An electromagnetic wave detector 100 comprises: a substrate 5 having a front surface and a back surface; an insulating layer 4 formed of a rare earth oxide, which is provided on the front surface of the substrate 5; a pair of electrodes 2 provided on the insulating layer 4 so as to be arranged to face each other across a gap; and a two-dimensional material layer 1 provided on the insulating layer 4 so as to be electrically connected to the pair of electrodes 2. The rare earth oxide contains a base material made of an oxide of a first rare earth element, and a second rare earth element different from the first rare earth element, which is activated in the base material.

An active pattern structure includes a lower active pattern protruding from an upper surface of a substrate in a vertical direction substantially perpendicular to an upper surface of the substrate, a buffer structure on the lower active pattern, at least a portion of which may include aluminum silicon oxide, and an upper active pattern on the buffer structure.

Provided are a light-receiving element which has more capability of detecting wavelengths than that of existing silicon light-receiving elements and a unit pixel of an image sensor by using it. The light-receiving element includes: a light-receiving unit which is floated or connected to external voltage and absorbs light; an oxide film which is formed to come in contact with a side of the light-receiving unit; a source and a drain which stand off the light-receiving unit with the oxide film in between and face each other; a channel which is formed between the source and the drain and forms an electric current between the source and the drain; and a wavelength expanding layer which is formed in at least one among the light-receiving unit, the oxide film and the channel and forms a plurality of local energy levels by using strained silicon.

Provided are a light-receiving element which has more capability of detecting wavelengths than that of existing silicon light-receiving elements and a unit pixel of an image sensor by using it. The light-receiving element includes: a light-receiving unit which is floated or connected to external voltage and absorbs light; an oxide film which is formed to come in contact with a side of the light-receiving unit; a source and a drain which stand off the light-receiving unit with the oxide film in between and face each other; a channel which is formed between the source and the drain and forms an electric current between the source and the drain; and a wavelength expanding layer which is formed in at least one among the light-receiving unit, the oxide film and the channel and forms a plurality of local energy levels by using strained silicon.

The present application provides a control component, a display screen, and a control device. The control component is integrated in a display screen and includes a substrate and a light control structure and a touch control structure arranged side by side on the substrate; the light control structure includes a signal input line, a signal output line, and a photosensitive circuit electrically connected between the signal input line and the signal output line; the touch control structure includes a plurality of receiving electrodes and a plurality of transmitting electrodes; and the receiving electrodes are multiplexed as the signal output line.

The present application provides a control component, a display screen, and a control device. The control component is integrated in a display screen and includes a substrate and a light control structure and a touch control structure arranged side by side on the substrate; the light control structure includes a signal input line, a signal output line, and a photosensitive circuit electrically connected between the signal input line and the signal output line; the touch control structure includes a plurality of receiving electrodes and a plurality of transmitting electrodes; and the receiving electrodes are multiplexed as the signal output line.

A device for sensing light includes a first semiconductor region doped with a dopant of a first type and a second semiconductor region doped with a dopant of a second type. The second semiconductor region is positioned above the first semiconductor region. The device includes a gate insulation layer; a gate, a source, and a drain. The second semiconductor region has a top surface that is positioned toward the gate insulation layer and a bottom surface that is positioned opposite to the top surface of the second semiconductor region. The second semiconductor region has an upper portion that includes the top surface of the second semiconductor region and a lower portion that includes the bottom surface of the second semiconductor region and is mutually exclusive with the upper portion. The first semiconductor region is in contact with both the upper portion and the lower portion of the second semiconductor region.

One embodiment provides a line of sight detector. The line of sight detector includes a first TeraFET (field effect transistor) including a first source, a first drain, a first gate, and a first channel having a first end and a second end. The line of sight detector further includes a first source antenna coupled to the first source; a first drain antenna coupled to the first drain; and a third antenna. Each antenna is configured to receive an incident radiation signal having a frequency in a sub terahertz or a terahertz frequency range. Each antenna is positioned a respective distance from each other antenna. Each distance is less than one wavelength of the incident radiation signal.

The various embodiments described herein include methods, devices, and systems for fabricating and operating transistors. In one aspect, a transistor includes: (1) a semiconducting component configured to operate in an on state at temperatures above a semiconducting threshold temperature; and (2) a superconducting component configured to operate in a superconducting state while: (a) a temperature of the superconducting component is below a superconducting threshold temperature; and (b) a first current supplied to the superconducting component is below a current threshold; where: (i) the semiconducting component is located adjacent to the superconducting component; and (ii) in response to a first input voltage, the semiconducting component is configured to generate an electromagnetic field sufficient to lower the current threshold such that the first current exceeds the lowered current threshold, thereby transitioning the superconducting component to a non-superconducting state.

A light emitting transducer including a flexible sheet having a bottom side and a top side, the flexible sheet including a substrate that is stretchable and compressible, the substrate having a bottom substrate surface at the bottom side, and a top substrate surface facing towards the top side, the top substrate surface comprising a surface pattern of a plurality of raised and depressed micro-scale surface portions which extend in at least one direction; a light emitting diode layer above the substrate and conforming in shape to the top substrate surface, the light emitting diode layer corresponding with the surface pattern of the top substrate surface, wherein the light emitting diode layer has a bottom diode surface facing towards the bottom side, and a top diode surface facing towards the top side, a bottom electrode on the bottom diode surface, and a top electrode on the top diode surface.