Patent classifications
H
H01
H01L
2924/00
H01L2924/40
H01L2924/401
H01L2924/402
H01L2924/4025
H01L2924/40252
H01L2924/40252
Semiconductor package including a semiconductor die having redistributed pads
09633951
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2017-04-25
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A semiconductor package that includes a semiconductor die, an insulation around the die, and a conforming conductive pad coupled to an electrode of the die.