A die-packaging component includes a substrate, a die, a jumper structure, a lead structure and a package body. The substrate has a base surface further including a die-connecting portion and a package-body retaining structure surrounding the die-connecting portion. The die connects the die-connecting portion. The jumper structure welded to the die generates a thermal deformation while in conducting a high-voltage current. The lead structure includes a lead groove defining a thermal-deformation tolerance allowable route. While in meeting the thermal deformation, the jumper structure welded to the lead groove as well is movable along the thermal-deformation tolerance allowable route. The package body at least partly covers the lead structure and the substrate, completely covers the die and the jumper structure, and is constrained by the package-body retaining structure.

A die-packaging component includes a substrate, a die, a jumper structure, a lead structure and a package body. The substrate has a base surface further including a die-connecting portion and a package-body retaining structure surrounding the die-connecting portion. The die connects the die-connecting portion. The jumper structure welded to the die generates a thermal deformation while in conducting a high-voltage current. The lead structure includes a lead groove defining a thermal-deformation tolerance allowable route. While in meeting the thermal deformation, the jumper structure welded to the lead groove as well is movable along the thermal-deformation tolerance allowable route. The package body at least partly covers the lead structure and the substrate, completely covers the die and the jumper structure, and is constrained by the package-body retaining structure.

A semiconductor package includes a first metal plate having a first surface, a semiconductor chip including a first electrode and a second electrode, on the first surface, and a second metal plate on the semiconductor chip. The first metal plate has a first surface. The first electrode is connected to the first metal plate. The second metal plate includes a second surface and first and second side surfaces respectively on opposite sides of the second metal plate and connected to the second surface. The first side surface has a first recessed portion extending in a direction which crosses the first and second surfaces, and the second side surface has a second recessed portion extending in the second direction that crosses the first and second surfaces.

A semiconductor package includes a first metal plate having a first surface, a semiconductor chip including a first electrode and a second electrode, on the first surface, and a second metal plate on the semiconductor chip. The first metal plate has a first surface. The first electrode is connected to the first metal plate. The second metal plate includes a second surface and first and second side surfaces respectively on opposite sides of the second metal plate and connected to the second surface. The first side surface has a first recessed portion extending in a direction which crosses the first and second surfaces, and the second side surface has a second recessed portion extending in the second direction that crosses the first and second surfaces.