A resonance device is provided for reducing the influence on the resonant frequency of the resonance device of the electric charge borne by an insulating film of a frame. The resonance device includes a resonator including a vibration portion and a frame disposed in at least a part of a vicinity of the vibration portion. The frame includes a holding body and an insulating film, with the holding body holding the vibration portion to vibrate and the insulating film being formed above the holding body. A lower cover is provided having a recess forming at least a part of a space in which the vibration portion vibrates. An inner side surface of the insulating film is disposed at a first distance from an inner surface of a side wall defining the recess.

The present disclosure provides an aerosol sensing method. The aerosol sensing method includes steps of providing an entering process, providing a particle collecting process and providing a measuring process. The entering process is to allow an aerosol to enter a chamber of a thermal-piezoresistive oscillator-based aerosol sensor, and a thermal-piezoresistive resonator is disposed in the chamber. The particle collecting process is to allow particulate matters in the aerosol to land on at least one proof-mass of the thermal-piezoresistive resonator when the thermal-piezoresistive resonator is not driven. The measuring process is to use an electrical signal to drive the thermal-piezoresistive resonator and measure a resonant frequency of the thermal-piezoresistive resonator. The particle collecting process and the measuring process are operated in a repetitive cycle for measuring changes of the resonant frequency of the thermal-piezoresistive resonator to measure the particulate matters of the aerosol.

A microelectromechanical device having a mobile structure including mobile arms formed from a composite material and having a fixed structure including fixed arms capacitively coupled to the mobile arms. The composite material includes core regions of insulating material and a silicon coating.

A mechanical resonator includes a spring-mass system, wherein the spring-mass system comprises a phase-change material. The mechanical resonator typically comprises an electrical circuit portion, coupled to the phase-change material to alter a phase configuration within the phase-change material. Methods of operation are also disclosed.

A resonant member of a MEMS resonator oscillates in a mechanical resonance mode that produces non-uniform regional stresses such that a first level of mechanical stress in a first region of the resonant member is higher than a second level of mechanical stress in a second region of the resonant member. A plurality of openings within a surface of the resonant member are disposed more densely within the first region than the second region and at least partly filled with a compensating material that reduces temperature dependence of the resonant frequency corresponding to the mechanical resonance mode.

A mechanical resonator includes a spring-mass system, wherein the spring-mass system comprises a phase-change material. The mechanical resonator typically comprises an electrical circuit portion, coupled to the phase-change material to alter a phase configuration within the phase-change material. Methods of operation are also disclosed.

A mechanical resonator includes a spring-mass system, wherein the spring-mass system comprises a phase-change material. The mechanical resonator typically comprises an electrical circuit portion, coupled to the phase-change material to alter a phase configuration within the phase-change material. Methods of operation are also disclosed.

A MEMS (microelectromechanical system) resonator assembly (100), comprising a support structure (102), a resonator element (101) suspended to the support structure (102), and an actuator for exciting the resonator element (101) to a resonance mode. The resonator element (101) vibrates at resonance frequency f.sub.0 and comprises at least one bulk acoustic resonator (110a, 110b). The ESR*A*f.sub.0 values of the resonator assembly (100) are in the range from 12 mm.sup.2 MHz to 83 mm.sup.2 MHZ.

A MEMS (microelectromechanical system) resonator assembly (100), comprising a support structure (102), a resonator element (101) suspended to the support structure (102), and an actuator for exciting the resonator element (101) to a resonance mode. The resonator element (101) comprises two bulk acoustic resonators (110a, 110b) and a flexural mode resonator (120). The flexural mode resonator (120) mechanically connects the two bulk acoustic resonators (110a, 110b), and the MEMS resonator assembly (100) is configured to vibrate in a collective resonance mode in which motions of the two bulk acoustic resonators (110a, 110b) are substantially in the same or 180 degrees shifted phase with respect to each other.

An ultra low power thermally-actuated oscillator and driving circuit thereof are provided. The ultra low power thermally-actuated oscillator includes proof masses, thermally-actuated element and a plurality of driving elements. The proof masses is symmetrically disposed and suspended from a substrate by spring structure. The thermally-actuated element is a line structure to effectively reduce the motional impedance and direct current power. Wherein, the thermally-actuated element is connected to the proof masses or the spring structure. The plurality of driving elements are respectively disposed on both sides of the thermally-actuated element to provide a driving current. When the driving current flows through the thermally-actuated element, the thermally-actuated element will be deformed and thus the proof masses will be driven to produce a harmonic oscillation.