Provided is an electronic component including a pad region including a plurality of pads extending along corresponding extension lines and arranged in a first direction, and a signal wire configured to receive a driving signal from the pad region, wherein the plurality of pads include a plurality of first pads arranged continuously and a plurality of second pads arranged continuously, and extension lines of the plurality of first pads substantially converge into a first point and extension lines of the plurality of second pads substantially converge into a second point different from the first point.

A display device includes a substrate, conductive pads arranged on the substrate over a plurality of rows, and a drive circuit chip including bumps arranged over a plurality of rows to be electrically connected with the conductive pads, and the conductive pads arranged in a same row are arranged in parallel, and the bumps arranged in a same row are arranged in a zigzag form so as to be partially shifted.

A semiconductor structure includes a substrate, a chip, a plurality of conductive bumps, a flexible printed circuit (FPC) board and a plurality of circuit patterns. The chip is disposed on the substrate and includes a plurality of pads. The conductive bumps are disposed on the pads respectively. The FPC board is connected between the substrate and the chip, and the conductive bumps penetrate through an end of the FPC board. The circuit patterns are disposed on the FPC board and electrically connected to the conductive bumps and the substrate.

A device and related method that provides a two-phase heat transfer device with a combination of enhanced evaporation and increase cooling capacity. A recess topology is used to increase suction of working fluid toward a heat source. A non-wetting coating or structure may be used to keep working fluid away from the spaces between elongated members of an evaporator and a wetting coating or structure may be used to form thin films of working fluid around the distal regions of elongated members. The devices and method described herein may be used to cool computer chips, the skin of a hypersonic flying object, a parabolic solar collector, a turbine engine blade, or other heat sources that require high heat flux.

A multi-chip module includes two silicon bridge interconnects and three components that are tied together by the bridges with one of the components in the center. At least one of the silicon bridge interconnects is bent to create a non-planar chip-module form factor. Cross-connected multi-chip silicon bent-bridge interconnect modules include the two silicon bridges contacting the center component at right angles to each other, plus a fourth component and a third silicon bridge interconnect contacting the fourth component and any one of the original three components.

Provided is an electronic component including a pad region including a plurality of pads extending along corresponding extension lines and arranged in a first direction, and a signal wire configured to receive a driving signal from the pad region, wherein the plurality of pads include a plurality of first pads arranged continuously and a plurality of second pads arranged continuously, and extension lines of the plurality of first pads substantially converge into a first point and extension lines of the plurality of second pads substantially converge into a second point different from the first point.

A POP structure includes a circuit board, a bottom package structure, a top package structure, and a metal frame structure. The circuit board has a plurality of signal pads and dummy pads. The dummy pads surround the signal pads. The bottom package structure is disposed over the circuit board. The bottom package structure is electrically connected to the signal pads. The top package structure is disposed over the bottom package structure. The top package structure is electrically connected to the bottom package structure. The metal frame structure includes a body and a plurality of terminal pins. The body is located between the top package structure and the bottom package structure. The terminal pins extend outward from an edge of the top package structure to connect the top package structure and the dummy pads of the circuit board.

Provided is an electronic component including a pad region including a plurality of pads extending along corresponding extension lines and arranged in a first direction, and a signal wire configured to receive a driving signal from the pad region, wherein the plurality of pads include a plurality of first pads arranged continuously and a plurality of second pads arranged continuously, and extension lines of the plurality of first pads substantially converge into a first point and extension lines of the plurality of second pads substantially converge into a second point different from the first point.

A semiconductor module includes: a first substrate having a first insulating substrate and a first conductor layer; a power device part having a first electrode, a second electrode and a gate electrode; a second substrate having a second insulating substrate, a second conductor layer and a third conductor layer wherein a hole is formed in the second insulating substrate, the second conductor layer has a bonding portion and a surrounding wall portion; an inner resin portion; a control IC; and an outer resin portion, wherein the first substrate, the power device part, the second substrate and the control IC are stacked in this order, a connector is disposed in the inside of the hole, and the gate electrode is electrically connected to a control signal output terminal of the control IC through a connector.

A semiconductor structure includes a substrate, a chip, a plurality of conductive bumps, a flexible printed circuit (FPC) board and a plurality of circuit patterns. The chip is disposed on the substrate and includes a plurality of pads. The conductive bumps are disposed on the pads respectively. The FPC board is connected between the substrate and the chip, and the conductive bumps penetrate through an end of the FPC board. The circuit patterns are disposed on the FPC board and electrically connected to the conductive bumps and the substrate.