A III-V device and a method for forming the device is provided. The III-V FET device includes: a device layer stack including in a bottom-up direction: a drain layer of n-type GaN, a drift layer of n-type GaN, a channel layer of p-type GaN, and a source layer; a gate extending in a top-down direction into the device layer stack and through the channel layer; and a source contact in contact with the source layer and a drain contact in contact with the drain layer; wherein the source layer is formed by a heterostructure comprising in the bottom-up direction a buffer layer of unintentionally doped GaN and a barrier layer of AlGaN.

Embodiments disclosed herein include semiconductor devices and methods of forming such semiconductor devices. In an embodiment, a semiconductor device comprises a semiconductor channel, a source region adjacent to the semiconductor channel, and a drain region adjacent to the semiconductor channel. In an embodiment, the source region and the drain region each comprise a trench, a conformal silicide lining the trench, and a binary metallic alloy filling the trench.

A method of manufacturing a vertical metal-semiconductor field-effect transistor (MESFET) device is provided. The method includes forming a first oxide layer, forming a first electrode in the oxide layer, forming a crystallized silicon layer on the first electrode, forming a second electrode on the first oxide layer and on sidewalls of the crystalized silicon layer, forming a second oxide layer on upper surfaces of the second electrode. The method also includes forming a third electrode on an upper surface of the crystallized silicon layer.

A semiconductor device is described. The semiconductor device includes: a Si substrate having a first main surface; a plurality of gate trenches extending from the first main surface into the Si substrate; a semiconductor mesa between adjacent gate trenches; a first interlayer dielectric on the first main surface; a plurality of first metal contacts extending through the first interlayer dielectric and contacting gate electrodes disposed in the gate trenches; a plurality of second metal contacts extending through the first interlayer dielectric and contacting the semiconductor mesas; and an air gap or a dielectric material having a lower dielectric constant than the first interlayer dielectric between adjacent first and second metal contacts. Methods of producing the semiconductor device are also described.

A semiconductor structure, the semiconductor structure includes a substrate with a first conductivity type and a laterally diffused metal-oxide-semiconductor (LDMOS) device on the substrate, the LDMOS device includes a first well region on the substrate, and the first well region has a first conductivity type. A second well region with a second conductivity type, the second conductivity type is complementary to the first conductivity type, a source doped region in the second well region with the first conductivity type, and a deep drain doped region in the first well region, the deep drain doped region has the first conductivity type.

A semiconductor structure may include a first nanosheet field-effect transistor formed on a first portion of a substrate, a second nanosheet field-effect transistor formed on a second portion of the substrate, and one or more metal contacts. The first field-effect transistor formed on the first portion of a substrate may include a first source drain epitaxy. A top surface of the first source drain epitaxy may be above a top surface of a top-most nanosheet channel layer. The second nanosheet field-effect transistor formed on the second portion of the substrate may include a second source drain epitaxy and a third source drain epitaxy. The second source drain epitaxy may be below the third source drain epitaxy. The third source drain epitaxy may be u-shaped and may be connected to at least one nanosheet channel layer.

A semiconductor device includes an active fin protruding from a substrate; a plurality of channel layers on the active fin and spaced apart from each other in a vertical direction; a gate pattern intersecting the active fin and the plurality of channel layers; and source/drain regions on recessed regions of the active fin on both sides of the gate pattern. The gate pattern includes a gate dielectric layer, inner conductive layers, and a conductive liner. The inner conductive layers are disposed between the plurality of channel layers, and between the active fin and a lowermost channel layer among the plurality of channel layers. The conductive liner has a first thickness on an upper surface of an uppermost channel layer in the vertical direction, and at least one of the inner conductive layers have a second thickness in the vertical direction. The first thickness is less than the second thickness.

A semiconductor device includes a substrate, a semiconductor layer that is provided on the substrate and includes channel layers that are stacked, a source electrode and a drain electrode that are electrically connected to the channel layers, and gate electrodes that are provided between the source electrode and the drain electrode, are arranged in a direction intersecting with a direction from the source electrode to the drain electrode, and are embedded in the semiconductor layer so as to extend from a top face of the semiconductor layer to at least a channel layer closest to the substrate, wherein a width between two adjacent gate electrodes of the gate electrodes in a channel layer farther from the substrate of two channel layers of the channel layers, is narrower than a width between the two adjacent gate electrodes in a channel layer closer to the substrate of the two channel layers.

A semiconductor device includes: an active region extending on a substrate in a first direction; a plurality of semiconductor layers spaced apart from each other vertically on the active region, including a lower semiconductor layer and an uppermost semiconductor layer disposed above the lower semiconductor layer and having a thickness greater than that of the lower semiconductor layer; a gate structure extending on the substrate in a second direction, perpendicular to the first direction, and including a gate electrode at least partially surrounding each of the plurality of semiconductor layers; a spacer structure disposed on both sidewalls of the gate structure; and source/drain regions disposed on the active region on both sides of the gate structure and contacting the plurality of semiconductor layers.

A VDMOS device and a manufacturing method therefor. The method comprises: forming a groove in a semiconductor substrate, wherein the groove comprises a first groove area, a second groove area and a third groove area communicating with the first groove area and the second groove area, and the width of the first groove area is greater than the widths of the second groove area and the third groove area; forming an insulation layer on the semiconductor substrate; forming a first polycrystalline silicon layer on the insulation layer; removing some of the first polycrystalline silicon layer; the first polycrystalline silicon layer forming in the first groove being used as a first electrode of a deep gate; removing all the insulation layer located on the surface of the semiconductor substrate and some of the insulation layer located in the groove; forming a gate oxide layer on the semiconductor substrate; forming a second polycrystalline silicon layer on the gate oxide layer; removing some of the second polycrystalline silicon layer; and the second polycrystalline silicon layer forming in the groove being used as a second electrode of a shallow gate.