Patent classifications
H01S5/32391
Externally-Strain-Engineered Semiconductor Photonic and Electronic Devices and Assemblies and Methods of Making Same
Externally-strained devices such as LED and FET structures as discussed herein may have strain applied before or during their being coupled to a housing or packaging substrate. The packaging substrate may also be strained prior to receiving the structure. The strain on the devices enables modulation of light intensity, color, and electrical currents in some embodiments, and in alternate embodiments, enables a fixed strain to be induced and maintained in the structures.
Integrated high-power tunable laser with adjustable outputs
A tunable laser that includes an array of parallel optical amplifiers is described. The laser may also include an intracavity NM coupler that couples power between a cavity mirror and the array of parallel optical amplifiers. Phase adjusters in optical paths between the NM coupler and the optical amplifiers can be used to adjust an amount of power output from M1 ports of the NM coupler. A tunable wavelength filter is incorporated in the laser cavity to select a lasing wavelength.
Systems and methods for optical full-field transmission using photonic integration
An optical full-field transmitter for an optical communications network includes a primary laser source configured to provide a narrow spectral linewidth for a primary laser signal, and a first intensity modulator in communication with a first amplitude data source. The first intensity modulator is configured to output a first amplitude-modulated optical signal from the laser signal. The transmitter further includes a first phase modulator in communication with a first phase data source and the first amplitude-modulated optical signal. The first phase modulator is configured to output a first two-stage full-field optical signal. The primary laser source has a structure based on a III-V compound semiconductor.
Externally-Strain-Engineered Semiconductor Photonic and Electronic Devices and Assemblies and Methods of Making Same
Externally-strained devices such as LED and FET structures as discussed herein may have strain applied before or during their being coupled to a housing or packaging substrate. The packaging substrate may also be strained prior to receiving the structure. The strain on the devices enables modulation of light intensity, color, and electrical currents in some embodiments, and in alternate embodiments, enables a fixed strain to be induced and maintained in the structures.
INTEGRATED HIGH-POWER TUNABLE LASER WITH ADJUSTABLE OUTPUTS
A tunable laser that includes an array of parallel optical amplifiers is described. The laser may also include an intracavity NM coupler that couples power between a cavity mirror and the array of parallel optical amplifiers. Phase adjusters in optical paths between the NM coupler and the optical amplifiers can be used to adjust an amount of power output from M-1 ports of the NM coupler. A tunable wavelength filter is incorporated in the laser cavity to select a lasing wavelength.
Vertically integrated electro-absorption modulated lasers and methods of fabrication
Electro-absorption modulators (EAM) and monolithically integrated electro-absorption modulated lasers (EML) and methods of fabrication are disclosed. Vertically stacked waveguides for a distributed feedback (DFB) laser, an electro-absorption modulator (EAM) and a passive output waveguide are vertically integrated, and the DFB laser, EAM and output waveguide are optically coupled using laterally tapered vertical optical couplers. Laterally tapered vertical optical couplers provides an alternative to conventional butt-coupling of a laser and EAM, offering improved reliability for high power operation over extended lifetimes. Optionally, the EML comprises monolithically integrated electronic circuitry, e.g., driver and control electronics for the DFB laser and EAM. Beneficially, integrated EAM driver and control circuitry comprises a high-speed electro-optical control loop for very high-speed linearization and temperature compensation, e.g. to enable advanced modulation schemes, such as PAM-4 and DP-QPSK, for analog optical data center interconnect applications. Some embodiments are compatible with fabrication using a single epitaxial growth.
Integrated high-power tunable laser with adjustable outputs
A tunable laser that includes an array of parallel optical amplifiers is described. The laser may also include an intracavity NM coupler that couples power between a cavity mirror and the array of parallel optical amplifiers. Phase adjusters in optical paths between the NM coupler and the optical amplifiers can be used to adjust an amount of power output from M1 ports of the NM coupler. A tunable wavelength filter is incorporated in the laser cavity to select a lasing wavelength.
VERTICALLY INTEGRATED ELECTRO-ABSORPTION MODULATED LASERS AND METHODS OF FABRICATION
Monolithically integrated electro-absorption modulated lasers (EML) and methods of fabrication are disclosed. Vertically stacked optical waveguides for a laser, such as a distributed feedback (DFB) laser, and an electro-absorption modulator (EAM) are vertically integrated, and the laser and EAM are optically coupled using a laterally tapered vertical optical coupler. A passive output waveguide may be provided. Laterally tapered vertical optical couplers provide an alternative to conventional butt-coupling of a laser and EAM, offering improved reliability for high power operation over extended lifetimes. The EML may comprise monolithically integrated electronic circuitry, e.g., driver and control electronics for the laser and EAM. Beneficially, integrated EAM driver and control circuitry comprises a high-speed electro-optical control loop for very high-speed linearization and temperature compensation, e.g. to enable advanced modulation schemes, such as PAM-4 and DP-QPSK, for analog optical data center interconnect applications. Some embodiments are compatible with fabrication using a single epitaxial growth.
VERTICALLY INTEGRATED ELECTRO-ABSORPTION MODULATED LASERS AND METHODS OF FABRICATION
Electro-absorption modulators (EAM) and monolithically integrated electro-absorption modulated lasers (EML) and methods of fabrication are disclosed. Vertically stacked waveguides for a distributed feedback (DFB) laser, an electro-absorption modulator (EAM) and a passive output waveguide are vertically integrated, and the DFB laser, EAM and output waveguide are optically coupled using laterally tapered vertical optical couplers. Laterally tapered vertical optical couplers provide an alternative to conventional butt-coupling of a laser and EAM, offering improved reliability for high power operation over extended lifetimes. The EML may comprise monolithically integrated electronic circuitry, e.g., driver and control electronics for the DFB laser and EAM. Beneficially, integrated EAM driver and control circuitry comprises a high-speed electro-optical control loop for very high-speed linearization and temperature compensation, e.g. to enable advanced modulation schemes, such as PAM-4 and DP-QPSK, for analog optical data center interconnect applications. Some embodiments are compatible with fabrication using a single epitaxial growth.
OPTICAL PACKAGE AND METHOD OF MANUFACTURE
A method includes forming a laser diode structure including an active layer sandwiched between an n-type contact layer and a p-type contact layer; forming an n-type contact on the n-type contact layer, wherein the n-type contact includes a first noble metal; forming a p-type contact on the p-type contact layer, wherein the p-type contact includes a second noble metal; forming a conductive routing layer on the n-type contact and on the p-type contact, wherein the conductive routing layer is free of noble metals, wherein the conductive routing layer fully covers the n-type contact and the p-type contact; and forming a passivation layer over the conductive routing layer.