An embodiment includes a light source. The light source may include a substrate and a diffuser. The substrate may include a first surface and a second surface. The second surface may be opposite the first surface. The diffuser may be carried by the substrate. The diffuser may be configured to receive an optical signal from the substrate after the optical signal propagates through the substrate and to control a particular profile of a resultant beam of the optical signal over two axes after the optical signal propagates through the integrated diffuser.

An embodiment includes a light source. The light source may include a substrate and a diffuser. The substrate may include a first surface and a second surface. The second surface may be opposite the first surface. The diffuser may be carried by the substrate. The diffuser may be configured to receive an optical signal from the substrate after the optical signal propagates through the substrate and to control a particular profile of a resultant beam of the optical signal over two axes after the optical signal propagates through the integrated diffuser.

A method for use in manufacturing an optical emitter arrangement comprises holding an electrically conductive base member and two electrically conductive base elements in a predetermined spatial relationship, and providing two electrically conductive projections, wherein each projection extends in a direction away from a surface of a corresponding one of the base elements and wherein each projection terminates at a corresponding outer end. The method further comprises bringing a projecting portion of a surface profile of a mold tool into engagement with an area of a surface of the base member whilst bringing other portions of the surface profile of the mold tool into engagement with the outer ends of the projections so as to form a void that extends away from the surface of the base member around the projecting portion of the surface profile of the mold tool and that extends away from the surface of each of the base elements around each projection without extending over the outer end of each projection. The method further comprises injecting an electrically insulating plastic material into the void and curing the plastic material so as to form an electrically insulating housing that extends away from the surface of the base member so as to define a space for accommodating an optical emitter device, wherein the space extends away from the area of the surface of the base member, and wherein the housing also extends away from the surface of each of the base elements around each projection without covering the outer end of each projection. The method may be used, in particular though not exclusively, for manufacturing an optical emitter arrangement for a projector or an illuminator such as flood illuminator.

A method for use in manufacturing an optical emitter arrangement comprises holding an electrically conductive base member and two electrically conductive base elements in a predetermined spatial relationship, and providing two electrically conductive projections, wherein each projection extends in a direction away from a surface of a corresponding one of the base elements and wherein each projection terminates at a corresponding outer end. The method further comprises bringing a projecting portion of a surface profile of a mold tool into engagement with an area of a surface of the base member whilst bringing other portions of the surface profile of the mold tool into engagement with the outer ends of the projections so as to form a void that extends away from the surface of the base member around the projecting portion of the surface profile of the mold tool and that extends away from the surface of each of the base elements around each projection without extending over the outer end of each projection. The method further comprises injecting an electrically insulating plastic material into the void and curing the plastic material so as to form an electrically insulating housing that extends away from the surface of the base member so as to define a space for accommodating an optical emitter device, wherein the space extends away from the area of the surface of the base member, and wherein the housing also extends away from the surface of each of the base elements around each projection without covering the outer end of each projection. The method may be used, in particular though not exclusively, for manufacturing an optical emitter arrangement for a projector or an illuminator such as flood illuminator.

A light emitting device comprises: a semiconductor laser element; a base portion comprising: a bottom portion on which the semiconductor laser element is located, and a frame portion comprising a step and surrounding the semiconductor laser element; and a light reflecting member disposed on the bottom portion of the base portion so as to lean against the step, the light reflecting member being configured to reflect light from the semiconductor laser element.

A light emitting device comprises: a semiconductor laser element; a base portion comprising: a bottom portion on which the semiconductor laser element is located, and a frame portion comprising a step and surrounding the semiconductor laser element; and a light reflecting member disposed on the bottom portion of the base portion so as to lean against the step, the light reflecting member being configured to reflect light from the semiconductor laser element.

In one embodiment the semiconductor laser (1) comprises a carrier (2) and an edge-emitting laser diode (3) which is mounted on the carrier (2) and which comprises an active zone (33) for generating a laser radiation (L) and a facet (30) with a radiation exit region (31). The semiconductor laser (1) further comprises a protective cover (4), preferably a lens for collimation of the laser radiation (L). The protective cover (4) is fastened to the facet (30) and to a side surface (20) of the carrier (2) by means of an adhesive (5). A mean distance between a light entrance side (41) of the protective cover (4) and the facet (30) is at most 60 μm. The semiconductor laser (1) is configured to be operated in a normal atmosphere without additional gas-tight encapsulation.

In one embodiment the semiconductor laser (1) comprises a carrier (2) and an edge-emitting laser diode (3) which is mounted on the carrier (2) and which comprises an active zone (33) for generating a laser radiation (L) and a facet (30) with a radiation exit region (31). The semiconductor laser (1) further comprises a protective cover (4), preferably a lens for collimation of the laser radiation (L). The protective cover (4) is fastened to the facet (30) and to a side surface (20) of the carrier (2) by means of an adhesive (5). A mean distance between a light entrance side (41) of the protective cover (4) and the facet (30) is at most 60 μm. The semiconductor laser (1) is configured to be operated in a normal atmosphere without additional gas-tight encapsulation.

Semiconductor devices, such as vertical-cavity surface-emitting lasers, and methods for manufacturing the same, are disclosed. The semiconductor devices include contact extensions and electrically conductive adhesive material, such as fusible metal alloys or electrically conductive composites. In some instances, the semiconductor devices further include structured contacts. These components enable the production of semiconductor devices having minimal distortion. For example, arrays of vertical-cavity surface-emitting lasers can be produced exhibiting little to no bowing. Semiconductor devices having minimal distortion exhibit enhanced performance in some instances.

Semiconductor devices, such as vertical-cavity surface-emitting lasers, and methods for manufacturing the same, are disclosed. The semiconductor devices include contact extensions and electrically conductive adhesive material, such as fusible metal alloys or electrically conductive composites. In some instances, the semiconductor devices further include structured contacts. These components enable the production of semiconductor devices having minimal distortion. For example, arrays of vertical-cavity surface-emitting lasers can be produced exhibiting little to no bowing. Semiconductor devices having minimal distortion exhibit enhanced performance in some instances.