An opto-electronic device includes a base portion, a first electrode and a second electrode formed on an upper surface of the base portion apart from each other, a quantum dot layer, and a bank structure. The quantum dot layer is between the first electrode and the second electrode on the base portion and includes a plurality of quantum dots. The bank structure covers at least partial regions of the first electrode and the second electrode, defines a region where the quantum dot layer is formed, and is formed of an inorganic material.

An optical device useful for spatial light modulation. The device comprises: a semiconductor layer having a first surface and a second surface, the semiconductor having an electric field-dependent resonance wavelength; a first electrode electrically connected to the semiconductor layer; a first insulating layer adjacent to the first surface of the semiconductor layer, and a second insulating layer adjacent to the second surface of the semiconducting layer, the first and the second insulating layers each being optically transparent at the resonance wavelength; a first group of at least one gate electrodes disposed adjacent to the first insulating layer, and a second group of at least one gate electrodes disposed adjacent to the second insulating layer, each gate electrode being at least 80% optically transparent at the resonance wavelength; wherein the first and the second groups of gate electrodes, taken together, form at least two regions in the semiconductor layer, an electrostatic field in each of the at least two regions being independently controllable by application of voltage to the first and the second groups of gate electrodes, the at least two regions abutting each other along at least one boundary.

A photosensitive module is provided. The photosensitive module includes a base, an integrated package substrate, and a photosensitive element. The integrated package substrate is connected to the base. The integrated package substrate has a plurality of first electronic components, and the first electronic components are housed inside the integrated package substrate without being exposed to external environment. The photosensitive element is connected to the base, and the photosensitive element is configured to receive a light beam traveling along an optical axis.

Crystalline material, phototransistor, and methods of fabrication thereof. The crystalline material comprising a plurality of stacked two-dimensional black phosphorous carbide layers.

A first wafer of semiconductor material has a surface. A second wafer of semiconductor material includes a substrate and a structural layer on the substrate. The structural layer integrates a detector device for detecting electromagnetic radiation. The structural layer of the second wafer is coupled to the surface of the first wafer. The substrate of the second wafer is shaped to form a stator, a rotor, and a mobile mass of a micromirror. The stator and the rotor form an assembly for capacitively driving the mobile mass.

A transistor includes (i) a first wire including a semiconducting component configured to operate in an on state at temperatures above a semiconducting threshold temperature and (ii) a second wire including a superconducting component configured to operate in a superconducting state while: a temperature of the superconducting component is below a superconducting threshold temperature and a first input current supplied to the superconducting component is below a current threshold. The semiconducting component is located adjacent to the superconducting component. In response to a first input voltage, the semiconducting component is configured to generate an electromagnetic field sufficient to lower the current threshold such that the first input current exceeds the lowered current threshold.

[Object] To stably form a low-resistance electrical coupling between a metal and a semiconductor. [Solution] An electrical coupling structure includes: a semiconductor layer; a metal layer; and an intermediate layer that is held between the semiconductor layer and the metal layer, and includes an insulating layer provided on the semiconductor layer side and a two-dimensional material layer provided on the metal layer side.

An electromagnetic wave detector includes: an insulating film having a first surface and a second surface facing the first surface; a first layer to perform photoelectric conversion by an incident electromagnetic wave and change in potential, the first layer being made of a first two-dimensional atomic layer material; and a second layer to receive the change in potential through the first insulating film and generate change in electrical quantity, the second layer being made of a second two-dimensional atomic layer material and provided on the first surface. In this manner, the sensitive electromagnetic wave detector detecting an incident electromagnetic wave as change in electrical quantity and having high response speed to an incident electromagnetic wave can be provided.

An electromagnetic wave detector includes: an insulating film having a first surface and a second surface facing the first surface; a first layer to perform photoelectric conversion by an incident electromagnetic wave and change in potential, the first layer being made of a first two-dimensional atomic layer material; and a second layer to receive the change in potential through the first insulating film and generate change in electrical quantity, the second layer being made of a second two-dimensional atomic layer material and provided on the first surface. In this manner, the sensitive electromagnetic wave detector detecting an incident electromagnetic wave as change in electrical quantity and having high response speed to an incident electromagnetic wave can be provided.

A method of manufacturing a semiconductor device includes forming a plurality of fin structures extending in a first direction over a semiconductor substrate. Each fin structure includes a first region proximate to the semiconductor substrate and a second region distal to the semiconductor substrate. An electrically conductive layer is formed between the first regions of a first adjacent pair of fin structures. A gate electrode structure is formed extending in a second direction substantially perpendicular to the first direction over the fin structure second region, and a metallization layer including at least one conductive line is formed over the gate electrode structure.