According to embodiments of the present disclosure, a dynamic photodiode may include a substrate including a major surface; a hedge formation extruding perpendicularly from the major surface; a first resettable region disposed on a top surface the hedge formation; a second resettable region disposed on the top surface of the hedge formation; a first doped region disposed on the top surface of the hedge formation between the first resettable region and the second resettable region, the first doped region including a first contact configured to receive a first voltage; and a second doped region disposed on a top surface of the hedge formation, the second doped region including a second contact configured to receive a second voltage. Exposed portions of the substrate form light absorbing regions configured to generate electron-hole pairs in the substrate.

An image sensing device is disclosed. The image sensing device includes a semiconductor substrate including an active region, a first impurity region and a second impurity region formed in the active region, a photoelectric conversion region disposed over the semiconductor substrate to be directly coupled to the first impurity region and configured to generate photocharges in response to incident light and transmit the generated photocharges to the first impurity region, a switching element disposed coupled to the first impurity region and the second impurity region and configured to transmit the photocharges stored in the first impurity region to the second impurity region, an insulation structure disposed on sides of the photoelectric conversion region and a plurality of conductive lines disposed in the insulation structure and configured to read out an electrical image signal corresponding to the photocharges generated by the photoelectric conversion region.

A phototransistor device to act as an artificial photonic synapse includes a substrate and a graphene source-drain channel patterned on the substrate. A perovskite quantum dot layer is formed on the graphene source-drain channel. The perovskite quantum dot layer is methylammonium lead bromide material. A method of operating the phototransistor device as an artificial photonic synapse includes applying a first fixed voltage to a gate of the phototransistor and a second fixed voltage across the graphene source-drain channel. A presynaptic signal is applied as stimuli across the graphene source-drain channel. The presynaptic signal includes one or more pulses of light or electrical voltage. A current across the graphene source-drain channel is measured to represent a postsynaptic signal.

A thin-film transistor (TFT) photodetector for a display panel is provided. The TFT photodetector includes an amorphous transparent substrate used as the display panel, a source formed of amorphous silicon or polycrystalline silicon on the transparent substrate, a drain formed of amorphous silicon or polycrystalline silicon, opposite to the source on the transparent substrate, an active layer formed between the source and the drain and having a current channel formed between the source and the drain, an insulating oxide film formed on the source, the drain, and the active layer, and a light receiving part formed on the insulating oxide film and configured to absorb light. When light is incident on the light receiving part, electrons migrate by tunneling through the insulating oxide film between the light receiving part and the active layer which have been excited with the insulating oxide film in between, the amount of charge in the light receiving part is changed by the migration of the electrons, a threshold voltage of the current channel is changed due to the change of the amount of charge, and photocurrent flows through the current channel due to the change of the threshold voltage.

An optical system is provided and includes a fixed assembly, an optical module, a first movable assembly and a first driving assembly. The optical module has an optical axis. The first movable assembly is configured to be connected to the optical module. The first driving assembly is configured to drive the first movable assembly to move relative to the fixed assembly, and a gap is formed between the first movable assembly and the fixed assembly.

The disclosure provides a display panel and a manufacturing method thereof. The method includes: forming a main gate and a sub-gate on a glass substrate, wherein at least a portion of the sub-gate includes a light transmissive area; sequentially forming a gate insulating layer, a semiconductor layer, and a second metal layer on the sub-gate, patterning the semiconductor layer to obtain a main active layer and a sub-active layer, and patterning the second metal layer to obtain a main source/drain and a sub-source/drain.

A dynamic photodiode may comprise a substrate comprising a first surface opposite a second surface, the substrate being of a first doping type; a substrate region disposed on the first surface, the substrate region comprising a substrate contact configured to be grounded; a first doped region disposed on the first surface, the first doped region being of the first doping type and comprising a first contact configured to receive a first voltage; a second doped region disposed on the first surface, the second doped region being of a second doping type opposite to the first doping type and comprising a second contact configured to receive a second voltage. The substrate region may surround the second doped region, the second doped region may surround the first doped region, and exposed portions of the substrate form light absorbing regions may be configured to generate electron-hole pairs in the substrate.

A display module and a method for monitoring backlight brightness are provided in the present disclosure. The display module includes a display region including an opening region and a non-opening region. The display module includes a backlight module and an array substrate. The array substrate is at a light-exiting side of the backlight module. The array substrate includes a plurality of gate lines which extends along a first direction and is arranged along a second direction, and further includes a plurality of data signal lines which is arranged along the first direction and extends along the second direction. The array substrate further includes a first substrate and at least one photosensitive unit, where the photosensitive unit is at a side of the first substrate away from the backlight module; and the photosensitive unit is disposed at the non-opening region for sensing a luminous brightness of the backlight module.

A display panel includes a plurality of sub-pixels, and an image capturing assembly including a plurality of photoelectric converters and an image integrator electrically coupled to each photoelectric converter. At least one sub-pixel contains one photoelectric converter. Each photoelectric converter can convert an optical signal from an outside light reaching thereonto into an electrical signal. The image integrator can receive the electrical signal from each photoelectric converter to thereby build an image based thereupon. The display panel further includes a substrate, and a color filter layer disposed over the substrate and including a plurality of color blocks, each of a primary color and corresponding to one sub-pixel. The photoelectric converters are each disposed between the substrate and the color filter layer. Each photoelectric converter can convert an optical signal from an outside light entering through one of the plurality of color blocks into an electrical signal.

An infrared detection film includes a gate electrode, a gate insulating layer, a majority-carrier channel layer, at least one drain terminal, at least one source terminal, and a photovoltaic semiconductor layer. The gate insulating layer is formed on the gate electrode. The majority-carrier channel layer is formed on the gate insulating layer. Each of the at least one drain terminal and the at least one source terminal is disposed on the majority-carrier channel layer and is spaced apart from the gate electrode. The photovoltaic semiconductor layer is disposed on an exposed portion of the majority-carrier channel layer exposed between the at least one drain terminal and the at least one source terminal.