The present disclosure provides a method for forming an interconnect structure, including forming an N.sup.th metal line principally extending in a first direction, forming a sacrificial bilayer over the N.sup.th metal line, forming a dielectric layer over the sacrificial bilayer, removing a portion of the sacrificial bilayer, forming a conductive post in the sacrificial bilayer, wherein the conductive post having a top pattern coplanar with a top surface of the sacrificial bilayer and a bottom pattern in contact with a top surface of the N.sup.th metal line, and forming an N.sup.th metal via over the sacrificial bilayer.

A method of forming a device that includes encapsulating a magnetic resistive access memory (MRAM) stack with a first patternable low-k dielectric material that is patterned by an exposure to produce a via pattern that extends to circuitry to logic devices. The via pattern is developed forming a via opening. The method further includes forming a second patternable low-k dielectric material over first patternable low-k dielectric material and filling the via opening. The second patternable low-k dielectric material is patterned by a light exposure to produce a first line pattern to the MRAM stack and a second line pattern to the via opening. The first line pattern and the second line pattern are developed to form trench openings. Thereafter, electrically conductive material is formed in the trench openings and the via opening.

A method of forming a device that includes encapsulating a magnetic resistive access memory (MRAM) stack with a first patternable low-k dielectric material that is patterned by an exposure to produce a via pattern that extends to circuitry to logic devices. The via pattern is developed forming a via opening. The method further includes forming a second patternable low-k dielectric material over first patternable low-k dielectric material and filling the via opening. The second patternable low-k dielectric material is patterned by a light exposure to produce a first line pattern to the MRAM stack and a second line pattern to the via opening. The first line pattern and the second line pattern are developed to form trench openings. Thereafter, electrically conductive material is formed in the trench openings and the via opening.

A method of forming a device that includes encapsulating a magnetic resistive access memory (MRAM) stack with a first patternable low-k dielectric material that is patterned by a exposure to produce a via pattern that extends to circuitry to logic devices. The via pattern is developed forming a via opening. The method further includes forming a second patternable low-k dielectric material over first patternable low-k dielectric material and filling the via opening. The second patternable low-k dielectric material is patterned by a light exposure to produce a first line pattern to the MRAM stack and a second line pattern to the via opening. The first line pattern and the second line pattern are developed to form trench openings. Thereafter, electrically conductive material is formed in the trench openings and the via opening.

A semiconductor device is provided. The semiconductor device can have a substrate including dielectric material. A plurality of narrow interconnect openings can be formed within said dielectric material. In addition, a plurality of wide interconnect openings can be formed within said dielectric material. The semiconductor device can include a first metal filling the narrow interconnect openings to form an interconnect structure and conformally covering a surface of the wide interconnect openings formed in the dielectric material, and a second metal formed over the first metal and encapsulated by the first metal to form another interconnect structure within the wide interconnect openings.

A semiconductor device is provided. The semiconductor device can have a substrate including dielectric material. A plurality of narrow interconnect openings can be formed within said dielectric material. In addition, a plurality of wide interconnect openings can be formed within said dielectric material. The semiconductor device can include a first metal filling the narrow interconnect openings to form an interconnect structure and conformally covering a surface of the wide interconnect openings formed in the dielectric material, and a second metal formed over the first metal and encapsulated by the first metal to form another interconnect structure within the wide interconnect openings.

A semiconductor device includes a first conductive element, a first insulating layer and a second insulating layer sequentially disposed on the first conductive element, a conductive via passing through the first insulating layer and the second insulating layer. The conductive via is connected to the first conductive element. The semiconductor device includes a via extension portion disposed in the second insulating layer that extends along an upper surface of the first insulating layer from one side surface of the conductive via, and a second conductive element disposed on the second insulating layer that is connected to the via extension portion.

Some embodiments relate to a semiconductor device disposed on a semiconductor substrate. A dielectric structure is arranged over the semiconductor substrate. First and second metal vias are disposed in the dielectric structure and spaced laterally apart from one another. First and second metal lines are disposed in the dielectric structure and have nearest neighboring sidewalls that are spaced laterally apart from one another by a portion of the dielectric structure. The first and second metal lines contact upper portions of the first and second metal vias, respectively. First and second air gaps are disposed in the portion of the dielectric structure. The first and second air gaps are proximate to nearest neighboring sidewalls of the first and second metal lines, respectively.

A method for manufacturing an interconnect structure is provided, and the method is as below. A dielectric layer is deposited over a substrate. The dielectric layer is etched to form a recess. A dummy adhesion layer is deposited on sidewalls of the recess. A conductive layer is formed in the recess. The dummy adhesion layer is removed to expose a portion of the conductive layer.

A method of protecting a dielectric during fabrication is provided. A conductive layer is patterned to form a first conductive shape on a first portion of a dielectric layer and a second conductive shape on a second portion of the dielectric layer. A conductive trace is formed over at least a portion of the second conductive shape. The conductive trace electrically connects the first conductive shape with a substrate tie. An interconnect layer is coupled to the first conductive shape. The conductive trace is etched to electrically isolate the first conductive shape from the substrate tie.