A microwave or radio frequency (RF) device includes a substrate and a cover. The substrate has a first surface and an opposing second surface, the first surface including a first RF component and a second RF component electrically coupled to the first RF component in series. The cover is disposed over the first surface of the substrate, where the cover includes a first portion with a first width covering the first RF component, where the first portion and the first surface define a first waveguide cavity having the first width, and a second portion with a second width, less than the first width, covering the second RF component, where the second portion and the first surface define a second waveguide cavity having the second width.

A component carrier includes a first stack having at least one first electrically insulating layer structure and at least one first electrically conductive layer structure, and a second stack with at least one second electrically insulating layer structure and at least one second electrically conductive layer structure. The first stack and the second stack are connected with each other so that a vertical two-dimensional electrically conductive connection is established. The first stack has a first cavity and the second stack has a second cavity, the first cavity and the second cavity being separated by at least one further electrically insulating layer structure. At least one of the first cavity and the second cavity is delimited by a wall being at least partially lined with an electrically conductive coating.

A tunable bandpass filter (1A) includes a waveguide (11); a plurality of resonators (12) housed in the waveguide (11) and arranged in the lengthwise direction of the waveguide (11); a coupling member (13) disposed between two adjacent resonators (12); a ridge member (14) extending in the lengthwise direction of the waveguide (11) and connected to one end of the coupling member (13); and a dielectric plate (17) extending in the lengthwise direction of the waveguide (11), disposed adjacent to the plurality of resonators (12) in a direction orthogonal to the lengthwise direction of the waveguide (11), and movable in the direction orthogonal to the lengthwise direction of the waveguide (11).

A cavity filter including a housing, defining a cavity; and a planar resonator arrangement including multiple planar resonators that are arranged in a common plane inside the cavity, wherein the multiple planar resonators include at least: a first planar resonator including a first elongate planar lead terminating at a first planar head, and a second planar resonator including a second elongate planar lead terminating at a second planar head, wherein the first resonator and the second resonator are immediately adjacent and wherein the first elongate planar lead, the first planar head, the second elongate planar lead and the second planar head extend within the common plane.

A filter circuit may include a transmission line, a quarter wave resonator, and an electrical component coupled in series with the quarter wave resonator at a first end and to the transmission line at a second end. The electrical component may be have a frequency dependent impedance. The electrical component may be an inductor, a capacitor, or an inductor in series with a capacitor. In another aspect, a filter circuit may include a transmission line, a first quarter wave resonator coupled to a first electrical component and a second quarter wave resonator coupled to a second electrical component. Each of the first and second electrical components may be coupled to the transmission line in parallel with each other. The first and the second electrical components may have a frequency dependent impedance. The first electrical component may be the same as or different from the second electrical component.

A filter device includes a first filter connected between a common terminal and a first individual terminal, and a second filter connected between the common terminal and a second individual terminal. A pass band of the second filter is in a frequency range lower than a pass band of the first filter. The first filter includes SAW resonators, at least one of which includes divided resonators connected in parallel with each other. Each of the divided resonators includes an IDT. A pitch of the IDT of one of the divided resonators is different from that of another of the divided resonators.

Provided are a resonator having a good Q value and a filter using the resonator. The resonator has: a via electrode portion formed inside a dielectric substrate; a plurality of shielding conductors formed on the dielectric substrate to surround the via electrode portion; a first strip line which is connected to one end of the via electrode portion in the dielectric substrate and faces a first shielding conductor among the plurality of shielding conductors; and a second strip line which is connected to the other end of the via electrode portion in the dielectric substrate and faces a second shielding conductor among the plurality of shielding conductors.

A band-pass filter includes first to sixth stage resonators. Each resonator includes a resonator conductor portion formed of a conductor line. The resonator conductor portion has a first end and a second end which are opposite ends of the conductor line. The resonator conductor portion of each of the first and sixth stage resonators includes a narrow portion, a first wide portion located between the narrow portion and the first end, and a second wide portion located between the narrow portion and the second end. Each of the first and sixth stage resonators is lower in unloaded Q than the other resonators.

The present invention includes a method of creating electrical air gap low loss low cost RF mechanically and thermally stabilized interdigitated resonate filter in photo definable glass ceramic substrate. Where a ground plane may be used to adjacent to or below the RF filter in order to prevent parasitic electronic signals, RF signals, differential voltage build up and floating grounds from disrupting and degrading the performance of isolated electronic devices by the fabrication of electrical isolation and ground plane structures on a photo-definable glass substrate.

The present invention includes a method of creating electrical air gap low loss low cost RF mechanically and thermally stabilized interdigitated resonate filter in photo definable glass ceramic substrate. Where a ground plane may be used to adjacent to or below the RF filter in order to prevent parasitic electronic signals, RF signals, differential voltage build up and floating grounds from disrupting and degrading the performance of isolated electronic devices by the fabrication of electrical isolation and ground plane structures on a photo-definable glass substrate.