Patent classifications
H01P5/187
Power combiner having a symmetrically arranged cooling body and power combiner arrangement
A power combiner for coupling, splitting, or coupling and splitting high-frequency signals, the power combiner has a first input for a first high-frequency signal, a second input for a second high-frequency signal, an output, an equalizing connection, a first electrical conductor arranged between the first input and the output, wherein the first electrical conductor has a first total surface shaped primarily as a first planar surface electrode, a second electrical conductor arranged between the second input and the equalizing connection, wherein the second electrical conductor has a second total surface shaped primarily as a second planar surface electrode, and wherein the second electrical conductor is capacitively and inductively coupled to the first electrical conductor; and a cooling body, wherein more than 70% of the first total surface of the first electrical conductor is a same distance from the cooling body as the second total surface of the second electrical conductor.
Signal channel for reducing crosstalk noise, module substrate and memory module including the same
A signal channel includes at least one first signal line positioned in a first signal layer and at least one second signal line positioned in a second signal layer. The first signal layer extends in a first horizontal direction. The second signal layer extends along a second horizontal plane parallel to the first horizontal plane and spaced apart from the first horizontal plane along a vertical direction orthogonal to the first and second horizontal planes. The first signal line includes a first coupling segment and the second signal line includes a second coupling segment. The first coupling segment at least partially overlaps the second coupling segment along the vertical direction. The first and second coupling segments are positioned to form a greater degree of capacitive coupling between the first and second coupling segments than a degree of capacitive coupling formed between other segments of the first and second signal lines.
Wideband gysel power divider
A power divider capable of implementation in a compact multilayer surface mount component to perform power division/combining with low insertion loss, wide bandwidth, design flexibility and high power handling capabilities. The power divider has a first pair of coupled transmission lines interconnecting the input to the outputs, a second pair of coupled transmission lines interconnecting the output ports to grounded isolation resistors, and a single transmission line interconnecting the second pair of coupled transmission lines. The surface mount implementation is by a first layer supporting the ports, a second layer providing edge coupled lines, a third layer having ground plane, a fourth layer and a fifth layer each supporting one of a pair of broadside coupled lines, a sixth layer with another ground plane, and a seventh layer including a single line interconnecting the broadside coupled lines.
90-degree hybrid circuit
A 90-degree hybrid circuit includes a dielectric substrate, a first conductor that includes a conductor pattern formed on the dielectric substrate and electrically conducts between a first port and a second port, a second conductor that includes a conductor pattern formed on the dielectric substrate and electrically conducts between a third port and a fourth port, and a coupled line comprising a portion of the first conductor and a portion of the second conductor that face each other on front and back sides of the dielectric substrate. A first coupled line portion as the portion of the first conductor includes a coplanar line with first ground patterns formed to sandwich the first coupled line portion from both sides. A second coupled line portion as the portion of the second conductor includes a coplanar line with second ground patterns formed to sandwich the second coupled line portion from both sides.
Embedded directional couplers and related methods
A directional coupler includes an electrically conductive main line coupled at least partially in and/or on a dielectric layer and having input and output ports. An electrically conductive coupled line separated from the main line includes a coupled port and is at least partially formed in and/or on the dielectric layer. An electrically conductive ground layer couples with the dielectric layer and is electrically isolated from the main and coupled lines. One or more tuning elements, formed of electrically conductive elements arranged in a pattern (but electrically isolated from the main and coupled lines and ground layer) and/or formed using an electrically conductive layer (the electrically conductive layer electrically isolated from the main and coupled lines and ground layer and with or without a pattern of openings therein) are at least partially encapsulated in the dielectric layer and increase a coupling coefficient and/or directivity of the directional coupler.
RF coupler including vertically stacked coupling sections having conductive layers disposed between the coupling sections and the coupler including a surrounding electric shield
An RF coupler having: a pair of input ports; a pair of output ports; and a coupling region for coupling: a portion of an input signal at a first one of the input ports to first of the pair of output ports and another portion of the input signal fed to the first one of the input ports a second one of the output ports; and one portion of an input signal fed to a second one of the input ports to the second of the pair of output ports and another portion of the input signals fed to the second one of the input ports to the second one of the output ports. The coupling region comprises a plurality of serially connected, vertically stacked, coupling sections. Each one of a plurality of electrically conductive layers is disposed between a pair of the vertically stacked coupling sections.
Directional coupler and electronic component module
A directional coupler includes a substrate, a main line 121, a main line 122, and a sub-line. The main line 121 and the main line 122 each include a conductor pattern formed in the substrate, and are connected in parallel to each other. The sub-line includes a conductor pattern formed in the substrate. The sub-line is disposed at a position at least partially overlapping with the main line 121 in a plan view of the substrate.
Wideband dual directional coupler
A directional coupler device includes an asymmetric dual directional coupler for receiving a radio frequency (RF) signal and a switching circuit. The asymmetric dual directional coupler includes a main line having an input port and an output port, multiple coupled lines separated from the main line, the coupled lines having different lengths for providing different coupling factors, respectively, where each coupled line has first and second ports. The switching circuit selectively applies one of the different coupling factors of the coupled lines, depending on frequency of the RF signal in relation to a predetermined threshold frequency, while coupling a portion of forward power or reverse power of the RF signal to a coupling reading port, to mitigate power loss in an upper frequency range of the RF signal, while satisfying coupling criteria.
CABLE NETWORK DEVICE WITH LOW LOSS MEASUREMENT PORT
There is provided a cable network device (10) comprising an output path (32), for example from a diplex filter, connected to at least one output (14) and a test port (24) associated with the at least one output (14), wherein a microstrip directional coupler (30) is disposed in the output path (32) with a coupling port (44) of the microstrip directional coupler (30) connected to the test port (24), and an amplifier element (36) and at least one equalizer (34) disposed between the coupling port (44) and the test port (24). The device is configured for signals complying with a high frequency spectrum of 1.8 GHz and above.
High-density embedded broadside-coupled attenuators
Systems and techniques that facilitate high-density embedded broadside-coupled attenuators are provided. In various embodiments, an attenuator can comprise an output line. In various aspects, the attenuator can further comprise a reflectively-terminated input line that is broadside coupled to the output line. In various instances, a downstream end of the reflectively-terminated input line can be shorted to ground. In other instances, a downstream end of the reflectively-terminated input line can be open from ground. In various cases, the output line can exhibit a non-looped-back-layout.