A phosphor element includes an incident face for an excitation light, an emitting face opposing the incident face and a side face, and the element converts at least a part of the incident excitation light incident onto the incident face to fluorescence and emits the fluorescence from the emitting face. The emitting face has an area larger than an area of the incident face. The phosphor element comprises an inclination region in which an inclination angle of the side face with respect to a vertical axis perpendicular to the emitting face is monotonously increased from the incident face toward the emitting face, viewed in a cross-section perpendicular to the emitting face and along the longest dividing line halving the emitting face.

A semiconductor laser includes a first mirror layer, a second mirror layer, an active layer, a first area provided continuously with the first mirror layer and including a plurality of first oxidized layers, and a second area provided continuously with the second mirror layer and including a plurality of second oxidized layers. The first mirror layer, the second mirror layer, the active layer, the first area, and the second area form a laminate. The laminate includes in the plan view a first section, a second section, and a third section disposed between the first section and the second section along a first axis and causing light produced in the active layer to resonate. The amount of strain per unit volume in the second mirror layer of the third section is measured along a second axis perpendicular to the first axis and passing through the center of the third section in the plan view, and the difference between the maximum of the amount of strain and the minimum thereof is smaller than 0.20%.

A VCSEL can include: an elliptical oxide aperture in an oxidized region that is located between an active region and an emission surface, the elliptical aperture having a short radius and a long radius with a radius ratio (short radius)/(long radius) being between 0.6 and 0.8, the VCSEL having a relative intensity noise (RIN) of less than −140 dB/Hz. The VCSEL can include an elliptical emission aperture having the same dimensions of the elliptical oxide aperture. The VCSEL can include an elliptical contact having an elliptical contact aperture therein, the elliptical contact being around the elliptical emission aperture. The elliptical contact can be C-shaped. The VCSEL can include one or more trenches lateral of the oxidized region, the one or more trenches forming an elliptical shape, wherein the oxidized region has an elliptical shape. The one or more trenches can be trapezoidal shaped trenches.

An embodiment relates to a surface emitting laser device and a light emitting device including the same. The surface emitting laser device according to an embodiment may comprise: a substrate; a first reflective layer arranged on the substrate; an active layer arranged on the first reflective layer; an aperture layer arranged on the active layer and comprising an opening; a second reflective layer arranged on the active layer; a transparent electrode layer arranged on the second reflective layer; and a metal electrode layer arranged on the transparent electrode layer. The transparent electrode layer may comprise a first area perpendicularly overlapping the opening and multiple second areas extending from the first area. The multiple second areas may be arranged outside the opening along the circumferential direction of the opening and spaced apart from each other. The multiple second areas may be arranged and spaced apart from each other so as to correspond to the circumference of the opening. The metal electrode layer may electrically contact the second reflective layer between the multiple second areas.

A semiconductor device comprises a substrate and a plurality of emitters disposed on the substrate. The emitter may comprise: a first conductive reflection layer having a first reflectivity; an active layer disposed on the first conductive reflection layer; an aperture layer disposed on the active layer and comprising an aperture region and a blocking region surrounding the aperture region; and a second conductive reflection layer disposed on the aperture layer and having a second reflectivity smaller than the first reflectivity. A diameter-to-pitch ratio of the aperture region of the aperture layer is 1:3 to 1:5, wherein the pitch may be defined as the distance between centers of aperture regions of aperture layers of adjacent emitters.

The embodiment relates to a surface emitting laser device and a light emitting device including the same.

The surface-emitting laser device according to the embodiment includes a first reflective layer, an active region disposed on the first reflective layer, a plurality of aperture regions disposed on the active region, including an aperture and an insulating region, a second reflective layer disposed on the aperture region, and a first electrode and a second electrode electrically connected to the first reflective layer and the second reflective layer, respectively.

In the aperture region, an outer periphery of the insulating region may have a circular shape, and an outer periphery of the aperture may have a polygonal shape.

A surface-emitting laser includes a substrate, a lower reflector layer disposed on the substrate, an active layer disposed on the lower reflector layer, and an upper reflector layer disposed on the active layer. The lower reflector layer, the active layer, and the upper reflector layer form a mesa. The mesa has a current confinement structure. The current confinement structure includes a current confinement layer. The current confinement layer includes an oxide layer extending from a periphery of the mesa and an aperture surrounded by the oxide layer. The aperture overlaps the active layer. The aperture has a major axis and a minor axis. A length of the major axis is twice or more a length of the minor axis.

A vertical-cavity surface-emitting laser (VCSEL) device includes a substrate, first and second-type doped distributed Bragg reflectors, first and second electrodes, an active layer, a surface relief layer having a surface relief indentation of a diameter (d4) ranging from 1.0-6.0 um, and a confinement member defining an aperture with a diameter (d2) ranging from 3.0-15 m. The second electrode is a ring-shaped p-contact metal having an inner diameter (d3) ranging from 8-17 m. The VCSEL device has a mesa structure that has a bottom mesa diameter (d1) ranging from 16-28 m. The diameters satisfy the relation of d1>d2>d3>d4. The surface relief layer has a thickness equaling to n/4 times a wavelength of a laser beam generated by the active layer with n being positive even numbers.

A surface emitting laser includes a substrate, semiconductor layers on the substrate, a light transmitting window configured to transmit laser light from the semiconductor layers, a first electrode pad, a second electrode pad, a first dummy pad, and a second dummy pad, wherein the first electrode pad, the second electrode pad, the first dummy pad, and the second dummy pad are disposed on the semiconductor layers at a place different from the light transmitting window, and wherein the substrate is classified into first through fourth regions by a straight line extending in a first direction and a straight line extending in a second direction perpendicular to the first direction, the first electrode pad being situated in the first region, the second electrode pad being situated in the second region, the first dummy pad being situated in the third region, and the second dummy pad being situated in the fourth region.

A surface-emitting laser includes a substrate; semiconductor layers provided on the substrate, the semiconductor layers including a lower reflector layer, an active layer, and an upper reflector layer, the semiconductor layers forming a mesa; a first insulating film covering the mesa; and a second insulating film covering the first insulating film, wherein the mesa has a polygonal shape in a direction in which the substrate extends, and a vertex of the mesa in the direction in which the substrate extends has a chamfered portion.