A decrease in an insulation resistance between a separation region at a boundary between pixels and a wiring layer is prevented. A light receiving element includes the pixels, the separation region, the wiring layer, and a wiring layer protective film. The pixels included in the light receiving element have photoelectric conversion units, each photoelectric conversion unit being disposed in a semiconductor substrate to perform photoelectric conversion of incident light. The separation region included in the light receiving element is disposed at a boundary between the photoelectric conversion units and separates the photoelectric conversion units from each other. The wiring layer included in the light receiving element is wired to the pixels. The wiring layer protective film included in the light receiving element is disposed between the separation region and the wiring layer to protect the wiring layer.

A photoelectric conversion apparatus includes an avalanche diode arranged in a semiconductor layer having a first surface and a second surface facing the first surface. The avalanche diode includes a first semiconductor region of a first conductivity type, which is arranged at a first depth, a second semiconductor region of a second conductivity type, which is arranged at a second depth deeper than the first depth with respect to the second surface, a third semiconductor region provided in contact with an end of the first semiconductor region in a planar view from the second surface, a first wiring portion connected to the first semiconductor region, and a second wiring portion connected to the second semiconductor region. In a planar view from the second surface, at least part of a boundary between an insulating film and the second wiring portion that faces the first wiring portion overlaps the third semiconductor region and does not overlap the first semiconductor region.

A photoelectric conversion apparatus includes an avalanche diode arranged in a semiconductor layer having a first surface and a second surface facing the first surface. The avalanche diode includes a first semiconductor region of a first conductivity type, which is arranged at a first depth, a second semiconductor region of a second conductivity type, which is arranged at a second depth deeper than the first depth with respect to the second surface, a third semiconductor region provided in contact with an end of the first semiconductor region in a planar view from the second surface, a first wiring portion connected to the first semiconductor region, and a second wiring portion connected to the second semiconductor region. In a planar view from the second surface, at least part of a boundary between an insulating film and the second wiring portion that faces the first wiring portion overlaps the third semiconductor region and does not overlap the first semiconductor region.

Structures for a photodetector or terminator and methods of fabricating a structure for a photodetector or terminator. The structure includes a waveguide core having a longitudinal axis, a pad connected to the waveguide core, and a light-absorbing layer on the pad adjacent to the waveguide core. The light-absorbing layer includes an annular portion, a first taper, and a second taper laterally spaced from the first taper. The first taper and the second taper are positioned adjacent to the waveguide core.

An integrated circuit includes a photodetector that has an epitaxial layer with a first conductivity type located over a substrate. A buried layer of the first conductivity type is located within the epitaxial layer and has a higher carrier concentration than the epitaxial layer. A semiconductor layer located over the buried layer has an opposite second conductivity type and includes a first sublayer over the buried semiconductor layer and a second sublayer between the first sublayer and the buried layer. The first sublayer has a larger lateral dimension than the second sublayer, and has a lower carrier concentration than the second sublayer.

An integrated circuit includes a photodetector that has an epitaxial layer with a first conductivity type located over a substrate. A buried layer of the first conductivity type is located within the epitaxial layer and has a higher carrier concentration than the epitaxial layer. A semiconductor layer located over the buried layer has an opposite second conductivity type and includes a first sublayer over the buried semiconductor layer and a second sublayer between the first sublayer and the buried layer. The first sublayer has a larger lateral dimension than the second sublayer, and has a lower carrier concentration than the second sublayer.

The photoelectric conversion device includes a semiconductor layer provided with an avalanche photodiode, and an interconnection structure layer provided on a side of a first surface of the semiconductor layer. The interconnection structure layer includes an interconnection structure made of a metal material and overlapping with the avalanche multiplication region of the avalanche photodiode in a plan view. The interconnection structure includes a first interconnection, a second interconnection disposed farther from the first surface than the first interconnection, and a contact electrode electrically connecting the first interconnection and the second interconnection. An opening is provided in the first interconnection in a portion overlapping with the avalanche multiplication region in the plan view. The second interconnection is disposed so as to overlap an entire of the opening in the plan view. The contact electrode is arranged around the opening in the plan view.

The photoelectric conversion device includes a semiconductor layer provided with an avalanche photodiode, and an interconnection structure layer provided on a side of a first surface of the semiconductor layer. The interconnection structure layer includes an interconnection structure made of a metal material and overlapping with the avalanche multiplication region of the avalanche photodiode in a plan view. The interconnection structure includes a first interconnection, a second interconnection disposed farther from the first surface than the first interconnection, and a contact electrode electrically connecting the first interconnection and the second interconnection. An opening is provided in the first interconnection in a portion overlapping with the avalanche multiplication region in the plan view. The second interconnection is disposed so as to overlap an entire of the opening in the plan view. The contact electrode is arranged around the opening in the plan view.

A light sensing device including a first conductivity type buried layer, a second conductivity type well, and a first conductivity type well is provided. The second conductivity type well is on the first conductivity type buried layer. The first conductivity type well is on the second conductivity type well and surrounded by the second conductivity type well.

A light sensing device including a first conductivity type buried layer, a second conductivity type well, and a first conductivity type well is provided. The second conductivity type well is on the first conductivity type buried layer. The first conductivity type well is on the second conductivity type well and surrounded by the second conductivity type well.