A connector is provided that includes a housing and a terminal installed in the housing. The housing includes a receiving space in which the upper face receiving a counterpart connector is opened, a pair of side wall parts defining at least a portion of both the left and right sides of the receiving space, a front wall part defining at least a portion of the front of the receiving space, and a pair of rear wall parts defining at least a portion of the rear of the receiving space. The terminal includes a front contact part provided on the front of the receiving space so as to be adjacent to each side wall part, and a rear contact part provided on the rear of the receiving space so as to be adjacent to each side wall part. The front contact part and the rear contact part are disposed in nearly a straight line extending in the anteroposterior direction, face each other, and are capable of holding a counterpart terminal of the counterpart connector from the front and rear thereof.

A connecting terminal device may include: a bottom plate; a movable part provided on a rear surface of the bottom plate that is configured to be electrically connected to an external object as the movable part is pressed or raised; one or more protective walls provided on side surfaces of the bottom plate; pressing preventing parts provided at ends of the protective walls and provided between the bottom plate and the movable plate to restrict a pressing movement of the movable part; and rising preventing parts provided on side surfaces of the protective walls to restrict a rising movement of the movable part.

A connection module includes a module body and a module circuit board arrangement. The module body defines a first port and an open first end providing access to the first port. The module circuit board arrangement extends across the open first end within a peripheral boundary defined by the module body. The module circuit board arrangement includes at least a first contact set that extends into the first port of the module body; an electronic controller that is electrically connected to the first contact set; and a circuit board connector facing outwardly from the module board arrangement. Example connection modules include optical adapters and electrical jacks.

An electric connection socket for relaying electric signals between a circuit substrate and an electric component includes: a metal housing which has a through hole enabling communication between the top surface and the bottom surface thereof, and on the top surface of which the electric component is mounted and on the bottom surface of which the circuit substrate is mounted; and a signal pin inserted into the through hole to configure a coaxial line between the inner wall surfaces of the through hole, and which is electrically connected at one end to a signal path first pad electrode of the circuit substrate and is electrically connected at the other end to a signal path terminal of the electric component. On the bottom surface, the metal housing has a ground connection unit which contacts a second pad electrode for grounding formed on the circuit substrate and which grounds the metal housing.

An electrical connector includes a non-conductive housing, electrical contacts and a flange. The non-conductive housing has spaced openings on a front face thereof configured to receive corresponding spaced members of an electrical plug. The electrical contacts include contact clips disposed in the spaced openings and configured to receive corresponding of the spaced members of the electrical plug, and contact members extending beyond the non-conductive housing and spaced independently of a spacing of the spaced members of the electrical plug to be received in the spaced openings. The flange has a predetermined shape, outlining the non-conductive housing and configured to be inserted in a correspondingly shaped standardized receptacle.

Microelectronic assemblies, as well as related structures, devices, and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a microelectronic device having a hexagonal node configuration, wherein the hexagonal node configuration may include a differential signal node pair; a power node; and a plurality of ground nodes; and wherein the differential signal node pair, the power node, and the plurality of ground nodes are arranged in a hexagonal parallelogon pattern, wherein the differential signal node pair includes a first differential signal node adjacent to a second differential signal node, and wherein the power node is adjacent and symmetric to the differential signal node pair; and a microelectronic substrate electrically coupled to the microelectronic device.

A light source module includes a transparent conductive substrate, a circuit assembly and a light-emitting element. The circuit assembly is electrically connected with a conductive film of the transparent conductive substrate. The circuit assembly includes a feed terminal. The feed terminal is coupled with a po-go pin. The light-emitting element is installed on the conductive film of the transparent conductive substrate. The present invention also provides a computing device with the light source module.

A compact ECG snap connector is disclosed. A channeled U shaped body is formed from a thin sheet of electrically conductive and resilient material. The body is dimensioned to be compatible with standard ECG snap connector pins, and can be fastened to a printed circuit board. Fixed structures located in proximity to the channeled U shaped body provide mechanical restrictions on the expansion and contraction of the channeled U shaped body's aperture.

Embodiments include a transmission line-land grid array (TL-LGA) socket assembly, a TL-LGA socket, and a package substrate. The TL-LGA socket assembly includes a TL-LGA socket having an interconnect in a housing body, the interconnect includes a vertical portion and a horizontal portion. The housing body has a top surface and a bottom surface, where the top surface is a conductive layer. The TL-LGA socket assembly also includes a package substrate having a base layer having a signal pad and a ground strip. The base layer is above the conductive layer of the housing body of the TL-LGA socket. The ground strip is above the horizontal portion of the interconnect and adjacent to the signal pad. The horizontal portion is coupled to the signal pad on the base layer. The package substrate may have a pad with a reduced pad area.

According to various embodiments, an electronic apparatus comprises: a housing including a front plate, a rear plate disposed facing a direction opposite the front plate, and a side bezel enclosing at least a portion of the space between the front plate and the rear plate; a circuit board disposed between the front plate and the rear plate; a first radiating conductor disposed to form at least a portion of the side bezel; a connection member comprising a conductive material disposed between the circuit board and the rear plate; and a processor or communication module comprising communication circuitry disposed on the circuit board. The connection member includes a first curved part provided on one end and contacting the circuit board, and a second curved part provided on another end and contacting the first radiating conductor, thereby electrically connecting the first radiating conductor to the circuit board. The processor or communication module can be configured to use the first radiating conductor to perform wireless communication in at least one frequency band.