A VCSEL array has VCSEL sub-arrays having VCSELs on a substrate. The sub-arrays are electrically contacted by a first electrical contact arrangement common to the VCSELs within a respective sub-array and a second electrical contact arrangement. The second electrical contact arrangement has second electrical contacts contacting a respective VCSEL within the respective sub-array, individually. The second electrical contacts each has a second metal-semiconductor interface to a second semiconductor layer of an associated VCSEL. The second electrical contacts pump the VCSEL along a current path to the first electrical contact arrangement. Current paths between the first electrical contact arrangement and the second electrical contacts via the VCSELs have a symmetry selected out of the group of rotation symmetry, mirror symmetry, and translation symmetry. The first electrical contact arrangement and the second electrical contact arrangement are arranged on the same side of the substrate.

A Vertical Cavity Surface Emitting Laser (VCSEL) includes a VCSEL array, a multitude of detectors, a first electrical laser contact, and at least one second electrical laser contact. The VCSEL array comprises a multitude of laser diodes, each laser diode including an optical resonator having a first distributed Bragg reflector, a second distributed Bragg reflector and an active layer for light emission, the active layer being arranged between the first distributed Bragg reflector and the second distributed Bragg reflector. The first electrical laser contact and the at least one second electrical laser contact are arranged to provide an electrical drive current to electrically pump the optical resonators of the laser diodes. Each detector is arranged to generate an electrical self-mixing interference measurement signal associated to at least one laser diode upon reception of the laser light.

A laser arrangement includes a laser array, and an optical arrangement. The laser array includes lasers in a first pattern emitting a same laser emission profile around a first optical axis with a divergence angle θ/2. The optical arrangement has a diffusor with an array of optical elements in a second pattern, with a second optical axis, and with an illumination pattern along a first illumination axis in a field-of-view if laser light is received within a defined range smaller than or equal to a range of angles between −/+θ with respect to the second optical axis. A row of lasers parallel to the first illumination axis has a pitch p. A row of m optical elements is parallel to the first axis. Each optical element has a diameter L, and contacts its neighbor. The n lasers and the m optical elements satisfy n*p=m*L with a deviation smaller than +/−5%.

A light-emitting device according to an embodiment of the present disclosure includes a laminate. The laminate includes an active layer, a first semiconductor layer, and a second semiconductor layer. The first semiconductor layer and the second semiconductor layer sandwich the active layer in between. The light-emitting device further includes a current confining layer, a concave-shaped first reflecting mirror provided on side of the first semiconductor layer, and a second reflecting mirror provided on side of the second semiconductor layer. The current confining layer has an opening. The first reflecting mirror and the second reflecting mirror sandwich the laminate and the opening in between. The light-emitting device further includes a first reflecting layer and a phosphor layer. The first reflecting layer is disposed at a position opposed to the first reflecting mirror with a predetermined gap in between. The phosphor layer is disposed between the first reflecting mirror and the first reflecting layer, and performs wavelength conversion on light leaking from the first reflecting mirror.

A LIDAR system includes a plurality of lasers that generate an optical beam having a FOV. A plurality of detectors are positioned where a FOV of at least one of the plurality of optical beams generated by the plurality of lasers overlaps a FOV of at least two of the plurality of detectors. The lens system collimates and projects the optical beams generated by the plurality of lasers. An actuator is coupled to at least one of the plurality of lasers and the lens system to cause relative motion between the plurality of lasers and the lens system in a direction that is orthogonal to an optical axis of the lens system so as to cause relative motion between the FOVs of the optical beams generated by the plurality of lasers and the FOVs of the detectors.

A VCSEL device includes a substrate and a first DBR structure disposed on the substrate. The VCSEL device further includes a cathode contact disposed on a top surface of the first DBR structure. In addition, the VCSEL device includes a VCSEL mesa that is disposed on the top surface of the first DBR structure. The VCSEL mesa includes a quantum well, a non-circularly-shaped oxide aperture region disposed above the quantum well, and a second DBR structure disposed above the non-circularly-shaped oxide aperture region. In addition, the VCSEL mesa includes a selective polarization structure disposed above the second DBR structure and an anode contact disposed above the selective polarization structure.

An illumination apparatus includes a first semiconductor layer comprising a plurality of emitters that are electrically interconnected in or on the first semiconductor layer, and a second semiconductor layer that is bonded to the first semiconductor layer in a stacked arrangement. The second semiconductor layer comprises a plurality of transistors that are electrically connected to respective emitters or subsets of the plurality of emitters at a bonding interface between the first and second semiconductor layers. Related systems and methods of fabrication are also discussed.

A laser arrangement includes a VCSEL array comprising multiple VCSELs arranged on a common semiconductor substrate, an optical structure, and a diffusor structure. The optical structure is arranged to reduce a divergence angle of laser light emitted by each respective VCSEL to a section of the diffusor structure assigned to the respective VCSEL. The diffusor structure is arranged to transform the laser light received from the optical structure to transformed laser light such that a continuous illumination pattern is configured to be provided in a reference plane in a defined field-of-view. The diffusor structure is arranged to increase a size of the illumination pattern in comparison to an untransformed illumination pattern which can be provided without the diffusor structure. The VCSEL array, optical structure, and diffusor structure are arranged such that sections of the diffusor structure do not overlap. Diffusor properties of the diffusor structure vary across the diffusor structure.

A VCSEL/VECSEL array design is disclosed that results in arrays that can be directly soldered to a PCB using conventional surface-mount assembly and soldering techniques for mass production. The completed VCSEL array does not need a separate package and no precision sub-mount and flip-chip bonding processes are required. The design allows for on-wafer probing of the completed arrays prior to singulation of the die from the wafer. Embodiments relate to semiconductor devices, and more particularly to multibeam arrays of semiconductor lasers for high power and high frequency applications and methods of making and using the same.

Disclosed herein are various embodiments for high performance wireless data transfers. In an example embodiment, laser chips are used to support the data transfers using laser signals that encode the data to be transferred. The laser chip can be configured to (1) receive a digital signal and (2) responsive to the received digital signal, generate and emit a variable laser signal, wherein the laser chip comprises a laser-emitting epitaxial structure, wherein the laser-emitting epitaxial structure comprises a plurality of laser-emitting regions within a single mesa structure that generate the variable laser signal. Also disclosed are a number of embodiments for a photonics receiver that can receive and digitize the laser signals produced by the laser chips. Such technology can be used to wireless transfer large data sets such as lidar point clouds at high data rates.