A wire harness including: a tube that is made of metal; a plurality of electrical wires that are inserted into the tube; and a plurality of shields that are formed by braided wires in which conductive strands are woven into a tubular shape, and include tubular portions that respectively cover portions of the electrical wires located outside the tube, wherein portions at one end of the plurality of shields are put together and are fixed to the tube.

An electrical connector includes a substrate and multiple terminals. The substrate is provided with multiple accommodating holes running through the substrate vertically. A shielding member is provided on a lower surface of the substrate. The terminals are correspondingly accommodated in the accommodating holes respectively. The terminals include multiple signal terminals and at least one ground terminal. An interval exists between the ground terminal and the shielding member. The ground terminal has a conducting portion extending downward out of a corresponding accommodating hole. The conducting portion is soldered to a main circuit board through a solder, and the solder is in contact with the conducting portion and the shielding member. According to the present invention, the conducting portion of the ground terminal is connected with the shielding member through the solder, thereby reducing a spurious charge, reducing the capacitance, and improving a high frequency.

A connector system, method and apparatus for an EMI enclosure such as a Gauss/Faraday cage or chamber. The connector system, method and/or apparatus includes one or more individual conductors located within the EMI enclosure to eliminate EMI/E&H field effects with respect to applications such as a small form factor cable applications, high density cable applications, and a high speed (e.g., greater than 1 Gbps) multiconductor copper-based cable applications. This approach therefore isolates individual or multiple cable signals (e.g., single conductors) within individual Gaussian/Faraday cages to eliminate EMI/E&H field effects for small form factor, high density, high speed (e.g., >1 Gbps) multiconductor copper based cable applications.

A wire harness including a wire and a connector, wherein the connector includes a connector main body that is partially or entirely made of a conductive resin or is partially formed by a conductive portion, a shield that is made of a conductive metal and covers a periphery of the connector main body, and a conductive elastic member that is provided between the connector main body and the shield, a circumference of the wire is covered by a tube, the tube including a heat-shrinkable shielding tube having a conductive portion that is configured to surround the circumference of the wire, and in a state in which the tube is attached to an attachment of the connector main body, the conductive portion of the tube, the connector main body, the conductive elastic member, and the shield are electrically connected to each other.

A connector system, method and apparatus for an EMI enclosure such as a Gauss/Faraday cage or chamber. The connector system, method and/or apparatus includes one or more individual conductors located within the EMI enclosure to eliminate EMI/E&H field effects with respect to applications such as a small form factor cable applications, high density cable applications, and a high speed (e.g., greater than 1 Gbps) multiconductor copper-based cable applications. This approach therefore isolates individual or multiple cable signals (e.g., single conductors) within individual Gaussian/Faraday cages to eliminate EMI/E&H field effects for small form factor, high density, high speed (e.g., >1 Gbps) multiconductor copper based cable applications.

The present disclosure provides a connector enabling a size reduction by simplifying a configuration. A connector 11 includes a housing 21 in which a plurality of shielded cables 14 are held while being partially inserted, and cores of the plurality of shielded cables 14 are connected to a plurality of terminals 13a of a mating connector 13 by connecting the housing 21 to the mating connector 13. The connector 11 includes an electromagnetic shielding shell 22 for covering the outer surface of the housing 21 and a shield terminal 27 to be provided between the plurality of shielded cables 14 in the housing 21, connected to shield members of the plurality of shielded cables 14 and connected to a ground terminal 13b of the mating connector 13 by connecting the housing 21 to the mating connector 13.

A shield connector is formed such that an electrical wire shield portion at an end of an electrical shield wire is removed to expose a plurality of single shield wires; connection terminals are each connected to the conductor at an end of each exposed single shield wire; the connection terminals are held in an inner housing; the inner housing and the single shield wires are sheathed with a shield shell; and an attachment piece integrated with the shield shell is fixedly attached to an end of the electrical shield wire. The shield shell is provided with a connector shield member, and the connector shield member is electrically connected to single wire shield portions of the exposed single shield wires.

An antenna feeding network for a multi-radiator antenna, the antenna feeding network comprising at least two coaxial lines, wherein each coaxial line comprises an elongated central inner conductor and an elongated outer conductor surrounding the central inner conductor. At least one connector device is configured to interconnect at least a first inner conductor and a second inner conductor of the central inner conductors. The connector device comprises at least one engaging portion, each being configured to engage with at least one corresponding surface portion formed on the envelope surface of the first or second inner conductor. The envelope surface is furthermore provided with at least one recess provided adjacent at least one surface portion.

A shield terminal (12) includes inner conductors (14) having tabs (16) projecting forward from bodies (15), a dielectric (21) formed with conductor accommodation chambers (36) inside and configured to hold the inner conductors (14) with the bodies (15) accommodated in the conductor accommodation chambers (36), an outer conductor (37) for surrounding the dielectric (21) and the tabs (16), and walls (23, 31 and 32) constituting the conductor accommodation chambers (36) and formed with air chambers (43 to 50). Focusing on the fact that air has a lower dielectric constant than synthetic resin, the air chambers (43 to 50) are formed in the walls (23, 31 and 32) constituting the conductor accommodation chambers (36). This enables an impedance to be enhanced even if the dielectric (21) is made of a material having high rigidity.

A shield terminal (12) includes a dielectric (22) made of synthetic resin and formed with conductor accommodation chambers (39) inside, inner conductors (15) accommodated in the conductor accommodation chambers (39), an outer conductor (14) for surrounding the dielectric (22), and wall portions (24, 35) constituting the conductor accommodation chambers (39) and formed with air chambers (42, 43, 45 and 46). Focusing on the fact that air has a lower dielectric constant than synthetic resin, the air chambers (42, 43, 45 and 46) are formed in the wall portions (24, 35) constituting the conductor accommodation chambers (39). This enables an impedance to be enhanced even if the dielectric (22) is made of a material having high rigidity.