IC device assemblies including a power delivery bus board that is mounted to a primary PCB (i.e., motherboard) that further hosts a power-sink device and a power-source device. The bus board, as a secondary PCB, may be surface-mounted on a back side of the primary PCB opposite the power source and sink devices, which are mounted on the front side of the primary PCB. The bus board need only be dimensioned so as to bridge a length between first and second back-side regions of the primary PCB that are further coupled to a portion of the front-side pads employed by the power-sink device. The secondary PCB may be purpose-built for conveying power between the source and sink devices, and include, for example, short, wide traces, that may be formed from multiple heavyweight metallization layers.

A receptacle connector is provided that is used for board-to-board connection. The connector includes: a housing including: first sidewall portions protruding along both side borders of a bottom portion that face each other; second sidewall portions protruding along the other side borders of the bottom portion that face each other to be connected with the first sidewall portions; a center protrusion portion protruding from a center of the bottom portion; and a connection recess portion formed between the first sidewall portions and the second sidewall portions, and the center protrusion portion; metal brackets soldered to a board and coupled to the second sidewall portions and protruding ends of the center protrusion portion; and terminals received in terminal holes formed on the housing, and the metal bracket includes a connection sensing member configured to provide a feeling of clicking of completion of connection by pressing a plug metal bracket.

A contact arrangement, including multiple contacts, is provided. The contacts are staggered. Some of the contacts form at least one contact group. The at least one contact group includes a first contact and six second contacts. The second contacts are arranged around the first contact. When the first contact is a power contact or a ground contact, the second contacts are signal contacts. When the first contact is a signal contact, three of the second contacts are power contacts or ground contacts and are not adjacent to each other.

A contact arrangement, including multiple contacts, is provided. The contacts are staggered. Some of the contacts form at least one contact group. The at least one contact group includes a pair of first contacts and eight second contacts. The pair of first contacts is a pair of differential signal contacts. The second contacts are arranged around the pair of first contacts. Two of the second contacts are arranged along a straight line perpendicular to a connecting line of the pair of first contacts. The position distribution and electrical properties of the other six of the second contacts are symmetrical to each other relative to the straight line.

A board-to-board connection structure includes a first circuit board, a second circuit board, and a connector. The first circuit board includes a first base layer and a first outer circuit layer. The second circuit board includes a second base layer and a second outer circuit layer. The connector electrically couples the first circuit board and the second circuit board. The connector includes a housing, a first electrical connection portion, and a second electrical connection portion. A side surface of the first circuit board includes a first conductive layer electrically coupled to the first outer circuit layer. The connector is coupled to the first conductive layer through the first electrical connection portion. The second circuit board is located in the housing, and the second electrical connection portion is electrically coupled to the second outer circuit layer.

In a transceiver module, when one end portion of a module board (18) is inserted and connected to a concave portion (16R) of a plug connector (16), a projection portion (16PP) formed on the periphery of the concave portion (16R) of the plug connector (16) is fitted into a notch portion (18PH) as one end surface of the module board (18) comes into contact with an inner peripheral surface that forms the concave portion (16R).

A method for manufacturing a power interface is provided. The method may includes: providing a pin workblank and disposing the pin workblank on a first mold; and performing a punching shear process on the pin workblank by a second mold, thereby forming a power pin of the power interface without a process of removing burrs. A power interface is also provided.

An electrical connector includes an insulating housing having a mating cavity and a contact module. The contact module comprises at least one contact group and an insulative component, the one contact group has a first power contact and a second power contact, each one of the first power contact and the second power contact has a retaining portion, at least one contacting portion and at least one soldering portion. The retaining portions of the first power contact and the second power contact in one contact group are arranged in a height direction in the insulative component, the contacting portions of the first power contact and the second power contact in one contact group are arranged in a transverse direction of the insulating housing, the soldering portions of the first power contact and the second power contact in one contact group are arranged in a front-and-back direction.

Electrical connectors provide signal connections between electronic devices using electrically-conductive contacts, or electrical contacts. In some applications, a connector including a solid substrate body may facilitate the connection of cables with a complementary connector.

An electrical connector structure includes an insulating housing, a first terminal set, a second terminal set, a third terminal set and at least one conductive member. The first, second and third terminal sets are disposed in the insulating housing. Each of the first and second terminal sets includes a plurality of signal terminals and at least one ground terminal. The conductive member is electrically connected to the ground terminals of the first and second terminal sets, and is not electrically connected to the third terminal set.