An embodiment package includes a first die stack on a surface of a package component, a second die stack on the surface of the package component, and a contour lid over the first die stack and second die stack. The contour lid includes a first thermal conductive portion over the first die stack, a second thermal conductive portion over the second die stack, and a thermal barrier portion between the first thermal conductive portion and the second thermal conductive portion. The thermal barrier portion includes a low thermal conductivity material.

A heat radiation structure includes a heat spreader provided on a heating component mounted on a substrate, a heat sink disposed at a position facing the heat spreader, a heat transfer member disposed between the heat spreader and the heat sink, and transmitting heat from the heat spreader to the heat sink, and a conductive member electrically connecting the heat spreader and the heat sink.

An information processing device includes a substrate configured to include a mounting surface above which an electronic component is mounted; a flow passage configured to include a flow path through which a cooling medium flows and be arranged above the mounting surface; and a cooler configured to be detachably coupled with the flow passage and cool the electronic component.

A method affixes a heat sink to a module lid. A module lid is mounted to a substrate by use of a lid adhesive. The module lid has a threaded exterior portion. The module lid is thermally interfaced to a die by use of a thermal interface material. The heat sink is then screwed onto a module lid, where the heat sink includes a threaded heat sink base pocket that mates with the threaded exterior portion of the module lid, and wherein the heat sink is screwed down onto the module lid until 1) a solid mechanical and thermal contact is established between the heat sink and the module lid, and 2) an airflow from an air moving device flows unobstructed across vanes on the heat sink.

Embodiments described herein may include apparatus, system and/or processes to provide an adjustable thermal coupling between cold plate coupled to a first heat source and a liquid-cooled cold plate cooling a second heat source. In embodiments, the adjustable thermal coupling may provide a degree of freedom along an access in accommodating a dimension requirement of the second heat source. Other embodiments may be described and/or claimed.

Devices, systems, and methods for dissipating heat generated from an electrical current carrying device are provided herein. The disclosed concept provides a dielectric heat path device that assists in heat dissipation of an electrical current carrying device by transferring heat from one end of the device to another. The disclosed concept also provides systems that communicate heat generated by an electrical device to a thermally grounded secondary device through a dielectric heat path device to dissipate heat.

An apparatus including a primary device and at least one secondary device coupled in a planar array to a substrate; a first heat exchanger disposed on the primary device and having an opening over an area corresponding to the at least one secondary device; a second heat exchanger disposed in the opening on the at least one secondary device; at least one heat pipe coupled to the first heat exchanger and the second heat exchanger. A method including placing a heat exchanger on a multi-chip package, the heat exchanger including a first portion, a second portion and at least one heat pipe coupled to the first portion and the second portion; and coupling the heat exchanger to the multi-chip package.

A heat dissipation component includes a plate that presses a heat receiving portion against a heat generating portion, and a heat pipe installed at a first surface side of the plate to be in contact with the heat receiving portion, wherein the plate has a shape of an equilateral triangle in plan view from a normal direction of the first surface of the plate, an outer circumferential portion of the plate, except for a portion between each two vertexes of the equilateral triangle, is bent to the first surface side of the plate, and the heat pipe extends to an outside of the plate through a non-bent portion in the outer circumferential portion of the plate.

A fluid routing device includes a fluid inlet, first vertical channels, a horizontal channel, a second vertical channel, and a fluid outlet. The first vertical channels are open to the fluid inlet. The horizontal channel is open to each of the first vertical channels. The first vertical channels are oriented to provide fluid coolant from the fluid inlet vertically down to the horizontal channel. The horizontal channel is open on one side such that fluid coolant in the horizontal channel directly contacts an apparatus attached to a bottom of the fluid routing device. The second vertical channel is open to the horizontal channel. The second vertical channel is oriented to provide fluid coolant vertically up away from the horizontal channel. The fluid outlet is open to the second vertical channel such that fluid coolant from the second vertical channel exits the fluid routing device through the fluid outlet.

A heat sink includes a heat sink base, a first fin, and a second fin. The spacing between the base and the first fin and the second fin, restively, may be adjusted by rotating a threaded rod. The threaded rod includes a first threaded knurl that is engaged with the first fin and a second threaded knurl that is engaged with the second fin. The thread pitch of the first threaded knurl and the second threaded knurl may differ. For example, the pitch of the first threaded knurl may be smaller than the pitch of the second threaded knurl if the first fin is located nearest the heat sink base relative to the second fin. The spacing of the heat sink fins may be adjusted based upon the current operating conditions of the electronic device to maintain an optimal temperature of a heat generating device during device operation.