A method for producing a display device includes locating a substrate, including a plurality of pixels, on a jig including a magnet; locating a plate formed of a magnetic material on the substrate to secure the substrate; and folding back an end portion of the substrate in a state where the substrate is held between the jig and the plate.

An apparatus is for plasma dicing a semiconductor substrate of the type forming part of a workpiece, the workpiece further including a carrier sheet on a frame member, where the carrier sheet carries the semiconductor substrate. The apparatus includes a chamber, a plasma production device configured to produce a plasma within the chamber suitable for dicing the semiconductor substrate, a workpiece support located in the chamber for supporting the workpiece through contact with the carrier sheet, and a frame cover element configured to, in use, contact the frame member thereby clamping the carrier sheet against an auxiliary element disposed in the chamber.

A spin dry etching process includes loading an object into a dry etching system. A dry etching process is performed to the object, and the object is spun while the dry etching process is being performed. The spin dry etching process is performed using a semiconductor fabrication system. The semiconductor fabrication system includes a dry etching chamber in which a dry etching process is performed. A holder apparatus has a horizontally-facing slot that is configured for horizontal insertion of an etchable object therein. The etchable object includes either a photomask or a wafer. A controller is communicatively coupled to the holder apparatus and configured to spin the holder apparatus in a clockwise or counterclockwise direction while the dry etching process is being performed. An insertion of the etchable object into the horizontally-facing slot of the holder apparatus restricts a movement of the object as the dry etching process is performed.

A substrate holding device includes robot arms, wherein the robot arm includes a supporting portion for supporting a substrate; a plurality of substrate holding modules disposed on the robot arm. Each substrate holding module includes a linear guide mechanism, a substrate holding member, and a drive device for driving the substrate holding member to move along the linear guide mechanism between a first position in which the substrate holding member clamps the substrate and a second position in which the substrate holding member releases the substrate.

Conformable transfer devices and micro-transfer printing methods are described. In an embodiment, a conformable transfer devices includes first and second arrays of transfer heads with differential lengths to support a micro-transfer printing sequence including a single pick operation and multiple placement operations.

A substrate holding device includes robot arms, wherein the robot arm includes a supporting portion for supporting a substrate; a plurality of substrate holding modules disposed on the robot arm. Each substrate holding module includes a linear guide mechanism, a substrate holding member, and a drive device for driving the substrate holding member to move along the linear guide mechanism between a first position in which the substrate holding member clamps the substrate and a second position in which the substrate holding member releases the substrate.

A singulation assembly for molded leadframe sheets includes a saw chuck table having a flat upper surface with a plurality of holes therein. A vacuum source is in fluid communication with the plurality of holes. A mechanical clamping assembly operatively associated with the saw chuck table is adapted to be selectively engageable with predetermined portions of a warped molded leadframe sheet supported on the flat upper surface of the saw chuck table.

A electrostatic chucking apparatus and method for coating mobile device 2D or 3D cover glass in a vacuum coating chamber having a rotating drum and which is driven in rotation. The apparatus includes a carrier including a liquid-cooled cold plate which is removably mountable to the rotating drum. In the case of 3D cover glass, the carrier includes a portion with a 3D profile to match a 3D profile of the 3D cover glass. The carrier further includes an electrostatic chuck (ESC) adapted to secure the cover glass in place against the carrier in the face of centrifugal forces caused by rotation of the rotating drum, with the ESC developing a sufficient clamping force for reliably securing the cover glass in place.

One aspect of the invention relates to a semiconductor module with an outer housing having four side walls, and a circuit carrier, which is mounted on the outer housing and has an upper side and a lower side opposite the upper side. A semiconductor chip is arranged on the upper side and in the outer housing. A first gripping socket, which is formed as an indentation, extends from the outer side of the outer housing into a first of the side walls.

A method for producing a display device includes locating a substrate, including a plurality of pixels, on a jig including a magnet; locating a plate formed of a magnetic material on the substrate to secure the substrate; and folding back an end portion of the substrate in a state where the substrate is held between the jig and the plate.