer-facing surface and the attraction surface are positioned at respective different positions in a direction perpendicular to the wafer-facing surface so that the attraction surface is separated from the wafer-facing surface by a distance.

A substrate processing apparatus capable of improving the uniformity of thin films on a substrate includes: a substrate support unit having a first slope; and a flow control ring arranged to surround the substrate support unit and having a second slope, wherein, during alignment, as the substrate support unit moves in a first direction, the first slope and the second slope contact each other, and due to the contact, the flow control ring slides in a second direction that is different from the first direction.

A substrate transfer device is provided with: a movement tile provided in a substrate transfer region and including first magnets for changing a state of a magnetic field and a movement surface; a substrate transfer module including a second magnet that receives a magnetic force and configured to move along the movement surface while being floated from the movement surface by the magnetic force; a transfer controller for controlling the magnetic field formed by the first magnets to move the substrate transfer module along a preset route; a detector for detecting an index value corresponding to a magnitude of a deviation, from the preset route, of an actual movement path of the substrate transfer module moving along the movement surface; and a correction parameter calculation part for calculating a correction parameter for correcting the magnetic force acting on the second magnet based on the index value.

The present disclosure provides a load-bearing device telescopic relative to a reference object, a wafer transfer device, a chamber device which is configured to exchange wafers between different pressure environments, and a wafer processing apparatus, the load-bearing device including a base, a movable platform opposite to the base, an ejector rod which is configured to extend through a bearing secured to the base and is coupled to the movable platform, and a driving member which is fixed relative to the reference object and is configured to push against the ejector rod and in turn to drive the ejector rod to displace relative to the base. The bearing device further includes a corrugated tube assembly, surrounding the ejector rod and includes a first corrugated tube sleeved on the ejector rod, the ejector rod and the first corrugated tube cooperating with each other to define collectively a first space.

A substrate support includes a disc body with an upper surface and an opposite lower surface arranged along a rotation axis. The upper surface has a circular concave portion extending about the rotation axis, an annular ledge portion extending circumferentially about the concave portion, and an annular rim portion extending circumferentially about the ledge portion connecting to the concave portion of the disc body by the ledge portion of the disc body. The ledge portion slopes downward radially outward from the rotation axis to seat a substrate on the disc body such that a beveled edge of the substrate is cantilevered above the ledge portion of the upper surface of the disc body. Substrate support assemblies, semiconductor processing systems, and film deposition methods are also described.

A method of transporting a workpiece includes steps of: (a) adjusting an inclination of a stage including a placement surface on which the workpiece is to be placed such that the placement surface is inclined with respect to a horizontal plane; (b) receiving the workpiece from a transport apparatus configured to transport the workpiece by raising lift pins provided in the stage, before or after step (a); (c) placing the workpiece on the inclined placement surface by performing at least one of lowering the lift pins and raising the stage; and (d) adjusting the inclination of the stage such that the placement surface on which the workpiece is placed is parallel to the horizontal plane.

Cleaning systems and methods for semiconductor fabrication use rotatable and translatable chuck assemblies that incorporate a compact drive system to cause chuck rotation. The system uses an offset drive gear that drives a ring gear. This reduces components whose friction or lubricants might generate undue contamination. The low friction chuck functionality of the present invention is useful in any fabrication tool in which a workpiece is supported on a rotating support during a treatment. The chuck is particularly useful in cryogenic cleaning treatments.

Provided is an apparatus for treating a substrate, the apparatus including: a liquid treating chamber for liquid-treating a substrate by supplying a treatment liquid to the substrate; and a liquid supply unit for supplying the treatment liquid to the liquid treating chamber, in which the liquid supply unit includes: a cabinet configured to be mounted with a bottle containing the treatment liquid; and a rotation generating part configured to rotate the bottle so that a direction in which an inlet of the bottle mounted on the cabinet faces is changed.