The present application discloses a semiconductor transistor structure, which includes: a substrate formed with a well region of a first conductive type, a gate structure being disposed on the substrate; a source/drain region of a second conductive type disposed in the well region of the first conductive type, the source region and the drain region being located on two sides of the gate structure respectively; a contact hole formed at a position corresponding to the source/drain region; and a conductive metal filled in the contact hole, the bottom of the contact hole being implanted with impurity ions for decreasing the contact resistance of the contact hole, and the impurity ion concentration at a peripheral region where the bottom of the contact hole comes into contact with the source/drain region being lower than the impurity ion concentration at a middle region.

A semiconductor device includes first and second channels, first and second gate structures, first and second source/drain layers, first and second fin spacers, and first and second etch stop patterns. The first channels are disposed vertically on a first region of a substrate. The second channels are disposed vertically on a second region of the substrate. The first gate structure is formed on the first region and covers the first channels. The second gate structure is formed on the second region and covers the second channels. The first and second source/drain layers contact the first and second channels, respectively. The first and second fin spacers contact sidewalls and upper surfaces of the first and second source/drain layers, respectively. The first and second etch stop patterns are formed on the first and second fin spacers, respectively, and do not contact the first and second source/drain layers, respectively.

A static random access memory (SRAM) cell includes a first gate and a second gate each extending in a first direction. A first gap separates the first gate from the second gate in the first direction. The SRAM cell includes a Vcc contact extending in the first direction. A second gap separates the Vcc contact and the first gate in a second direction perpendicular to the first direction. No segment of the Vcc contact overlaps with the first gap in the first direction. The SRAM cell includes a Vss contact extending in the first direction. A third gap separates the Vss contact from the first gate in the second direction. A segment of the Vss contact is disposed to the first gap. The Vss contact is smaller than the Vcc contact in the second direction.

The present disclosure provides a semiconductor device, a method for manufacturing the semiconductor device, and electronic equipment including the semiconductor device. According to embodiments, a semiconductor device may include a channel portion, source/drain portions in contact with the channel portion on opposite sides of the channel portion, and a gate stack intersecting the channel portion. The channel portion includes a first part extending in a vertical direction relative to the substrate and a second part extending from the first part in a lateral direction relative to the substrate.

A transistor includes a semiconductor substrate including a first active region, a second active region, and a semiconductor channel, a gate stack structure that overlies the semiconductor channel, a proximal dielectric material layer overlying the semiconductor substrate, laterally surrounding the gate stack structure, a distal dielectric material layer overlying the proximal dielectric material layer, and a first contact via structure contacting the first active region having a greater lateral extent at a level of the proximal dielectric material layer than at a level of the distal dielectric material layer.

A method of forming a semiconductor structure includes following steps. A first isolation is formed between a pair of active regions. A gate structure is formed on the first isolation structure. The active regions are etched to form recesses with curved top surfaces. The active regions are etched again to change each of the curved top surfaces to be a top surface and a sidewall substantially perpendicular to the top surface. A pair of contacts is formed respectively on the active regions, such that each of the contacts has a bottom surface and a sidewall substantially perpendicular to the bottom surface.

Disclosed is a semiconductor device including a semiconductor layer having a main surface, a first conductivity type drift region formed at a surface layer part of the main surface, a super junction region having a first conductivity type first column region and a second conductivity type second column region, a second conductivity type low resistance region formed at the surface layer part of the drift region and having an impurity concentration in excess of that of the second column region, a region insulating layer formed on the main surface and covering the low resistance region such as to cause part of the low resistance region to be exposed, a first pad electrode formed on the region insulating layer such as to overlap with the low resistance region, and a second pad electrode formed on the main surface and electrically connected to the second column region and the low resistance region.

A semiconductor device is described. The semiconductor device includes: a Si substrate having a first main surface; a plurality of gate trenches extending from the first main surface into the Si substrate; a semiconductor mesa between adjacent gate trenches; a first interlayer dielectric on the first main surface; a plurality of first metal contacts extending through the first interlayer dielectric and contacting gate electrodes disposed in the gate trenches; a plurality of second metal contacts extending through the first interlayer dielectric and contacting the semiconductor mesas; and an air gap or a dielectric material having a lower dielectric constant than the first interlayer dielectric between adjacent first and second metal contacts. Methods of producing the semiconductor device are also described.

A method may include forming a first silicon nitride layer in an opening of the semiconductor device and on a top surface of the semiconductor device, wherein the semiconductor device includes an epitaxial source/drain and a metal gate. The method may include forming a second silicon nitride layer on the first silicon nitride layer, as a sacrificial layer, and removing the second silicon nitride layer from sidewalls of the first silicon nitride layer formed in the opening. The method may include removing the second silicon nitride layer and the first silicon nitride layer formed at a bottom of the opening, and depositing a metal layer in the opening to form a metal drain in the opening of the semiconductor device.

A semiconductor device includes an active fin protruding from a substrate; a plurality of channel layers on the active fin and spaced apart from each other in a vertical direction; a gate pattern intersecting the active fin and the plurality of channel layers; and source/drain regions on recessed regions of the active fin on both sides of the gate pattern. The gate pattern includes a gate dielectric layer, inner conductive layers, and a conductive liner. The inner conductive layers are disposed between the plurality of channel layers, and between the active fin and a lowermost channel layer among the plurality of channel layers. The conductive liner has a first thickness on an upper surface of an uppermost channel layer in the vertical direction, and at least one of the inner conductive layers have a second thickness in the vertical direction. The first thickness is less than the second thickness.