An electronic device includes a first structure body and a second structure body. The first structure body includes a first base body, a first bonding electrode and a first hard part. The second structure body includes a second base body, and a second bonding electrode. The first bonding electrode and the second bonding electrode are bonded to each other between the first base body and the second base body. The first hard part is located between the first base body and the second base body. The first hard part is positioned within an area in which the first bonding electrode is located when viewed along a first direction. The first direction is from the first base body toward the first bonding electrode. The first hard part has a higher hardness than the first bonding electrode.

A display device includes a substrate including a first surface, a second surface opposite to the first surface, a first chamfered surface extending from one side of the first surface, a second chamfered surface extending from one side of the second surface, and a side surface connecting the first chamfered surface to the second chamfered surface, a pixel on the first surface of the substrate and including a light emitting element to emit light, a plurality of front pad parts on an edge of the first surface of the substrate and electrically connected to the pixel, a plurality of rear pad parts on an edge of the second surface of the substrate, and a plurality of side surface connection lines on the side surface of the substrate electrically connecting the plurality of front pad parts to the plurality of rear pad parts.

A display device, and a tile-shaped display device including the same are provided. The display device includes a transistor array layer on a first surface of a substrate, and a plurality of light emitting elements on the transistor array layer. The transistor array layer includes a plurality of pixel drivers and two or more gate drivers in a circuit area of a display area, a first gate voltage supply line around the circuit area, and two or more first gate voltage auxiliary lines connected between the first gate voltage supply line and each of the two or more gate drivers. One end of each of the two or more first gate voltage auxiliary lines is spaced from an edge of the substrate adjacent to the first gate voltage supply line than the first gate voltage supply line.

A display device includes a scan write line configured to receive a scan write signal, a scan initialization line configured to receive a scan initialization signal, a sweep signal line configured to receive a sweep signal, a first data line configured to receive a first data voltage, a second data line configured to receive a second data voltage, and a subpixel connected to the scan write line, the scan initialization line, the sweep signal line, the first data line, and the second data line. The subpixel includes a light-emitting element, a first pixel driver including a first transistor configured to generate a control current according to the first data voltage of the first data line, and a second pixel driver including an eighth transistor configured to generate a driving current applied to the light-emitting element according to the second data voltage.

A display device includes a substrate including a plurality of emission areas respectively corresponding to a plurality of subpixels for displaying an image, a plurality of light emitting elements respectively located in the plurality of emission areas of a first surface of the substrate and respectively corresponding to the plurality of subpixels, a first planarization layer on the first surface of the substrate and covering the plurality of light emitting elements, and an array layer on the first planarization layer.

The disclosure provides an electronic device, including: a circuit substrate, an inorganic light emitting unit, and an opaque layer. The circuit substrate includes an optical sensor. The inorganic light emitting unit is disposed on the circuit substrate and is configured to emit a light. The opaque layer is disposed on the circuit substrate, including a first opening through which a portion of the light is transmitted to the optical sensor.

A package structure includes a substrate, a plurality of conductive pads, a light-emitting diode, a photo imageable dielectric material, and a black matrix. The substrate includes a top surface. The conductive pads are located on the top surface of the substrate. The light-emitting diode is located on the conductive pads. The photo imageable dielectric material is located between the light-emitting diode and the top surface of the substrate and between the conductive pads. An orthogonal projection of the light-emitting diode on the substrate is overlapped with an orthogonal projection of the photo imageable dielectric material on the substrate. The black matrix is located on the top surface of the substrate and the conductive pads.

A light-emitting device includes a carrier, a light-emitting element and a connection structure. The carrier includes a first electrical conduction portion. The light-emitting element includes a first light-emitting layer capable of emitting first light and a first contact electrode formed under the light-emitting layer. The first contact electrode is corresponded to the first electrical conduction portion. The connection structure includes a first electrical connection portion and a protective portion surrounding the first contact electrode and the first electrical connection portion. The first electrical connection portion includes an upper portion, a lower portion and a neck portion arranged between the upper portion and the lower portion. An edge of the upper portion is protruded beyond the neck portion, and an edge of the lower portion is protruded beyond the upper portion.

An electronic device is provided, the electronic device includes a driving substrate, the driving substrate includes a plurality of first grooves and a plurality of second grooves, the first grooves and the second grooves have different sizes, at least one first electronic component of the plurality of first electronic components is disposed in one of the plurality of first grooves, at least one second electronic component of the plurality of second electronic components is disposed in one of the plurality of second grooves, a maximum length passing through a center of a bottom surface of the at least one first electronic component is defined as L1, a bottom length of one side of at least one second groove among the second grooves is defined as L2, and the at least one first electronic component and the at least one second groove satisfy the condition of L1>L2.

An electronic device comprises a supporting substrate, a flexible substrate disposed on the supporting substrate, a plurality of electronic units and a conductive pattern layer. The flexible substrate is bent from a front side to a back side of the supporting substrate, and a portion of the flexible substrate is disposed on the back side of the supporting substrate. The electronic units are disposed within a display region of the flexible substrate. The conductive pattern layer extends from the display region to the portion of the flexible substrate, and the conductive pattern layer electrically connects at least two of the electronic units.