H01S5/3432

Patterned metallization for hybrid metal-semiconductor mirror of high reflectivity

A reflector for optical devices is disclosed. The reflector includes a distributed Bragg reflector and a metal reflector. The metal reflector is contained within one or more apertures defined by a material having good adliesion to a semiconductor material. A method for bonding the resulting structure to a heat spreader is also disclosed.

Method of fabricating semiconductor light-emitting device and semiconductor light-emitting device

A method of fabricating a semiconductor light-emitting device includes: (a) forming a semiconductor layer including a light-emitting layer on the first surface of a substrate; (b) forming a first trench and a second trench in the semiconductor layer, the first trench extending in a first direction that is parallel to a principal plane of the substrate, and the second trench being disposed inside and parallel to the first trench; (c) forming a third trench parallel to the first trench in the second surface of the substrate opposite to the first surface of the substrate; and (d) forming a semiconductor light-emitting device by dividing the substrate. In (d), an end of at least one divided side of the semiconductor light-emitting device is in the second trench. The first trench has a first width, and the second trench has a second width. The second width is less than the first width.

Integrated vertical emitter structure having controlled wavelength

An optoelectronic device includes: (i) a semiconductor substrate doped with a first level of n-type dopants, (ii) a contact semiconductor layer disposed over the semiconductor substrate and doped with a second level of n-type dopants, larger than the first level, (iii) an upper distributed Bragg-reflector (DBR) stack disposed over the contact semiconductor layer and including alternating first and second epitaxial semiconductor layers having respective first and second indexes of refraction that differ from one another in a predefined wavelength band, (iv) a set of epitaxial layers disposed over the upper DBR, the set of epitaxial layers includes one or more III-V semiconductor materials and defines: (a) a quantum well structure, and (b) a confinement layer, and (v) a lower DBR stack disposed over the set of epitaxial layers, opposite the upper DBR, and including alternating dielectric and semiconductor layers.

Semiconductor laser device, chip on submount, and semiconductor laser module
11152762 · 2021-10-19 · ·

A semiconductor laser device of an edge emission type, where a waveguide mode is multi-mode, is provided. The semiconductor laser device includes a first facet of the waveguide on an emission direction front side, the first facet having a first width in a horizontal direction perpendicular to a longitudinal direction of the waveguide; and a second facet of the waveguide on an emission direction rear side, the second facet having the first width, wherein a width of the waveguide, in the horizontal direction, is at least partially narrower than the first width, between the first facet and the second facet.

SURFACE-EMITTING LASER AND METHOD OF MANUFACTURING THE SAME
20210320476 · 2021-10-14 · ·

A surface-emitting laser includes a first reflector layer, an active layer provided on the first reflector layer, and a second reflector layer provided on the active layer. The second reflector layer includes a corner reflector that tapers in a direction opposite to the first reflector layer, and the corner reflector has a plan shape of a circle or a polygon with an even number of vertexes.

DISTRIBUTED FEEDBACK (DFB) LASER ON SILICON AND INTEGRATED DEVICE COMPRISING A DFB LASER ON SILICON
20210273409 · 2021-09-02 ·

A distributed feedback (DFB) laser that includes a substrate comprising a first surface and a second surface, wherein the substrate comprises silicon; a plurality of shallow trench isolations (STIs) located over the second surface of the substrate; a grating region located over the plurality of STIs and the substrate, wherein the grating region comprises a III-V semiconductor material; a non-intentional doping (NID) region located over the grating region; and a contact region located over the NID region.

LIGHT EMITTING DEVICE, OPTICAL DEVICE, AND MEASUREMENT DEVICE

A light emitting device includes a wiring board having a first wiring layer and a second wiring layer adjacent to the first wiring layer via an insulating layer, a laser having a cathode electrode and an anode electrode, mounted on the wiring board, and driven through low-side driving, and a capacitive element mounted on the wiring board and configured to supply a drive current to the laser. The first wiring layer includes a cathode wire connected to the cathode electrode, and an anode wire connected to the anode electrode. The second wiring layer includes a reference potential wire connected to a reference potential. The reference potential wire overlaps the anode wire. The anode wire surrounds the capacitive element.

LIGHT-EMITTING DEVICE, OPTICAL DEVICE, AND MEASUREMENT DEVICE

A light-emitting device includes a laser unit; and a first capacitive element and a second capacitive element that supply a driving electric current to the laser unit; wherein the first capacitive element has a smaller capacity and smaller equivalent series inductance than the second capacitive element, and a length of a first electric current path along which the driving electric current output from the first capacitive element returns to the first capacitive element is shorter than a length of a second electric current path along which the driving electric current output from the second capacitive element returns to the second capacitive element.

LIGHT-EMITTING DEVICE, OPTICAL DEVICE, AND MEASUREMENT DEVICE
20210265813 · 2021-08-26 · ·

A light-emitting device includes a first base member; a laser unit provided on the first base member; a capacitive element that is provided on the first base member and supplies a driving electric current to the laser unit; a wiring board that is constituted by a second base member having lower thermal conductivity than the first base member and on which the first base member is mounted; and a driving unit that is mounted on the wiring board and drives the laser unit.

SPECIALIZED MOBILE LIGHT DEVICE CONFIGURED WITH A GALLIUM AND NITROGEN CONTAINING LASER SOURCE
20210194206 · 2021-06-24 ·

A portable lighting apparatus is provided with a gallium-and-nitrogen containing laser diode based white light source combined with an infrared illumination source which are driven by drivers disposed in a printed circuit board assembly enclosed in a compact housing and powered by a portable power supply therein. The portable lighting apparatus includes a first wavelength converter configured to output a white-color emission and an infrared emission. A beam shaper may be configured to direct the white-color emission and the infrared emission to a front aperture of a compact housing of the portable lighting apparatus. An optical transmitting unit is configured to project or transmit a directional light beam of the white light emission and/or the infrared emission for illuminating a target of interest, transmitting a pulsed sensing signal or modulated data signal generated by the drivers therein. In some configurations, detectors are included for depth sensing and visible/infrared light communications.