A connector to connect an electronic module to an edge of a first electronic circuit board is described. The module has a second electronic circuit board. The connector has a top part that houses a first row of I/Os. The top part is to be placed on a surface of the first electronic circuit board. The connector has a bottom part that houses a second row of I/Os. The bottom part is to be placed on an opposite surface of the first electronic circuit board, wherein, the top and bottom parts form inner and outer stand-offs when mater together. The inner stand-off is to reside within a through hole of the first electronic circuit board. The outer stand-off is to reside within free space off the edge of the first electronic circuit board. The second electronic circuit board is to be pressed in between the first row of I/Os and the second row of I/Os when the module is connected to the connector.

The present invention provides a high-power board-to-board floating connector that comprises a male header and a female socket. The male head comprises a first electrode, a first housing and a first insertion element. The female socket comprises a second electrode, a second housing, a floating member, and a second insertion element. The second housing combines with the floating member to form a connection part which can be slightly moved in one or more directions, so that the male head can be connected to the female socket in a permissible range, and then the first electrode is electrically connected to the second electrode.

This application relates to the field of power supply packaging technologies, and in particular, to a PCB-pinout based packaged module, including a packaged module and a pin exposed outside the packaged module. The packaged module includes a PCB and a power component. The PCB has a first surface and a second surface that are disposed opposite to each other, and the power component is disposed on the first surface or the second surface of the PCB. The power component performs communication connection with a pin located on one side of the first surface or one side of the second surface of the PCB through surface-layer copper of the PCB. The pin located on one side of the first surface or one side of the second surface of the PCB is a surface-layer copper etching pattern that is located on the PCB and that is exposed outside the packaged module.

A power connector for an aircraft solid state power controller includes a first portion including a socket configured for receiving an electric plug, which is inserted into the socket in a receiving direction (R). The controller also includes a second portion comprising a connection surface configured for mating with a complementary connection surface of a complementary connection element. At least one opening is formed within the connection surface.

According to an embodiment of the present disclosure, an electronic device comprise a housing including a mounting hole in which a battery module is mounted and a printed circuit board disposed adjacent to the mounting hole and electrically connected with the battery module, wherein the battery module include a battery cell having a connector projecting in a first direction, a terminal circuit including at least one connecting terminal electrically connected with the connector, a supporting case disposed at a side of the battery cell, seating the terminal circuit therein, and having an opening to expose at least part of the connecting terminal of the terminal circuit, and at least one upper film unit disposed facing a surface of the supporting case to protect the battery cell or the terminal circuit. According to the present disclosure, an electronic device including a battery module eliminates the need for an FPCB, leading to cost savings and simplified assembly.

High density pluggable electrical connector having a number of electrical contacts exceeding sixty and a contact density on a plugging interface of the connector of at least forty contacts per square centimeter, comprising a casing and a terminal unit mounted within the casing, the terminal unit comprising a housing with a module receiving cavity formed within the housing, and a plurality of terminal modules insertably received in the module receiving cavity in a stacked arrangement. Each terminal module comprises a plurality of contacts mounted in a dielectric terminal module housing, the terminal modules having a width W to height H ratio W/H greater than three.

A connector includes a housing; a cage surrounding the housing; first contacts that are located in the housing and that transmit high-speed signals; second contacts that are located in the housing, that transmit low-speed signals, and that each include a portion that extends from a top surface of the housing; first cables connected to the first contacts; and second cables connected to the second contacts.

An expansion module system includes a board having a plurality of expansion modules connectors mounted to the board. A shared expansion module coupling feature is provided on the board and includes a coupling member. A respective expansion module is connected to each of the plurality of expansion module connectors, and the coupling member engages each of the respective expansion modules to secure each of the respective expansion modules in their respective expansion module connectors. The shared expansion module coupling feature may includes a standoff that is mounted to the board immediately adjacent a single hole defined by the board, and the coupling member may be provided by a single screw that engages each of the respective expansion modules and at least one of: the shared expansion module coupling feature and the portion of the board that defines the hole.

An electrical connector includes an insulative housing defining a space. A connection module is received within the space. The connection module includes a pair of contact modules commonly sandwiching a grounding module therebetween in the transverse direction. Each contact module includes a plurality of contacts integrally formed within the corresponding insulative wafer via insert-molding. The grounding module includes a grounding plate embedded within an insulative wafer. The grounding plate forms a plurality of fingers respectively electrically and mechanically connecting to the corresponding grounding contacts of the contact modules. The wafer forms a plurality of transverse grooves to receive corresponding grounding bars each having a plurality of inward parts respectively mechanically and electrically connecting to the grounding plate, and a plurality of outward parts respectively mechanically and electrically connecting to the grounding contacts of the contact modules.

A fan connector comprises a connector body, a plurality of chip terminals, a plurality of wiring terminals, and a chip circuit board. The connector body comprises an electrical connection slot, a chip slot, and a wiring slot. The plurality of chip terminals and the plurality of wiring terminals are disposed on a sidewall of the electrical connection slot. The plurality of chip terminals corresponds to the plurality of wiring terminals, respectively. The chip circuit board comprises a chip, a circuit board, and a plurality of conductive pads. The chip circuit board is inserted into the chip slot. The plurality of conductive pads is in contact with the corresponding chip terminals. One end of the connector body is connected to a fan, in which a wire passes through the wiring slot and connects to the plurality of wiring terminals. An external plug is possible to insert into the electrical connection slot.