A printed circuit board plug-in connection is provided for transmitting the highest possible currents between a printed circuit board and an electrical cable, the printed circuit board plug-in connection being manufactured as simply and economically as possible. For this purpose, a plug-in connection having a slotted pin contact is proposed. Said pin contact is arranged in an insulating body and can be inserted directly into a passage contact opening of a printed circuit board in order to establish electrical contact. The insulating body has detent arms, which releasably engage in detent openings of the printed circuit board in a locking manner at the same time. By means of dovetail connections, several insulating bodies can be fastened to each other, i.e., can be cascaded with each other. A strain relief element can also be fastened to an insulating body by means of the dovetail connection in order to provide strain relief for individual conductors of the cable.

A discrete electrical component is disclosed, including a component member having at least one lead; and a base member on which the component member is supported. The electrical component further includes at least one compliant pin member, each compliant pin member having a first end portion configured for press-fit engagement in a printed circuit board and a second end portion electrically connected to the at least one lead of the component member. The at least one compliant pin at least partly extends through or into the base member.

A connection device includes a housing having a first face provided with a first opening that is closed by a PCB, and a second face provided with a second opening facing at least one electrical connection interface of the PCB. The housing includes at least one well extending from an edge of the second opening to the PCB so as to position a first connector relative to the connection interface, and in that the housing is a one-piece part that includes the well.

A bidirectional signal pin module includes: a signal pin configured to electrically connect two objects; and a socket having a bent body shape including bent portions, and configured to fix the signal pin in either one of a horizontal direction and a vertical direction.

A power semiconductor module includes: first and second substrates; at least one power semiconductor die arranged between and thermally coupled to a first side of each substrate, and electrically coupled to the first side of the first substrate; at least one rivet having a first end arranged on and electrically coupled to the first side of the first substrate; and an encapsulant encapsulating the at least one power semiconductor die, the at least one rivet and the substrates. At least parts of a second side of the substrates are exposed from the encapsulant. A second end of the at least one rivet is exposed at the encapsulant and configured to accept a press fit pin such that the at least one power semiconductor die can be electrically contacted from the outside.

An electrical connector for mounting on an external circuit board includes: an insulating body; a terminal module assembled on the insulating body and including a plurality of mating terminals, an insulating carrier with an accommodating cavity, plural intermediate terminals fixed on one side of the insulating carrier and electrically connected to the mating terminals, plural pin terminals fixed on the other side of the insulating carrier, and a magnetic module accommodated in the accommodating cavity and electrically connected to the intermediate terminals and the pin terminals, wherein the insulating carrier is a two-piece housing, the intermediate terminals are held in one housing piece, and the pin terminals are held in the other housing piece.

An electrical connector including a compressible lossy member is provided. The electrical connector comprises an insulative member, a plurality of terminals supported by the insulative member and disposed in a row along a row direction, and a compressible lossy member disposed in a recess of the insulative member. The lossy member includes a body portion elongated in the row direction and a plurality of projections extending from the body portion. The projections of the lossy member project toward and make contact with contact surfaces of first terminals of the plurality of terminals. At least a part of the body portion is compressible and is in a state of compression when the projections are pressed against the first terminals.

A power semiconductor module includes a housing accommodating a power circuit with at least one power semiconductor chip, the housing providing at least two power terminals; a printed circuit board mounted to the housing and electrically connected to the power circuit for distributing auxiliary signals; and at least one auxiliary terminal mounted to the printed circuit board with a press-fit connection provided by a body of the auxiliary terminal.

A contact module includes a frame assembly having a leadframe and a dielectric frame partially encasing the leadframe. The leadframe includes ground conductors each having a transition portion extending between a mating end configured to be mated to a mating connector and a terminating end configured to be terminated to one of a circuit board or a cable conductor. The dielectric frame includes dielectric material encasing at least a portion of each transition portion. Each mating end extends from the dielectric frame for connection with the mating connector. Each terminating end extends from the dielectric frame for connection with the circuit board or the cable conductor. The contact module includes resistive elements within the dielectric frame. Each resistive element is coupled in series with the transition portion of the corresponding ground conductor.

A wafer includes a number of conductive terminals and an insulating frame. The conductive terminals include differential signal terminals, a first ground terminal and a second ground terminal. Each conductive terminal includes a connection portion and a contact portion. The connection portions of the differential signal terminals, the first ground terminal and the second ground terminal are located in a first plane. The first ground terminal includes a first torsion portion and the second ground terminal includes a second torsion portion. The contact portion of the first ground terminal and the contact portion of the second ground terminal are both perpendicular to the first plane. This present disclosure can provide better shielding effect, reduce crosstalk and improve the quality of signal transmission. In addition, the present disclosure also relates to a backplane connector having the wafer.