H01S5/405

Laser module
09837782 · 2017-12-05 · ·

A light incidence plane of the core 15 includes a plurality of planes 15a to 15c unparalleled with each other to which a light beam emitted from at least one laser element 21 is entered. When seen on a cross section taken along the longer direction of an optical fiber 10, light beams entered to a core 15 from the inclined planes 15b and 15c inclined to an axis CA of the optical fiber 10 in the plurality of the planes 15a to 15c are propagated from a region surrounded by a line and the inclined planes 15b and 15c forming an acute angle, the line being passed through the incident points of the light beams entered to the inclined planes 15b and 15c and parallel with an axis CA.

THERMAL MANAGEMENT SYSTEM AND OPTICAL BENCH FOR DIODE LASER DEVICE

A thermo-optical ground plane includes a plate configured to mount a diode laser device defining a first surface area, an evaporation chamber in thermal communication with the plate, and a channel defined in thermal communication with the evaporation chamber. The channel is configured to receive and circulate a coolant fluid at a predetermined flowrate. The evaporation chamber is configured to receive a working fluid. The inner walls of the evaporation chamber define a second surface area that is greater than the first surface area of the diode laser device. The plate comprises beam shaping and folding optics for collimating and focusing the light from the diode laser device on an optical fiber. Light from a plurality of thermo-optical ground planes is combined on a single optical fiber. The structure enables cooling with exceptionally low coolant flowrate while also maintaining small specific volume and small specific weight.

STACKABLE ELECTRICALLY-ISOLATED DIODE-LASER BAR ASSEMBLY
20170346255 · 2017-11-30 ·

A diode-laser bar assembly comprises a diode-laser bar mounted onto a cooler by way of an electrically-insulating submount. A laminated connector is provided that includes two electrically-conducting sheets bonded to opposite sides on an electrically-insulating sheet. An electrical insulator is located between the laminated connector and the cooler. One electrically-conducting sheet is connected to n-side of the diode-laser bar and the other electrically-conducting sheet is connected to p-side of the diode-laser bar.

Laser component and method of producing it

A laser component includes a housing in which a first carrier block is arranged. A first laser chip having an emission direction is arranged on a longitudinal side of the first carrier block. The first laser chip electrically conductively connects to a first contact region arranged on the first carrier block and a second contact region arranged on the first carrier block. There is a respective electrically conductive connection between the first contact region and a first contact pin of the housing and between the second contact region and a second contact pin of the housing.

Device for shaping laser radiation
09823479 · 2017-11-21 · ·

Device for shaping laser radiation (10a, 10c), comprising a component (1) having an entrance face (2) and an exit face (3), a first lens array (4) on the entrance face (2) with a plurality of lenses (5a, 5c, 5e) juxtaposed in the X-direction, and a second lens array (6) on the exit face (3) with a plurality of lenses (7a, 7c, 7e) juxtaposed in the Y-direction, wherein the laser radiation (10a, 10c) is deflected by a first one of the lenses (5a, 5c, 5e) of the first lens array (4) with respect to the X- and Y-direction by a different angle than from a second one of the lenses (5a, 5c, 5e) of the first lens array (4), and/or wherein the laser radiation (10a, 10c) is deflected by a first of the lenses (7a, 7c, 7e) of the second lens array (6) with respect to the X- and Y-direction by a different angle than by a second one of the lenses (7a, 7c, 7e) of the second lens array (6).

LIGHT-EMITTING DEVICE

A light-emitting device includes: a substrate comprising a base; a semiconductor laser element disposed on an upper surface of the base; a sealing member located above the base and fixed to the substrate, wherein the sealing member and the substrate define a sealed space in which the semiconductor laser element is located; and a lens member fixed to the sealing member by adhesive, the lens member comprising a lens section through which light emitted from the semiconductor laser element passes. A space between the sealing member and the lens member is open to an area outside the light-emitting device.

LASER MODULE WITH BEAM ROTATOR

A laser module includes a laser submodule, a polarization beam combiner (PBC), a beam rotator, a grating, and an output fiber (e.g., each disposed on an internal surface of a floor of the laser module). The laser submodule is configured to emit an array pattern of beams, which the PBC is configured to combine into a vertical stack pattern of beams, which the beam rotator is configured to rotate into a horizontal stack pattern of beams, which the grating is configured to combine into an overlapped pattern of beams, which the output fiber is configured to emit. The vertical stack pattern of beams, the horizontal stack pattern of beams, and the overlapped pattern of beams are to transmit through the laser module parallel to a single common plane (e.g., that is parallel to the internal surface of the floor of the laser module).

Chirped Bragg grating elements

Apparatus and methods for altering one or more spectral, spatial, or temporal characteristics of a light-emitting device are disclosed. Generally, such apparatus may include a volume Bragg grating (VBG) element that receives input light generated by a light-emitting device, conditions one or more characteristics of the input light, and causes the light-emitting device to generate light having the one or more characteristics of the conditioned light.

OPTICAL FIBER STRUCTURES AND METHODS FOR VARYING LASER BEAM PROFILE

In various embodiments, the beam parameter product and/or numerical aperture of a laser beam is adjusted utilizing a step-clad optical fiber having a central core, a first cladding, an annular core, and a second cladding.

WAVELENGTH BEAM COMBINING LASER SYSTEMS WITH HIGH BEAM QUALITY FACTOR

In various embodiments, optical repositioners and/or angled dispersive elements are utilized to manipulate portions of an input laser beam emitted by a group of laser emitters in order to form a multi-wavelength output beam having a high beam quality factor.