A semiconductor module includes a resin molded part encapsulating a semiconductor chip, a first terminal having a plate shape, and a second terminal having a plate shape. The first terminal and the second terminal are disposed on top of the other in a thickness direction. The first terminal is exposed from a first surface of the resin molded part, and the second terminal is projected from a second surface of the resin molded part to an outside of the resin molded part, the second surface being different from the first surface from which the first terminal is exposed.

A semiconductor package includes: a lead frame that includes a first surface and a second surface opposite to the first surface, where the lead frame includes a first lead that extends in a first direction, and a plurality of second leads that are spaced apart from the first lead on both sides of the first lead; at least one semiconductor chip mounted on the first surface of the lead frame by a plurality of bumps; and an encapsulant that encapsulates the lead frame and the at least one semiconductor chip, wherein the first lead has a groove in the first surface that partitions the plurality of bumps in contact with the first lead.

A semiconductor package includes a semiconductor die including terminals, a plurality of leads, at least some of the leads being electrically coupled to the terminals within the semiconductor package, a sensor on a surface of the semiconductor die, laser shielding forming a perimeter around the sensor on the surface of the semiconductor die, and a mold compound surrounding the semiconductor die except for an area inside the perimeter on the surface of the semiconductor die such that the sensor is exposed to an external environment.

There is provided a technique that includes: a lead having a main surface facing in a thickness direction; a semiconductor element mounted over the main surface; and a sealing resin that is in contact with the main surface and covers the semiconductor element, wherein the lead is formed with a plurality of grooves that are recessed from the main surface and are located apart from each other, and wherein the plurality of grooves are located away from a peripheral edge of the main surface.

Electronic packages and related methods are disclosed. An example electronic package apparatus includes a substrate and an electronic component. A protective material is positioned on a first surface, a second surface and all side surfaces of the electronic component to encase the electronic component. An enclosure is coupled to the substrate to cover the protective material and the electronic component.

In a described example, a packaged device includes a substrate having a device mounting surface including a first layer of conductive material having a first thickness less than a substrate thickness, the substrate having a second layer of the conductive material having a second thickness less than the substrate thickness. A first semiconductor device is mounted to a first area of the device mounting surface; and a second semiconductor device is mounted to a second area on the device mounting surface and spaced from the first semiconductor device. At least two connectors are formed of the first layer of the substrate having first ends coupled to one of first bond pads on the first semiconductor device and the at least two connectors having second ends coupled to one of second bond pads on the second semiconductor device.

A microelectronic device has a first die attached to a first die pad, and a second die attached to a second die pad. A magnetically permeable member is attached to a first coupler pad and a second coupler pad. A coupler component is attached to the magnetically permeable member. The first die pad, the second die pad, the first coupler pad, the second coupler pad, and the magnetically permeable member are electrically conductive. The first coupler pad is electrically isolated from the first die, from the second coupler pad, and from external leads of the microelectronic device. The second coupler pad is electrically isolated from the first die and from the external leads. The first die and the second die are electrically coupled to the coupler component. A package structure contains at least portions of the components of the microelectronic device and extends to the external leads.

An electronic device includes a die attach pad with a set of cantilevered first leads for down bond connections, a set of second leads spaced apart from the die attach pad, a semiconductor die mounted to the die attach pad and enclosed by a package structure, a set of first bond wires connected between respective bond pads of the semiconductor die and at least some of the first leads, and a set of second bond wires connected between respective further bond pads of the semiconductor die and at least some of the second leads.

A multi-chip module (MCM) package includes a leadframe including half-etched lead terminals including a full-thickness and half-etched portion, and second lead terminals including a thermal pad(s). A first die is attached by a dielectric die attach material to the half-etched lead terminals. The first die includes first bond pads coupled to first circuitry configured for receiving a control signal and for outputting a coded signal and a transmitter. The second die includes second bond pads coupled to second circuitry configured for a receiver with a gate driver. The second die is attached by a conductive die attach material to the thermal pad. Bond wires include die-to-die bond wires between a portion of the first and second bond pads. A high-voltage isolation device is between the transmitter and receiver. A mold compound encapsulates the first and the second die.

A semiconductor device includes: a semiconductor chip having an element forming surface; an insulating layer formed on the element forming surface; a pad wiring layer including a first conductive layer formed on the insulating layer and containing a first conductive material and a second conductive layer formed on the first conductive layer and containing a second conductive material different from the first conductive material, wherein the second conductive layer includes an eaves portion protruding outward with respect to an end surface of the first conductive layer; a bonding member bonded to the pad wiring layer and supplying electric power to an element of the element forming surface; and a coating insulating film selectively formed on the insulating layer below the eaves portion, exposing an upper surface of the insulating layer to a peripheral region of the pad wiring layer, and covering the end surface of the first conductive layer.