Power amplifiers, amplifier systems, and related methods are disclosed herein. In one example embodiment, the amplifier system includes a bias controller that automatically sets a bias voltage of a power amplifier device by monitoring a reference device that is in a scaled relationship with the power amplifier device, and integrally is formed with the power amplifier device on a same semiconductor die. The bias controller can compare a voltage at an input to the reference device to a reference voltage, and then adjust a voltage at a control input of the reference device to a stabilized voltage that induces the reference device to drive the voltage at the input to the reference device equal to the reference voltage. Finally, the bias controller can transform, based on the scaled relationship, the stabilized voltage into a bias voltage applied to a control input of the power amplifier device.

Power amplifiers, amplifier systems, and related methods are disclosed herein. In one example embodiment, the amplifier system includes a bias controller that automatically sets a bias voltage of a power amplifier device by monitoring a reference device that is in a scaled relationship with the power amplifier device, and integrally is formed with the power amplifier device on a same semiconductor die. The bias controller can compare a voltage at an input to the reference device to a reference voltage, and then adjust a voltage at a control input of the reference device to a stabilized voltage that induces the reference device to drive the voltage at the input to the reference device equal to the reference voltage. Finally, the bias controller can transform, based on the scaled relationship, the stabilized voltage into a bias voltage applied to a control input of the power amplifier device.

A high peak bandwidth I/O channel embedded within a multilayer surface interface that forms the bus circuitry electrically interfacing the output or input port on a first semiconductor die with the input or output port on a second semiconductor die.

Apparatuses and methods for providing inductance are disclosed. In one embodiment, a method for providing an inductor includes forming an electrical circuit on a substrate, forming a seal ring around the perimeter of the electrical circuit, providing a break in at least one layer of the seal ring, and electrically connecting the seal ring such that the seal ring operates as an inductor.

Systems and methods are disclosed for integrating functional components of front-end modules for wireless radios. Front-end modules disclosed may be dual-band front-end modules for use in 802.11ac-compliant devices. In certain embodiments, integration of front-end module components on a single die is achieved by implementing a high-resistivity layer or substrate directly underneath, adjacent to, and/or supporting SiGe BiCMOS technology elements.

This disclosure relates to methods of forming bipolar transistors, such as heterojunction bipolar transistors. The methods may include forming a sub-collector over a substrate, forming a first portion of a collector over the sub-collector and doping a second portion of the collector to form a doping spike. The method may further include forming a third portion of the collector over the doping spike and forming a base of the bipolar transistor over the third portion of the collector.

The present invention relates to a push-pull amplifying unit and a Doherty amplifier. The push-pull amplifying unit comprises a first amplifier, a second amplifier, a first shunt inductor, and a second shunt inductor. The first and second shunt inductors have mutually connected second terminals and are inductively coupled to increase the impedance between the first output and the virtual ground and the impedance between the second output and the virtual ground at a fundamental frequency of a signal to be amplified by the push-pull amplifying unit relative to those impedances in the absence of said inductive coupling, and to decrease the impedance between the first output and the virtual ground and the impedance between the second output and the virtual ground at a second harmonic frequency of the signal to be amplified relative to those impedances in the absence of said inductive coupling.

A transistor amplifier package includes a package substrate comprising conductive patterns exposed by solder mask patterns at a surface thereof, and at least one transistor die comprising a semiconductor structure attached to the surface of the package substrate by a solder material and aligned by the solder mask patterns such that respective gate, drain, and/or source terminals of the at least one transistor die are electrically connected to respective ones of the conductive patterns. Related transistor amplifiers and fabrication methods are also discussed.

Front end systems and related devices, integrated circuits, modules, and methods are disclosed. One such front end system includes a low noise amplifier in a receive path and a multi-mode power amplifier circuit in a transmit path. The low noise amplifier includes a first inductor, an amplification circuit, and a second inductor magnetically coupled to the first inductor to provide negative feedback to linearize the low noise amplifier. The multi-mode power amplifier circuit includes a stacked output stage including a transistor stack of two or more transistors. The multi-mode power amplifier circuit also includes a bias circuit configured to control a bias of at least one transistor of the transistor stack based on a mode of the multi-mode power amplifier circuit. Other embodiments of front end systems are disclosed, along with related devices, integrated circuits, modules, methods, and components thereof.

A semiconductor device package includes a plurality of input leads and an output lead, a plurality of transistor amplifier dies having inputs respectively coupled to the plurality of input leads, and a combination circuit configured to combine output signals received from the plurality of transistor amplifier dies and output a combined signal to the output lead.