Examples described herein relate to an avalanche photodiode (APD) and an optical receiver including the APD. The APD may include a substrate and a photon absorption region disposed on the substrate. The substrate may include a charge carrier acceleration region under the photon absorption region; a charge region adjacent to the charge carrier acceleration region; and a charge carrier multiplication region adjacent to the charge region. The charge carrier acceleration region, the charge region, and the charge carrier multiplication region are laterally formed in the substrate. When a biasing voltage is applied to the optoelectronic device, photon-generated free charge carriers may be generated in the photon absorption region and are diffused into the charge carrier acceleration region. The charge carrier acceleration region is configured to accelerate the photon-generated free charge carriers prior to the photon-generated free charge carriers entering into the charge region and undergoing impact ionization in the charge carrier multiplication region.

An opto-electronic device includes a base portion, a first electrode and a second electrode formed on an upper surface of the base portion apart from each other, a quantum dot layer, and a bank structure. The quantum dot layer is between the first electrode and the second electrode on the base portion and includes a plurality of quantum dots. The bank structure covers at least partial regions of the first electrode and the second electrode, defines a region where the quantum dot layer is formed, and is formed of an inorganic material.

A photosensitive element includes a first film layer, a second film layer and a third film layer. The first film layer, the second film layer and the third film layer are in a sequentially stacked structure, the first film layer is a p-type copper indium gallium selenide (CIGS) layer, the second film layer is an i-type CIGS layer, and the third film layer is an n-type film layer, and the first film layer, the second film layer and the third film layer form a PIN junction structure.

A photosensitive element includes a first film layer, a second film layer and a third film layer. The first film layer, the second film layer and the third film layer are in a sequentially stacked structure, the first film layer is a p-type copper indium gallium selenide (CIGS) layer, the second film layer is an i-type CIGS layer, and the third film layer is an n-type film layer, and the first film layer, the second film layer and the third film layer form a PIN junction structure.

A device which detects and/or emits infrared radiation in the mid-infrared to far- infrared region is disclosed herein. The device comprises a first layer comprising a first transition metal dichalcogenide, and a second layer comprising a second transition metal dichalcogenide, wherein the second layer is deposited adjacent to the first layer to form a first interface which interlayer excitons are producible from for rendering the device operable to detect and/or emit infrared radiation in the mid-infrared to far-infrared region.

A device which detects and/or emits infrared radiation in the mid-infrared to far- infrared region is disclosed herein. The device comprises a first layer comprising a first transition metal dichalcogenide, and a second layer comprising a second transition metal dichalcogenide, wherein the second layer is deposited adjacent to the first layer to form a first interface which interlayer excitons are producible from for rendering the device operable to detect and/or emit infrared radiation in the mid-infrared to far-infrared region.

According to one embodiment, a solar cell includes a first electrode, a second electrode, a photoelectric conversion layer, and a plurality of insulants. The photoelectric conversion layer is provided between the first electrode and the second electrode. The plurality of insulants is disposed on a face of the first electrode. The face faces the second electrode. Any adjacent two of the plurality of insulants are disposed with a void interposed between the adjacent two.

A photodetector device to act as an artificial photonic synapse includes a substrate and a perovskite quantum dot-multiwall carbon nanotube (PQD-MWCNT) hybrid material. The PQD-MWCNT hybrid material channel is disposed on the substrate between a first electrode and a second electrode and forms a PQD-MWCNT channel. The PDQs comprise a methylammonium lead bromide material. A method of operating the photodetector device as an artificial photonic synapse includes applying a presynaptic signal as stimuli as one or more light pulses on the PQD-MWCNT channel between the first electrode and the second electrode. A current across the PQD-MWCNT channel is measured to represent a postsynaptic signal.

A radiation sensor includes a radiation-sensitive semiconductor layer, a cathode electrode disposed over a front side of the radiation-sensitive semiconductor layer that is configured to be exposed to radiation, at least one anode electrode disposed over a backside of the radiation-sensitive semiconductor layer, and a potential barrier layer located between the cathode electrode and the front side of the radiation-sensitive semiconductor layer.

The present disclosure provides a semiconductor heterojunction. The semiconductor heterojunction includes a bottom semiconductor, a top semiconductor and an electrode substrate. An upper surface of the bottom semiconductor includes a first facet. A lower surface of the top semiconductor includes a second facet, and the lower surface of the top semiconductor is contacted with the upper surface of the bottom semiconductor. The electrode substrate is disposed below the bottom semiconductor.