An electronic device includes an electronic component, a sealing resin covering the component, a first terminal protruding from the sealing resin toward a first side in a first direction orthogonal to the thickness direction of the sealing resin, a second terminal protruding from the sealing resin toward the first side in the first direction, and a plurality of third terminals protruding from the sealing resin toward a second side in the first direction. The first terminal and the second terminal are located side by side with a first interval in a second direction orthogonal to the thickness direction and the first direction. The third terminals are arranged in the second direction with a second interval. The first interval is greater than the second interval. The first terminal includes a plurality of first mount portions located at an end opposite to the sealing resin in the first direction.

A compound semiconductor substrate has a first main surface parallel to a first direction and a second direction perpendicular to the first direction, a second main surface located on a side opposite to the first main surface, and a recess. The recess has an opening, a bottom surface facing the opening, and a plurality of side surfaces located between the opening and the bottom surface. The side surfaces include at least one first side surface forming an angle of about degrees with the bottom surface in the recess and at least one second side surface forming an angle of about degrees with the bottom surface in the recess. The total length of edge lines between the first main surface and the at least one first side surface is larger than that of edge lines between the first main surface and the at least one second side surface.

A semiconductor chip has a first transistor that amplifies a first signal and outputs a second signal, a second transistor that amplifies the second signal and outputs a third signal, and a semiconductor substrate having a main surface parallel to a plane defined by first and second directions and which has the first and second transistors formed thereon. The main surface has thereon a first bump connected to a collector or drain of the first transistor, a second bump connected to an emitter or source of the first transistor, a third bump connected to a collector or drain of the second transistor, and a fourth bump connected to an emitter or source of the second transistor. The first bump is circular, the second through fourth bumps are rectangular or oval, and the area of each of the second through fourth bumps is larger than that of the first bump.

A semiconductor device includes a first semiconductor element, a first terminal electrically connected to the first semiconductor element, a second terminal electrically connected to the first semiconductor element and spaced apart from the first terminal in a first direction, and a sealing resin covering the first semiconductor element and a part of each of the first terminal and the second terminal. The sealing resin includes a first side surface facing in a second direction orthogonal to the first direction and located closest to the first terminal and the second terminal in the second direction. The first terminal and the second terminal are spaced apart from the first side surface.

A semiconductor device includes a first semiconductor unit including a plurality of first semiconductor chips, an organic resin provided between the first semiconductor chips, a wiring layer provided above the first semiconductor chips to electrically connect the first semiconductor chips to each other, and a plurality of connecting terminals provided on an upper portion of the wiring layer and a second semiconductor unit fixed to a wiring layer side of the first semiconductor unit, the second semiconductor unit fixed to a region sandwiched between the connecting terminals, the second semiconductor unit having a second semiconductor chip, the second semiconductor unit electrically connected to the first semiconductor unit.

In an optical receiver circuit which suppresses an unnecessary increase in impedance and occurrences of resonance and radiation noise and which produces preferable high-frequency transmission characteristics, a PD submount mounted with a PD chip and a chip capacitor and a TIA carrier mounted with a TIA chip are electrically connected to each other by a bonding wire. The chip includes an anode electrode pad and a cathode electrode pad, anode electrode-side ground pads are formed at positions that sandwich the pad, and cathode electrode-side ground pads are formed at positions that sandwich the pad. A wire electrically connects the pad and a signal pad for input of the chip to each other, a wire electrically connects the pad and the capacitor to each other, and a wire electrically connects the pads and the pads to each other.

A sensor array may include a plurality of sensors coupled with a flexible substrate. Each sensor may include a sensor die that generates an analog signal based on sensing, and a converter die that performs analog-to-digital conversion (ADC) of the analog signal to generate a digital output. The flexible substrate may include electrical interconnect to transmit digital outputs from sensors of the plurality of sensors. The flexible substrate may include strain relief cutouts between the sensors to enable deformation of the sensor array. Other aspects are also described and claimed.

A semiconductor device includes a first semiconductor chip, a die attach film, a second semiconductor chip, and a resin molding member. The first semiconductor chip is attached to the second semiconductor chip via the die attach film. The second semiconductor chip includes an analog circuit, a bonding pad, and one or more deformed bonding pads serving as alignment marks of the first semiconductor chip. In plan view, the analog circuit is located inside an outer peripheral edge of the die attach film. The resin molding member seals the first semiconductor chip, the second semiconductor chip, and the die attach film.