Patent classifications
H01S5/18388
III-NITRIDE-BASED VERTICAL CAVITY SURFACE EMITTING LASER (VCSEL) CONFIGURATIONS
Vertical Cavity Surface Emitting Laser (VCSEL) configurations are disclosed. In a first example, the VCSEL includes a III-Nitride active region between a p-type III-Nitride layer and an n-type III-Nitride layer; and a curved minor on or above the p-type III-Nitride layer. The curved mirror can be formed in a III-Nitride layer or a Transparent Oxide (TO) material and enables the formation of a long VCSEL cavity that improves VCSEL lifetime, VCSEL output power, VCSEL power efficiency and VCSEL reliability. In a second example, the VCSEL has an active region with a high indium content. In a third example, the VCSEL is transparent.
Infrared-Laser Source Device
An infrared-laser source device provided with an external housing, said external housing comprising: a light output interface arranged in a front part of the external housing, at least one infrared-laser source arranged in a rear part of the external housing and configured to emit an IR-laser beam providing a first emitting area at the light output interface, and a first light distributing element configured to diverge light at the light output interface, wherein said infrared-laser source device further comprises a second light distributing element separated from the first light distributing element and providing, at the light output interface, a second emitting area larger than the first emitting area.
MONOLITHIC LIGHT SOURCE WITH INTEGRATED OPTICS BASED ON NONLINEAR FREQUENCY CONVERSION
A semiconductor light source including a planar optical component that focuses long-wavelength (e.g., infrared) light emitted in a resonant cavity into a nonlinear crystal, which then converts the long-wavelength light into light having a shorter wavelength (e.g., visible light) by frequency doubling. A wavelength-selective reflection layer on the nonlinear crystal reflects the long-wavelength light back into the resonant cavity to form an external cavity and transmits the light having the shorter wavelength out of the external cavity. The resonant cavity includes an active region that emits the long-wavelength light at a high efficiency. The planar optical component includes a micro-lens formed in semiconductor layers or a gradient refractive index lens formed in the nonlinear crystal.
Microlens array with tailored sag profile
An optical device includes a first array of emitters disposed on a substrate and configured to emit respective beams of optical radiation in a direction perpendicular to the substrate. A second array of microlenses is positioned on the substrate in alignment with the respective beams of the emitters, having respective sag profiles that vary over an area of the substrate. The second array includes at least first microlenses in a central region of the substrate and second microlenses in a peripheral region of the substrate, such that the first microlenses have respective first focal powers, while the second microlenses have respective second focal powers, which are less than the first focal powers.
COUPLED-CAVITY VCSELS FOR ENHANCED MODULATION BANDWIDTH
Coupled-cavity vertical cavity surface emitting lasers (VCSELs) are provided by the present disclosure. The coupled-cavity VCSEL can comprise a VCSEL having a first mirror, a gain medium disposed above the first mirror, and a second mirror disposed above the gain medium, wherein a first cavity is formed by the first mirror and the second mirror. A second cavity is optically coupled to the VCSEL and configured to reflect light emitted from the VCSEL back into the first cavity of the VCSEL. In some embodiments, the second cavity can be an external cavity optically coupled to the VCSEL through a coupling component. In some embodiments, the second cavity can be integrated with the VCSEL to form a monolithic coupled-cavity VCSEL. A feedback circuit can control operation of the coupled-cavity VCSEL so the output comprises a target high frequency signal.
STRUCTURED ILLUMINATION DEVICES
An illumination device includes an emission layer including a semiconductor-based light emitter; and an optical layer disposed on the emission layer. The optical layer includes an optical element, such as a lens, at least partially aligned with the semi-conductor-based light emitter. The optical layer is formed of a material having a negative coefficient of thermal expansion (CTE). For instance, the semiconductor-based light emitter is configured to emit light at a wavelength λ, and in which a pitch p of the MLA, a thickness z of the optical layer, and the wavelength λ satisfy a predefined relationship.
BACK SIDE EMITTING LIGHT SOURCE ARRAY DEVICE AND ELECTRONIC APPARATUS HAVING THE SAME
Provided is a back side emitting light source array device and an electronic apparatus, the back side emitting light source array device includes a substrate, a distributed Bragg reflector (DBR) provided on a first surface of the substrate, a plurality of gain layers which are provided on the DBR, the plurality of gain layers being spaced apart from one another, and each of the plurality of gain layers being configured to individually generate light, and a nanostructure reflector provided on the plurality of gain layers opposite to the DBR, and including a plurality of nanostructures having a sub-wavelength shape dimension, wherein a reflectivity of the DBR is less than a reflectivity of the nanostructure reflector such that the light generated is emitted through the substrate.
Light-emitting device and method of manufacturing light-emitting device
A light-emitting device according to an embodiment of the present disclosure includes a laminate. The laminate includes an active layer, and a first semiconductor layer and a second semiconductor layer sandwiching the active layer. This light-emitting device further includes a current constriction layer having an opening and a vertical resonator including a first reflecting mirror having a concave-curved shape on the first semiconductor layer side and a second reflecting mirror on the second semiconductor side. The first reflecting mirror and the second reflecting mirror sandwich the laminate and the opening. This light-emitting device further includes an optically transparent substrate between the first reflecting mirror and the laminate. The optically transparent substrate has a first convex portion having a convex-curved shape and one or more second convex portions on a surface on the side opposite to the laminate. The first convex portion is in contact with the first reflecting mirror. The one or more second convex portions are provided around the first convex portion. The one or more second convex portions each have a height greater than or equal to a height of the first convex portion, and an end on the first reflecting mirror side has a convex-curved shape.
Laser grid structures for wireless high speed data transfers
Disclosed herein are various embodiments for high performance wireless data transfers. In an example embodiment, laser chips are used to support the data transfers using laser signals that encode the data to be transferred. The laser chip can be configured to (1) receive a digital signal and (2) responsive to the received digital signal, generate and emit a variable laser signal, wherein the laser chip comprises a laser-emitting epitaxial structure, wherein the laser-emitting epitaxial structure comprises a plurality of laser-emitting regions within a single mesa structure that generate the variable laser signal. Also disclosed are a number of embodiments for a photonics receiver that can receive and digitize the laser signals produced by the laser chips. Such technology can be used to wireless transfer large data sets such as lidar point clouds at high data rates.
LIGHT EMITTING ELEMENT AND METHOD FOR MANUFACTURING THE SAME
A light emitting element includes: a laminated structural body 20 in which a first compound semiconductor layer 21, an active layer 23, and a second compound semiconductor layer 22 are laminated; a first electrode 31 electrically connected to the first compound semiconductor layer 21; and a second electrode 32 and a second light reflecting layer 42 formed on the second compound semiconductor layer 22, in which a protrusion 43 is formed on the first surface side of the first compound semiconductor layer 21, a smoothing layer 44 is formed on at least the protrusion 43, the protrusion 43 and the smoothing layer 44 constitute a concave mirror portion, a first light reflecting layer 41 is formed on at least a part of the smoothing layer 44, and the second light reflecting layer 42 has a flat shape.