Provided is a mount component that is for forming a directional coupler consisting of a main line and a sub line. Out of the main line and the sub line, only the sub line is formed on or in the mount component. The main line is formed on or in a mounting substrate on which the mount component is mounted and is not formed on or in the mount component. When the mount component is mounted on the mounting substrate, the main line and the sub line electromagnetically couple with each other and as a result a directional coupler is formed.

Disclosed is a device including a first line, a second line including a first section disposed on a first side of the first line and a second section disposed on a second side of the first line, the second side being opposite to the first side and the second section being separate from the first section by a distance, and at least one bridge electrically connecting an end of the first section with an end of the second section and extending across the first line. The device may be a directional coupler that achieves significantly higher directivity than conventional directional coupler structures, and hence, improves power detection accuracy.

An electrical component, such as an RF device or thermal bridge, for use with a printed circuit board. The component may include a first dielectric layer having a top and a bottom, and a first conductive trace positioned on the bottom of the first dielectric layer. The component may also include a first ground layer positioned on the bottom of the first dielectric layer and spaced apart from the first conductive trace and a first solder layer connecting the first conductive trace to a second conductive trace of the printed circuit board and extending the full length of the first conductive trace. The component may also include a third conductive trace over the top of the first dielectric layer. The component may also include a pad under the first dielectric layer. The pad is soldered to a signal contact region of the printed circuit board. The third conductive trace is coupled to signal outputs formed by the signal contact region of the printed circuit board through a first via. The component may also include a second solder layer connecting the first ground layer of the component to a second ground layer positioned on the printed circuit board.

A directional coupler (1) includes a surface mounted component (10) and a mounting substrate (20) on which the surface mounted component (10) is mounted. Among a main line and a sub line of the directional coupler (1), the main line is formed of a first line (31) and a second line (32), one end (311) of the first line (31) and one end (321) of the second line (32) being connected to each other, the sub line is formed of a third line (33). The first line (31) and the third line (33) are formed in the surface mounted component (10). The second line (32) is formed on or in the mounting substrate (20). Furthermore, another end (312) of the first line (31) and another end (322) of the second line (32) may be connected to each other.

Disclosed in an electronic device, which includes a housing that includes a first plate and a second plate facing a direction opposite the first plate, a conductive plate that is disposed in a first plane between the first plate and the second plate, and is parallel to the second plate, a wireless communication circuit that is disposed within the housing and is configured to transmit and/or receive a signal having a frequency ranging from 20 GHz to 100 GHz, a first electrical path having a first end electrically connected with the wireless communication circuit and a second end floated, the first electrical path including a first portion between the first end and the second end, a second electrical path having a third end electrically connected with the conductive plate and a fourth end floated, the second electrical path including a second portion between the third end and the fourth end.

A directional coupler includes a multilayer body, a conductor (31), and a conductor (32). The conductor (31) is a conductor that is arranged in an insulating layer (21) of the multilayer body and that extends in a certain shape. The conductor (32) is arranged on a side of an insulating layer (22) of the multilayer body opposite the insulating layer (21). The conductor (32) runs parallel to the conductor (31) and is electromagnetically coupled to the conductor (31). The conductor (32) has a winding shape with one or more rounds, and has a conductor portion (321) and a conductor portion (325) that are arranged adjacent to each other with a spacing in a direction orthogonal to a running parallel direction. In plan view of the multilayer body, the conductor (31) is arranged between the conductor portion (321) and the conductor portion (325).

A feeding structure is provided. The feeding structure includes a feeding unit, which includes: a reference electrode, first and second substrates opposite to each other, and a dielectric layer between the first and second substrates. The first substrate includes a first base plate and a first electrode thereon. The first electrode includes a first main body and a plurality of first branches connected to the first main body and spaced apart from each other. The second substrate includes a second base plate and a second electrode thereon. The second electrode includes a second main body and a plurality of second branches, which are connected to the second main body, spaced apart from each other, and in one-to-one correspondence with the plurality of first branches. Orthographic projections of each second branch and a corresponding first branch on the first base plate partially overlap each other.

An electrical component, such as an RF device or thermal bridge, for use with a printed circuit board. The component has a first dielectric layer having a top and a bottom, a first conductive trace positioned on the bottom of the dielectric layer, and a first ground layer positioned on the bottom of the dielectric layer and spaced apart from the first conductive trace. For RF applications, a second conductive trace is positioned on top of first dielectric, a second dielectric is positioned on top of the second conductive trace, and a second ground plane is positioned on top of the second dielectric. A printed circuit board having a third conductive trace may then be coupled to the first conductive trace by a first solder layer.

A coupler module (1) includes a coupler component (10) formed with a main line (11) and a sub-line (12) that configure a directional coupler, and a module substrate (20) on which the coupler component (10) is mounted and on which a wiring conductor coupled in series with the main line (11) is formed. At least a part of the wiring conductor is along the main line (11) in plan view of the module substrate (20), and a direction of a main signal flowing through the main line (11) and a direction of the main signal flowing through the part of the wiring conductor are opposite to each other.

A branch line directional coupler has a first line, a second line, a first open-ended coupled circuit, and a second open-ended coupled circuit. The first and second lines have a first characteristic impedance and a quarter wavelength length. The first open-ended coupled line has one end connected to the first line and the other end connected to the second line. The second open-ended coupled line has one end connected to the first line and the other end connected to the second line. The first open-ended coupled line has two coupled lines having a coupling length of a quarter wavelength, an open stub, and a connecting line, and has a total length of one-half wavelength. The second open-ended coupled line includes two coupled lines having a coupling length of ¼-wavelength, open stubs, and a connecting line, and has a total length of ½-wavelength.