A resonator element includes a substrate having a first region performing thickness shear vibration, a second region located in a periphery of the first region and having a smaller thickness than the first region, a fixed end, and a free end opposite to the fixed end in the first region in a plan view. Excitation electrodes are disposed on a front and a rear of the first region and have regions overlapping each other in the plan view. A center of the first region and a center of the regions overlapping each other are located between a center of the substrate and the free end in the plan view. When Cs is a distance between the center of the regions overlapping each other and the center of the substrate in the plan view, a relation of 105 μm<Cs<130 μm is satisfied.

A lid and an insulating bonding layer that seal a piezoelectric vibrator on a substrate are bonded with higher strength. A piezoelectric vibration component includes a substrate having a principal surface on which a piezoelectric vibrator is mounted, an insulating film disposed on the principal surface, a lid having a recess opening toward the principal surface and an edge portion around the recess. Moreover, first and second insulating bonding layers are interposed between the lid and the substrate. The first and second insulating bonding layers are joined together between the edge portion and the insulating film so as to seal the piezoelectric vibrator in a space between the recess and the principal surface.

A vibrator includes a vibration element having an excitation section which is provided with excitation electrodes, and which excites a thickness shear vibration, and a fixation section electrically coupled to at least one of the excitation electrodes, a vibration attenuator disposed on at least one of principal surfaces of the vibration element, and a support substrate having a coupling electrode which is electrically coupled to the fixation section, and which supports the vibration element, wherein the vibration attenuator is disposed at the fixation section side of the excitation electrodes, and at an outer circumferential edge side of the vibration element from the fixation section in a direction perpendicular to a direction in which the excitation electrodes and the fixation section are arranged side by side.

A piezoelectric vibration component that includes a sealed space formed between first and second package members, and a piezoelectric vibrator is bonded to the first package member with first and second conductive adhesive portions. In the piezoelectric vibrator, a first vibration electrode and a first extended electrode are formed on a first surface of a piezoelectric substrate, and a second vibration electrode and a second extended electrode are formed on a second surface of the piezoelectric substrate. At least the second extended electrode provided on the second principal surface has a higher bonding strength with respect to the conductive adhesive than that of the electrodes on the first principal surface. The electrode patterns on the first and second principal surfaces differ from each other so that the first surface and the second surface can be distinguished from each other.

Provided is a piezoelectric device capable of improving measurement precision of a temperature of a piezoelectric element. A piezoelectric device (1) includes a package (2) including a housing member (4) having a thermistor substrate (3) and a frame (7) provided to project from a first main surface (3a) of the thermistor substrate (3) and in which a housing part (6) is formed by the first main surface (3a) and the frame (7) and a lid (9) provided on the frame (7) to cover a space (5) of the housing part (6), and a piezoelectric vibration element (5) provided on the first main surface (3a) of the thermistor substrate (3) in the housing part (6), wherein the thermistor substrate (3) is a multilayer negative temperature coefficient (NTC) thermistor.

A crystal vibrator includes an AT-cut crystal substrate with a vibration portion having a principal surface and a peripheral portion surrounding and thinner than the vibration portion. An excitation electrode is formed on the principal surface and an extension electrode is electrically connected to the excitation electrode. The vibration portion has a first short-edge side lateral surface that abuts the peripheral portion at an acute angle and a tapered lateral surface adjacent to the first short-edge side lateral surface and inclined with respect to the X axis in the XZ′ plane. The tapered lateral surface abuts the peripheral portion at an angle that is greater than the angle defined by the first short-edge side lateral surface. The extension electrode extends from the excitation electrode through the tapered lateral surface to a first short-edge side in a longitudinal direction parallel to the Z′ axis.

In a crystal unit, a substrate is rectangle-shaped. A frame includes a pair of portions located in regions on the sides of a pair of short sides of the substrate on the lower surface of the substrate and forms a concave portion between these pair of portions. An electrode pad is located on the upper surface of the substrate. A connection pad is located on the lower surface of the substrate within the frame. A plurality of external terminals are located on the lower surface of the frame. A crystal element is mounted on the electrode pad. A temperature sensing element is mounted on the connection pad. A ratio S2/S1 of an area S1 of a rectangular region formed by an outer edge of the lower surface of the frame and an area S2 of a smallest rectangular region containing all of the external terminals is 0.75 to 0.91.

A resonator device includes a base and a resonator component disposed on the base. The base includes a semiconductor substrate having a first surface and a second surface that are in a front-to-back relation with each other; an integrated circuit that includes a wiring layer disposed at the second surface side and including a connection pad and includes an insulating layer disposed between the second surface and the wiring layer; a through electrode that penetrates the semiconductor substrate and the insulating layer and is coupled to the connection pad; and an annular metal layer that is disposed so as to penetrate the insulating layer between the second surface and the wiring layer and surrounds the through electrode in a plan view of the semiconductor substrate.

A vibrator device includes a semiconductor substrate, a base, a vibrating element, and a lid. The semiconductor substrate has a first surface and a second surface which is in a front-back relationship with the first surface. The base includes an integrated circuit disposed on a first surface or a second surface. The vibrating element is electrically coupled to the integrated circuit and is disposed on the first surface side. The lid is joined to the base at a joining portion of the base to accommodate the vibrating element. The integrated circuit includes a passive element, and the passive element is disposed such that at least a part of the passive element overlaps with the joining portion in a plan view from a direction orthogonal to the first surface.

An electronic device that includes a base substrate having a mounting surface; an electronic component having a mechanical vibration portion mounted on the mounting surface of the base substrate; an intermediate layer mounted on the base substrate and forming an internal space with the base substrate so as to accommodate the electronic component therein, the intermediate layer having at least one through-hole that opens the internal space to an outside; and a sealing layer on the intermediate layer and sealing the internal space by closing the at least one through-hole.