A method and apparatus for increasing the Signal-to-Noise Ratio (SNR) of phononic comb teeth generated by a non-linear resonator. The method comprises generating a drive signal; applying the drive signal to the non-linear resonator with sufficient gain to generate the phononic comb teeth; and filtering the drive signal before applying it to the non-linear resonator to thereby increase the Signal-to-Noise Ratio (SNR) of phononic comb teeth generated by the non-linear resonator. The apparatus may comprise a circuit including a filter disposed between an oscillator generating the drive signal and the non-linear resonator, the filter preferably having a 3 db passband width which is less than a spacing of the phononic comb teeth generated by the non-linear resonator.

Provided is an oscillation apparatus and an oscillation control apparatus including a first control section that generates a first control signal that controls an oscillation frequency of an oscillator, based on a temperature detection result of a temperature detecting section; an encoder that generates a feedback signal; a second control section that generates a second control signal that controls the oscillation frequency of the oscillator, based on the temperature detection result of the temperature detecting section, an external input signal input from outside, and the feedback signal; an oscillation circuit that sets the oscillation frequency of the oscillator, based on the first control signal and the second control signal; and a reference voltage generating section that generates a reference voltage, wherein the encoder generates the feedback signal by comparing the second control signal and the reference voltage.

A vibrator device includes a semiconductor substrate, a base, a vibrating element, and a lid. The semiconductor substrate has a first surface and a second surface which is in a front-back relationship with the first surface. The base includes an integrated circuit disposed on a first surface or a second surface. The vibrating element is electrically coupled to the integrated circuit and is disposed on the first surface side. The lid is joined to the base at a joining portion of the base to accommodate the vibrating element. The integrated circuit includes a passive element, and the passive element is disposed such that at least a part of the passive element overlaps with the joining portion in a plan view from a direction orthogonal to the first surface.

Disclosed is an integrated circuit amplifier for use in a crystal oscillator. The circuit amplifier comprises a transistor; a voltage dependent capacitance circuit; and a node. The voltage dependent capacitance circuit comprises a device with a voltage dependent capacitance and a bias circuit. The node is connected to a terminal of the transistor and the integrated circuit amplifier is configured such that an intrinsic capacitance of the transistor is dependent on the mean voltage at the node. The node is connected to a terminal of the voltage dependent capacitance circuit and the integrated circuit amplifier is configured such that an effective capacitance of the node is dependent on the intrinsic capacitance of the transistor and the voltage dependent capacitance of said device. When in use, the voltage dependent capacitance circuit reduces the amount of change of the effective capacitance of the node when the mean voltage at the node changes.

A circuit device includes an oscillation circuit which is electrically coupled to a first node to electrically be coupled to one end of a resonator and a second node to electrically be coupled to another end of the resonator, and is configured to oscillate the resonator to generate an oscillation signal, and a waveform shaping circuit which is coupled to the first node, to which the oscillation signal is input from the first node, and which is configured to output a clock signal obtained by performing waveform shaping on the oscillation signal, and a duty adjustment circuit configured to supply the first node with a bias voltage which is variably adjusted based on adjustment data to thereby adjust a duty ratio of the clock signal.

A circuit device includes an oscillation circuit configured to oscillate a resonator to thereby generate an oscillation signal, a waveform shaping circuit to which the oscillation signal is input, and which is configured to output a clock signal obtained by performing waveform shaping on the oscillation signal, a first duty adjustment circuit configured to perform a duty adjustment of the clock signal, and an output buffer circuit configured to output a first output clock signal and a second output clock signal to an outside based on the clock signal. The output buffer circuit includes a second duty adjustment circuit configured to perform a duty adjustment of the second output clock signal.

A vibration device includes a base including a semiconductor substrate and through electrodes that pass through the portion between first and second surfaces of the semiconductor substrate, and a vibrator fixed to the first surface via an electrically conductive joining member. The following components are placed at the second surface: an oscillation circuit that is electrically coupled to the vibrator via the through electrodes and generates an oscillation signal by causing the vibrator to oscillate, a temperature sensor circuit, a temperature compensation circuit that performs temperature compensation on the oscillation signal, and an output buffer circuit that outputs a clock signal based on the oscillation signal. Dsx1<Dbx1, a distance between the output buffer circuit and one of the through electrodes is Dbx1, a distance between the temperature sensor circuit and the other through electrode is Dsx1.

A circuit apparatus includes an oscillation circuit that generates an oscillation signal, a first buffer circuit that outputs a first clock signal based on the oscillation signal, a second buffer circuit that outputs a second clock signal based on the first clock signal, a first terminal electrically couplable to a first node via which the first buffer circuit outputs the first clock signal, and a second terminal electrically coupled to a second node via which the second buffer circuit outputs the second clock signal, and the rise period of the first clock signal is shorter than the rise period of the second clock signal.

An integrated circuit may include oscillator circuitry having a resonator formed from fin field-effect transistor (FinFET) devices. The resonator may include drive cells of alternating polarities and sense cells interposed between the drive cells. The resonator may be connected in a feedback loop within the oscillator circuitry. The oscillator circuitry may include an amplifier having an input coupled to the sense cells and an output coupled to the drive cells. The oscillator circuitry may also include a separate inductor and capacitor based oscillator, where the resonator serves as a separate output filter stage for the inductor and capacitor based oscillator.

A circuit device includes: an oscillation circuit configured to oscillate a resonator; a temperature compensation circuit configured to output a temperature compensation voltage for temperature compensating an oscillation frequency of the oscillation circuit, based on a temperature detection result of a temperature sensor; and a frequency control circuit configured to output a frequency control voltage for the oscillation frequency. The oscillation circuit includes a first variable capacitance circuit having a positive capacitance change characteristic with respect to a capacitance control voltage and a second variable capacitance circuit having a negative capacitance change characteristic with respect to the capacitance control voltage. The temperature compensation circuit supplies the temperature compensation voltage as the capacitance control voltage to the first variable capacitance circuit, and the frequency control circuit supplies the frequency control voltage as the capacitance control voltage to the second variable capacitance circuit.