Patent classifications
H01L33/504
CONVERTER WITH GLASS LAYERS
A wavelength converting layer may have a glass or a silicon porous support structure. The wavelength converting layer may also have a cured portion of wavelength converting particles and a binder laminated onto the porous glass or silicon support structure.
ELECTRONIC DEVICE
An electronic device includes a substrate, a first light-emitting unit, a first light conversion unit, and a first buffer layer. The first light-emitting unit is disposed on the substrate. The first light conversion unit is disposed on the first light-emitting unit. The first buffer layer is disposed between the first light conversion unit and the first light-emitting unit. The thickness of the first light conversion unit is greater than the thickness of the first light-emitting unit.
Phosphor layer for micro-LED applications
Embodiments include a device having a micro-LED that includes at least two, individually addressable light emitting diodes on a same substrate; a phosphor converter layer disposed on the micro-LED, the phosphor converter layer including phosphor particles having a D50 of greater than 1 μm and less than 10 μm.
Display Device
A display device according to an embodiment of the present disclosure includes a substrate on which a plurality of sub-pixels are defined, a plurality of LEDs disposed in each of the plurality of sub-pixels, and a plurality of color conversion layers covering the plurality of LEDs. The plurality of color conversion layers each include a plurality of color conversion material layers that are stacked to be spaced apart from each other. Accordingly, according to the present disclosure, it is possible to minimize or reduce light lost inside the color conversion layer by separating the plurality of color conversion material layers from each other, and improve color conversion efficiency and luminance.
Optoelectronic component and method for producing an optoelectronic component
An optoelectronic component and a method for producing an optoelectronic component are disclosed. In an embodiment an optoelectronic component includes a semiconductor chip including a plurality of pixels, each pixel configured to emit electromagnetic primary radiation from a radiation exit surface and conversion layers located on at least a part of the radiation exit surfaces, wherein the conversion layers comprise a crosslinked matrix having a three-dimensional siloxane-based network and at least one phosphor embedded in the matrix, and wherein the conversion layers have a thickness of ≤30 μm.
DISPLAY APPARATUS
A display apparatus includes: a circuit substrate; and a pixel array on the circuit substrate and including a plurality of pixels. The pixel array includes: light emitting diode (LED) cells constituting the plurality of pixels, each of the LED cells including a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer; wavelength converters on the LED cells; an upper semiconductor layer on the LED cells and having a partition structure; a passivation layer on side surfaces of the LED cells; a first electrode along a region of the LED cells to have a grid shape; second electrodes connected to the second conductivity-type semiconductor layers; and reflective layers between the first electrode and the second electrode along the passivation layer on the side surfaces of the LED cells and having surfaces inclined toward outside of the LED cells.
DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME
A display device includes: a substrate; a first pixel electrode on the substrate; a second pixel electrode on the substrate and spaced apart from the first pixel electrode; a first light emitting element on the first pixel electrode and configured to emit first light; a first connection electrode on the second pixel electrode; a first partition wall between a side surface of the first light emitting element and a side surface of the first connection electrode; a second light emitting element on the first connection electrode and configured to emit second light; and a common electrode on an upper surface of the first light emitting element and an upper surface of the second light emitting element.
Display Device
The present disclosure relates to a display device, including at least one or more light sources disposed for each pixel and a light conversion layer disposed on the light source to convert a wavelength of light generated from the light source, wherein the light conversion layer includes a perovskite matrix and quantum dots.
DISPLAY DEVICE
According to aspects of the present disclosure, a display device includes a stretchable lower substrate; a pattern layer which is disposed on the lower substrate and is configured by a plurality of plate patterns and a plurality of line patterns; a plurality of pixels which is disposed on each of the plurality of plate patterns; and a plurality of connection lines which is disposed on each of the plurality of line patterns and connects the plurality of pixels, each of the plurality of pixels includes a light emitting diode and a driving element which drives the light emitting diode, the light emitting diode is divided into an emission area in which light is emitted and a non-emission area in which light is not emitted, a color conversion layer is disposed below the emission area of the light emitting diode, and a color transmission layer is disposed on the emission area of the light emitting diode, thereby improving the luminous efficiency of the light emitting diode.
LED display screen module
An LED display screen module includes a module substrate and a plurality of LED package structures. The LED package structures are disposed on the module substrate and arranged into an array. Each of the LED package structures includes a plurality of pixels and a packaging layer. The pixels are spaced apart from each other. The packaging layer includes a plurality of packaging portions and a plurality of connecting portions. The packaging portions respectively cover the pixels, and each of the connecting portions is connected between the adjacent two packaging portions. Each of the packaging portions has an upper light emitting surface and a lateral light emitting surface. The upper light emitting surface is a flat surface and is connected to the lateral light emitting surface via a transitional curved surface.